CN-115623848-B - Preparation process and device for tec semiconductor particle lamination

CN115623848BCN 115623848 BCN115623848 BCN 115623848BCN-115623848-B

Abstract

The invention discloses a preparation process and a device for adhering tec semiconductor particles, wherein the preparation process comprises the steps of obtaining a carrier, dividing the carrier from a master batch to obtain the carrier, carrying out carrier pretreatment, moving the carrier to a coating device, coating solder paste on the left side and the right side of the carrier, installing P particles, moving the carrier to a P particle installation table, installing the P particles on one side of the carrier coated with the solder paste, taking the other side of the carrier, which is not provided with the P particles, as a blank side, installing N particles, moving the carrier to an N particle installation table, installing the N particles on the blank side of the carrier coated with the solder paste, obtaining a semiconductor refrigeration sheet, and discharging the semiconductor refrigeration sheet to a discharge port to finish discharging. The invention adopts the method that the carrier is simultaneously provided with the P particles and the N particles on one machine to form the semiconductor refrigerating sheet, thereby reducing the resource loss, saving the manpower and improving the working efficiency.

Inventors

LI JINGTING
LI WANXI
ZHANG RIHUA
YIN YONGJUN
LIU SUFEN
XIA WEIQIANG
ZHONG JINXIN

Assignees

深圳市华科芯微半导体技术有限公司

Dates

Publication Date: 20260508
Application Date: 20220923

Claims (10)

1. A device (10) for attaching tec semiconductor particles to a semiconductor cooling sheet, comprising: a device main body (100); a coating device (200), wherein the coating device (200) is arranged on the device main body (100), and the coating device (200) is used for coating solder paste; a P particle mounting table (300), wherein the P particle mounting table (300) is connected with the device main body (100), and the P particle mounting table (300) is used for mounting P particles; An N-particle mounting table (400), wherein the N-particle mounting table (400) is connected to the device main body (100), and the N-particle mounting table (400) is used for mounting N-particles; A moving platform (500), wherein the moving platform (500) is disposed on the device main body (100), the moving platform (500) includes a first platform (510) and a second platform (520), the first platform (510) and the second platform (520) are movably connected with the device main body (100), and the first platform (510) and the second platform (520) are used for transferring the semiconductor refrigeration sheet; the apparatus is further configured to perform a preparation process for tec semiconductor particle bonding, the preparation process comprising the steps of: Obtaining a carrier, and dividing the carrier from the master batch to obtain the carrier; The carrier pretreatment, the carrier is moved to a coating device (200), and solder paste is coated on the left side and the right side of the carrier; Mounting the P particles, moving the carrier to a P particle mounting table (300), mounting the P particles on one side of the carrier coated with the solder paste, and regarding the other side without the P particles as a blank side; Mounting N particles, moving the carrier to an N particle mounting table (400), and mounting the N particles on the blank side of the carrier coated with the solder paste to obtain a semiconductor refrigeration sheet; and (3) discharging, namely moving the semiconductor refrigerating sheet to a discharging hole to finish discharging.
2. The preparation process for the lamination of tec semiconductor particles is characterized by comprising the following steps of: Obtaining a carrier, and dividing the carrier from the master batch to obtain the carrier; The carrier pretreatment, the carrier is moved to a coating device (200), and solder paste is coated on the left side and the right side of the carrier; Mounting the P particles, moving the carrier to a P particle mounting table (300), mounting the P particles on one side of the carrier coated with the solder paste, and regarding the other side without the P particles as a blank side; Mounting N particles, moving the carrier to an N particle mounting table (400), and mounting the N particles on the blank side of the carrier coated with the solder paste to obtain a semiconductor refrigeration sheet; and (3) discharging, namely moving the semiconductor refrigerating sheet to a discharging hole to finish discharging.
3. The process for the preparation of a coated semiconductor particle according to claim 2, wherein the step of obtaining a carrier comprises: Dividing the master batch, and cutting the master batch into a plurality of carriers; grabbing the carrier, identifying the identification sites on the master batch through the identification component, and grabbing the carrier through preset coordinates by a manipulator; stacking the carriers, placing the carriers on a transfer tray provided with a plurality of grooves corresponding to the shapes and the sizes of the carriers, and placing a plurality of carriers in the grooves of the transfer tray; The transfer carrier moves the transfer tray to the coating device (200) by the first stage (510).
4. A process for the preparation of a tec semiconductor particle bonding as claimed in claim 3, wherein said step of transferring the carrier comprises: When the identification is successful, then moving the transfer tray to the coating device (200) through the first platform (510); When the identification is unsuccessful, the first platform (510) is adjusted to drive the transfer tray to adjust so that the identification site on the transfer tray can be identified by the identification component, and then the transfer tray is moved to the coating device (200) by the first platform (510).
5. The process for the preparation of a coated semiconductor particle according to claim 2, wherein the step of obtaining a carrier comprises: cutting the master batch, namely cutting the master batch into a plurality of carriers, and separating the carriers one by one; Recognizing the carriers, namely placing the carriers on the recognition areas one by one through a mechanical arm, and recognizing the carriers through a recognition component; Correcting the carriers, analyzing the carriers identified by the identification component one by one, if the carriers deflect, adjusting the deflected carriers, and if the carriers do not deflect, directly performing the next step; And transferring the carriers one by one to a carrier tray by a mechanical arm and driving the transfer tray to move to the coating device (200) by a first platform (510).
6. The process for the preparation of tec semiconductor particle bonding according to claim 2, wherein the step of pretreatment of the carrier comprises: stacking the carriers, transferring the carriers from the transfer tray to the coating device (200), and moving the coating device (200) to the corresponding coating device (200); coating solder paste, namely coating the solder paste on two ends of the same side of a carrier through a mechanical scraping disc of a coating device (200) to form a blank carrier; And transferring the blank carrier, transferring the blank carrier onto a first platform (510), and moving the first platform (510) to a corresponding P particle mounting table (300).
7. The process for the preparation of tec semiconductor particle bonding according to claim 2, wherein said step of mounting P particles comprises: Receiving blank carriers, and transferring the blank carriers on a first platform (510) to a P particle installation table (300) through a mechanical arm; P particles are installed, the P particles are grabbed by a mechanical arm, the P particles are installed on a blank carrier, and the blank carrier after the P particles are installed becomes a half blank carrier; and transferring the semi-empty carrier, and transferring the semi-empty carrier to an N-particle mounting table (400) through a first platform (510).
8. The process for the preparation of tec semiconductor particle bonding according to claim 7, wherein said step of mounting N particles comprises: Receiving a half-blank carrier, and transferring the half-blank carrier on a first platform (510) to an N-particle mounting table (400) through a mechanical arm; N particles are installed, the N particles are grabbed by a mechanical arm, the N particles are installed on a blank carrier, and the blank carrier after the N particles are installed becomes a semiconductor refrigerating sheet; And transferring the semiconductor refrigerating sheet to a discharging conveyor belt.
9. The process for the preparation of tec semiconductor particle bonding according to claim 8, wherein said step of receiving semi-blank carriers comprises: Grabbing a semi-blank carrier, and sucking the semi-blank carrier from a first platform (510) through a vacuum suction claw; Transferring to a second platform (520), adsorbing the semi-empty white carrier by a vacuum suction claw, at the moment, moving the second platform (520) to the position below the vacuum suction claw, returning the first platform (510) to the coating device (200), loosening the vacuum suction claw, and placing the semi-empty white carrier on the second platform (520).
10. The process for the preparation of tec semiconductor particle bonding according to claim 2, wherein the step of discharging comprises: Receiving a semiconductor refrigerating sheet, lifting the semiconductor refrigerating sheet to a position flush with a discharge conveyor belt, and placing the semiconductor refrigerating sheet on the discharge conveyor belt through a manipulator; And the discharging conveyor belt transfers the semiconductor refrigerating sheet to a subsequent packaging link to finish discharging.

Description

Preparation process and device for tec semiconductor particle lamination Technical Field The invention relates to the field of semiconductor refrigeration, in particular to a preparation process and a device for tec semiconductor particle lamination. Background The semiconductor refrigerator (Thermo Electric Cooler) is fabricated using the peltier effect of semiconductor materials. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Heavily doped N-type and P-type bismuth telluride is mainly used as semiconductor materials of TEC, and bismuth telluride elements are electrically connected in series and generate heat in parallel. The TEC comprises a plurality of P-type particles and N-type particles which are connected together through electrodes and are clamped between two ceramic electrodes, when current flows through the TEC, heat generated by the current can be transferred from one side of the TEC to the other side, and a hot side and a cold side are generated on the TEC, so that refrigeration is realized. The current semiconductor refrigeration piece highly relies on the manpower when the preparation, needs to use the manual carrier that will cut to finish earlier and shifts to independent coating device, and the manual work shifts to the device of installation N particle again after the brush is glued, accomplishes the device of installation P particle again after the installation N particle, therefore the semiconductor refrigeration piece need consume a large amount of manpowers when producing, work efficiency is low, manufacturing cost is high. Therefore, there is a need for a process and apparatus for tec semiconductor particle lamination that can save labor and improve work efficiency. Disclosure of Invention The invention mainly aims to provide a preparation process and a device for tec semiconductor particle lamination, which aim to save labor and improve working efficiency. In order to achieve the above object, the present invention provides an apparatus for attaching semiconductor particles to a semiconductor refrigeration sheet, comprising: a device body; the coating device is arranged on the device main body and is used for coating solder paste; a P particle mounting table connected to the apparatus main body, the P particle mounting table being configured to mount P particles; the N particle installation platform is connected with the device main body and is used for installing N particles; The mobile platform is arranged on the device main body and comprises a first platform and a second platform, the first platform and the second platform are connected with the device main body in a movable mode, and the first platform and the second platform are used for transferring the semiconductor refrigerating sheet. In order to achieve the above object, the present invention also provides a process for preparing tec semiconductor particle bonding, which comprises: Obtaining a carrier, and dividing the carrier from the master batch to obtain the carrier; The carrier pretreatment, moving the carrier to a coating device, and coating solder paste on the left side and the right side of the carrier; mounting P particles, moving the carrier to a P particle mounting table, mounting the P particles on one side of the carrier coated with solder paste, and taking the other side without the P particles as a blank side; Mounting N particles, moving the carrier to an N particle mounting table, and mounting the N particles on the blank side of the carrier coated with the solder paste to obtain a semiconductor refrigeration sheet; and (3) discharging, namely moving the semiconductor refrigerating sheet to a discharging hole to finish discharging. Preferably, the step of obtaining a carrier comprises: Dividing the master batch, and cutting the master batch into a plurality of carriers; grabbing the carrier, identifying the identification sites on the master batch through the identification component, and grabbing the carrier through preset coordinates by a manipulator; stacking the carriers, placing the carriers on a transfer tray provided with a plurality of grooves corresponding to the shapes and the sizes of the carriers, and placing a plurality of carriers in the grooves of the transfer tray; and a transfer carrier, which moves the transfer tray to the coating device through the first stage. Preferably, the step of transferring the carrier comprises: When the identification is successful, the transfer tray is moved to the coating device through the first platform; when the identification is unsuccessful, the first platform is adjusted to drive the transfer tray to be adjusted, so that the identification sites on the transfer tray can be identified by the identification component, and then the transfer tray is moved to the coating device through the first platform. Preferably, the st