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CN-115625892-B - Forming platform of 3D printing equipment and preparation method thereof

CN115625892BCN 115625892 BCN115625892 BCN 115625892BCN-115625892-B

Abstract

The invention discloses a forming platform of 3D printing equipment and a preparation method thereof, and relates to the technical field of 3D printing. The plastic material after modification treatment is adopted to prepare the molding platform, and the plastic material is optimized, so that the bonding force between the molding surface and the printing layer molded after the photo-curing material is exposed and cured can be remarkably improved, the plate falling is further reduced, and the printing success rate is improved.

Inventors

  • QU YANG
  • GUO YU
  • Su Xiangru
  • ZENG WEIBIN

Assignees

  • 广州黑格智造信息科技有限公司

Dates

Publication Date
20260512
Application Date
20221020

Claims (20)

  1. 1. A molding platform of a 3D printing apparatus, characterized in that the molding platform has a molding surface for adhering a 3D printed matter molded by exposure and curing of a photo-curing material, wherein the molding platform is made of a plastic material after modification treatment, and an adhesion force between the molding surface and a printed layer molded by exposure and curing of the photo-curing material satisfies 1.5N per square centimeter; The molding platform is made of modified ABS materials, wherein the raw materials of the modified ABS materials comprise 70-80 wt% of ABS resin, 5-20% of methacrylic resin wt% of reinforcing fiber 5-10% of reinforcing fiber wt% and 1-5% of coupling agent wt%, and the molding platform is obtained by modifying and molding the raw materials.
  2. 2. The molding platform of claim 1, wherein an adhesion force between the molding surface and the printed layer molded after the photo-curable material is exposed to light and cured is not less than 3N per square centimeter.
  3. 3. The modeling platform of claim 1, wherein the plastic material is selected from at least one of ABS, PC, PP, POM, PA, PS, PBT, AS, PET, PVC, PEEK, PPSU, SAN, PE, TPE, PTFE, PES and PVA.
  4. 4. The forming table of claim 1, wherein the modification treatment comprises at least one of a grafting modification, a blending modification, an inorganic reinforcement modification, a morphology control modification, and a crosslinking modification.
  5. 5. The modeling platform of claim 1, wherein the reinforcing fiber is selected from at least one of glass fiber, ceramic fiber, silica fiber, and boron fiber.
  6. 6. The forming table of claim 1, wherein the coupling agent is selected from at least one of silane-based monomers, styrenic monomers, and titanate-based monomers; wherein the silane monomer is at least one selected from vinyl trimethoxy silane, vinyl triethoxy silane, 3-methacryloxypropyl trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma- (methacryloxy) propyl trimethoxy silane.
  7. 7. The molding platform of claim 1, wherein the methacrylic resin is selected from at least one of methyl methacrylate, polymethyl methacrylate, polyurethane methacrylate, and n-butyl methacrylate.
  8. 8. The forming table according to any one of claims 1 to 7, wherein the forming surface is obtained by a surface treatment comprising at least one of spraying, sandblasting, sanding, engraving, plating, coating, printing, embossing, polishing, painting, oiling, ion plating and laser treatment.
  9. 9. A method for manufacturing a molding platform of a 3D printing apparatus, comprising: Providing raw materials of a forming platform, wherein the raw materials comprise 70-80 wt% of ABS resin, 5-20% of methacrylic resin wt%, 5-10% of reinforcing fiber wt% and 1-5% of coupling agent wt%; and carrying out modification treatment on the raw materials and molding to obtain a molding platform made of plastic materials, wherein the molding platform is provided with a molding surface, the molding surface is used for adhering a 3D printed piece molded by light-cured materials after exposure and curing, and the bonding force between the molding surface and a printed layer molded by light-cured materials after exposure and curing is not less than 1.5N per square centimeter.
  10. 10. The method according to claim 9, wherein an adhesion force between the molding surface and the printed layer molded after the photo-curing material is exposed to light is not less than 3N per square centimeter.
  11. 11. The method of producing according to claim 9, wherein the modification treatment includes at least one of graft modification, blend modification, inorganic reinforcement modification, morphology control modification, and crosslinking modification.
  12. 12. The method according to claim 9, wherein the raw materials include 73-78 wt% of ABS resin, 10-15-wt% of methacrylic resin, 6-9-wt% of reinforcing fiber and 2-4-wt% of coupling agent.
  13. 13. The method of manufacturing according to claim 9, wherein the reinforcing fiber is at least one selected from the group consisting of glass fiber, ceramic fiber, silica fiber and boron fiber.
  14. 14. The method according to claim 9, wherein the coupling agent is at least one selected from the group consisting of silane-based monomers, styrene-based monomers, and titanate-based monomers; Wherein the coupling agent is at least one selected from vinyl trimethoxy silane, vinyl triethoxy silane, 3-methacryloxypropyl trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma- (methacryloxy) propyl trimethoxy silane.
  15. 15. The method according to claim 9, wherein the methacrylic resin is at least one selected from the group consisting of methyl methacrylate, polymethyl methacrylate, polyurethane methacrylate, and n-butyl methacrylate.
  16. 16. The method according to any one of claims 9 to 15, further comprising subjecting the molding surface to a surface treatment including at least one of spraying, blasting, sanding, engraving, plating, printing, embossing, polishing, painting, oiling, ion plating, and laser treatment.
  17. 17. The method according to any one of claims 9 to 15, further comprising blasting the molding surface to control the roughness Ra of the molding surface of the molding land to 0.1 μm to 5 μm.
  18. 18. The method according to claim 17, wherein the abrasive used for blasting is a hard abrasive with corners, and the abrasive is at least one selected from the group consisting of white corundum, brown corundum, glass sand and steel sand.
  19. 19. The method according to any one of claims 9 to 15, further comprising spraying the molding surface with a raw material comprising, by mass, 100 parts of a photocurable resin, 80-150 parts of a diluent, and 0.05-2 parts of an initiator; Wherein the light-cured resin is selected from at least one of acrylic esters, allyl ethers and vinyl ethers, and the number average molecular weight of the light-cured resin is 4000-10W.
  20. 20. The method of producing according to claim 19, wherein the photocurable resin comprises 50-90 parts of a first resin having a number average molecular weight of 4000-20000 and 10-50 parts of a second resin having a number average molecular weight of 4W-10W; the first resin is selected from at least one of RA3080, RA3081, RA3083, RA3091, 6071, 6175-3 and SD 7508; The second resin is selected from at least one of SD1000 and SWA 20.

Description

Forming platform of 3D printing equipment and preparation method thereof Technical Field The invention relates to the technical field of 3D printing, in particular to a forming platform of 3D printing equipment and a preparation method thereof. Background The 3D printing equipment has higher requirement on the bonding force between the forming platform of the 3D printing equipment and the 3D printing piece when in printing, and if the initial printing piece is not firmly bonded with the forming platform, the board is easy to drop in the follow-up printing, so that the printing is failed. Many molding platforms adopt injection molding platforms, and have the following problems in the printing process that the molding surface of the injection molding platform has poor adhesion with a printing piece, and the board is easy to drop in printing, such as ABS, PP, PC, PVA and the like, and the board dropping problem can not be well overcome. Aiming at the problem of board falling, the following improvement scheme is provided: (1) The ABS molding platform can be coated with the coating on the molding surface of the ABS molding platform, but the traditional coating is not easy to dry, so that the transportation and the like are inconvenient, and the board is still easy to fall off in the UV curing process. (2) The molding surface of the ABS molding platform is treated by chemical oxidation, and the most common method is to use chromic anhydride-sulfuric acid roughening solution to carry out oxidation etching on the surface of the molding surface of the ABS molding platform. The coarsening liquid has higher cost, serious pollution and high energy consumption, and the coarsening liquid is not good in improvement effect on an ABS forming platform, is easy to fall off the plate in the UV curing process, and has larger limitation in use. In view of this, the present invention has been made. Disclosure of Invention The invention aims to provide a forming platform of 3D printing equipment, which is prepared from the modified ABS material and can remarkably increase the adhesive force of the forming platform. The second purpose of the invention is to provide a preparation method of the forming platform of the 3D printing equipment, which aims to improve the bonding force of the forming surfaces of the printing piece and the forming platform, further reduce the plate dropping and improve the printing success rate. The invention is realized in the following way: In a first aspect, the present invention provides a molding platform of a 3D printing apparatus, where the molding platform has a molding surface for adhering a 3D printed part molded by exposure and curing of a photo-curing material, and the molding platform is made of a plastic material after modification treatment, and an adhesion force between the molding surface and a printed layer molded by exposure and curing of the photo-curing material satisfies not less than 1.5N per square centimeter. In an alternative embodiment, the adhesion between the molding surface and the printed layer molded after the photo-curable material is exposed to light and cured is not less than 3N per square centimeter. In an alternative embodiment, the plastic material is selected from at least one of ABS, PC, PP, POM, PA, PS, PBT, AS, PET, PVC, PEEK, PPSU, SAN, PE, TPE, PTFE, PES and PVA. In alternative embodiments, the modification treatment comprises at least one of grafting modification, blending modification, inorganic reinforcement modification, morphology control modification, and crosslinking modification. In an alternative embodiment, the molding platform is made of a modified ABS material, wherein the modified ABS material comprises 70-80wt% of ABS resin, 5-20wt% of methacrylic resin, 5-10wt% of reinforcing fiber and 1-5wt% of coupling agent. In an alternative embodiment, the raw materials of the modified ABS material include 73-78wt% of ABS resin, 10-15wt% of PMMA resin, 6-9wt% of reinforcing fiber and 2-4wt% of coupling agent. In an alternative embodiment, the reinforcing fibers are selected from at least one of glass fibers, ceramic fibers, silica fibers, and boron fibers. In an alternative embodiment, the coupling agent is selected from at least one of silane-based monomers, styrenic monomers, and titanate-based monomers; Wherein the silane monomer is at least one selected from vinyl trimethoxy silane, vinyl triethoxy silane, 3-methacryloxypropyl trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma- (methacryloxy) propyl trimethoxy silane. In an alternative embodiment, the methacrylic resin is selected from at least one of methyl methacrylate, polymethyl methacrylate (PMMA), polyurethane methacrylate, and n-butyl methacrylate. In an alternative embodiment, the molding surface is obtained by a surface treatment comprising at least one of spraying, sandblasting, sanding, engraving, electroplating, coating, printing, embossing, polishing, painting, oiling, ion plating