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CN-115643716-B - Electronic device and control method of electronic device

CN115643716BCN 115643716 BCN115643716 BCN 115643716BCN-115643716-B

Abstract

The disclosure provides electronic equipment and a control method of the electronic equipment, wherein the electronic equipment comprises a middle frame, a heat source arranged on the middle frame, a shell provided with a heat dissipation area and a non-heat dissipation area, wherein the heat source is positioned between the heat dissipation area and the middle frame, the heat dissipation coefficient of the heat dissipation area is higher than that of the non-heat dissipation area, and a processing module is used for adjusting the heat dissipation power of the heat dissipation area according to the temperature of the non-wearing position of the shell and the detected temperature of the wearing position of the shell. The technical scheme of the embodiment of the disclosure improves the heat dissipation effect on the heat source.

Inventors

  • YANG RUIFU

Assignees

  • 北京小米移动软件有限公司

Dates

Publication Date
20260508
Application Date
20210720

Claims (14)

  1. 1. An electronic device, the electronic device comprising: A middle frame; A heat source mounted on the center; The shell is provided with a heat dissipation area and a non-heat dissipation area, wherein the heat source is positioned between the heat dissipation area and the middle frame; And the processing module is used for adjusting the heat dissipation power of the heat dissipation area according to the temperature of the non-wearing position of the shell and the temperature detected by the wearing position of the shell.
  2. 2. The electronic device of claim 1, wherein the heat dissipation area comprises: a first insulating thermally conductive wall facing the heat source; The second insulating heat conducting wall is distributed with the first insulating heat conducting wall in a lamination manner; The electric control heat conduction layer is positioned between the first insulating heat conduction wall and the second insulating heat conduction wall and is used for conducting heat conduction between the first insulating heat conduction wall and the second insulating heat conduction wall when electric signals exist, and the electric control heat conduction layer stops conducting heat conduction between the first insulating heat conduction wall and the second insulating heat conduction wall when no electric signals exist.
  3. 3. The electronic device of claim 2, wherein the electronically controlled thermally conductive layer comprises: a thermocouple pair including a first semiconductor and a second semiconductor alternately distributed; The conductive sheet is used for electrically connecting the first semiconductor and the second semiconductor which are adjacently distributed, and comprises a first conductive sheet and a second conductive sheet, wherein the first conductive sheet is positioned between the first insulating heat conducting wall and a first end of the thermocouple pair, the second conductive sheet is positioned between the second insulating heat conducting wall and a second end of the thermocouple pair, and the second end is the opposite end of the first end; and when current flows through the conductive sheet and the thermocouple pair, heat of the first insulating heat conducting wall is transferred to the second insulating heat conducting wall.
  4. 4. The electronic device of claim 2, wherein the electrical signal comprises a pulse modulated signal; and the parameters of the pulse modulation signals are used for adjusting the heat dissipation power, wherein the parameters comprise frequency and/or duty ratio.
  5. 5. The electronic device of claim 2, wherein the first insulating heat conducting wall is of unitary construction with an inner wall of the non-heat dissipating region and/or the second insulating heat conducting wall is of unitary construction with an outer wall of the non-heat dissipating region.
  6. 6. The electronic device of claim 2, wherein the first insulating heat conducting wall is the same material as the non-heat dissipating region and/or the second insulating heat conducting wall is the same material as the non-heat dissipating region.
  7. 7. The electronic device of claim 1, wherein the heat dissipation area is located at or above a center position of the non-heat dissipation area.
  8. 8. The electronic device of claim 4, wherein the electronic device further comprises: the transmitting coil is positioned on the middle frame, is electrically connected with the processing module and is used for transmitting the pulse modulation signal; and the receiving coil is positioned on the shell, is electrically connected with the heat dissipation area and transmits the pulse modulation signal to the heat dissipation area.
  9. 9. The electronic device of claim 8, wherein the electronic device further comprises: the field effect tube is electrically connected with the transmitting coil; The pulse generator is electrically connected with the processing module and is used for generating the pulse modulation signal for controlling the on or off of the field effect transistor; The processing module is used for adjusting the power of the heat dissipation area by adjusting the frequency and/or the duty ratio of the pulse modulation signal.
  10. 10. A control method of an electronic device, characterized by being applied to the electronic device according to any one of claims 1 to 9, the method comprising: Acquiring the temperature of the electronic equipment at a non-wearing position of a shell and the temperature of the electronic equipment at the wearing position of the shell; and adjusting the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position and the temperature at the wearing position.
  11. 11. The method according to claim 10, wherein adjusting the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position and the temperature at the wearing position includes: If the difference between the temperature at the non-wearing position and the temperature at the wearing position reaches a preset threshold, adjusting the heat dissipation power of the heat dissipation area to be larger than or equal to a preset power, and/or, And if the difference value does not reach the preset threshold value, adjusting the heat dissipation power of the heat dissipation area to be smaller than the preset power.
  12. 12. The method of claim 10, wherein adjusting the heat dissipation power of the heat dissipation area comprises: The power of the heat dissipation area is adjusted by adjusting the frequency and/or the duty ratio of a pulse modulation signal generated by a pulse generator, wherein the pulse modulation signal is used for controlling a field effect transistor to be conducted or disconnected, and the field effect transistor is electrically connected with a transmitting coil of the electronic equipment.
  13. 13. The method of controlling an electronic device according to claim 10, wherein the acquiring the temperature at the housing wearing position includes: Establishing communication connection between the electronic device and the wearable device; acquiring the temperature at the wearing position through the wearable device.
  14. 14. The method of claim 13, wherein the wearable device comprises a wristband, a wristwatch, or a finger ring.

Description

Electronic device and control method of electronic device Technical Field The present disclosure relates to heat dissipation technology, and in particular, to an electronic device and a control method of the electronic device. Background Taking a mobile phone as an example, the power consumption of a 5G (fifth generation mobile communication technology, 5th Generation Mobile Communication Technology) mobile phone is greatly increased compared with that of a 4G (fourth generation mobile communication technology, the 4th generation mobile communication technology) mobile phone, and the mobile phone is heated more seriously, so that the experience of using the mobile phone is reduced if the mobile phone is heated more seriously while the performance experience of the mobile phone is better and better. At present, the main method for radiating the mobile phone is to radiate the heat through graphite sheets, copper tubes, VC (Vapor Chamber) liquid state, metal middle frames and the like of the mobile phone, and the radiating modes cannot meet the requirements, in some scenes, the heating phenomenon of the mobile phone is more serious, and the temperature of the rear shell, middle frames and other parts of the mobile phone is greatly increased when the mobile phone is touched by hands, so that the mobile phone feels hot when touched by hands, and the use experience is poor. Disclosure of Invention The present disclosure provides an electronic device and a control method of the electronic device. According to an embodiment of the first aspect of the present disclosure, there is provided an electronic device including: A middle frame; A heat source mounted on the center; The shell is provided with a heat dissipation area and a non-heat dissipation area, wherein the heat source is positioned between the heat dissipation area and the middle frame; And the processing module is used for adjusting the heat dissipation power of the heat dissipation area according to the temperature of the non-wearing position of the shell and the temperature detected by the wearing position of the shell. In some embodiments, the heat dissipation area comprises: a first insulating thermally conductive wall facing the heat source; The second insulating heat conducting wall is distributed with the first insulating heat conducting wall in a lamination manner; The electric control heat conduction layer is positioned between the first insulating heat conduction wall and the second insulating heat conduction wall and is used for conducting heat conduction between the first insulating heat conduction wall and the second insulating heat conduction wall when electric signals exist, and the electric control heat conduction layer stops conducting heat conduction between the first insulating heat conduction wall and the second insulating heat conduction wall when no electric signals exist. In some embodiments, the electronically controlled thermally conductive layer comprises: the thermocouple pair comprises first semiconductors and second semiconductors which are alternately distributed and are positioned between the first insulating heat conducting wall and the second insulating heat conducting wall; The conductive sheet is used for electrically connecting the first semiconductor and the second semiconductor which are adjacently distributed, and comprises a first conductive sheet and a second conductive sheet, wherein the first conductive sheet is positioned between the first insulating heat conducting wall and a first end of the thermocouple pair, the second conductive sheet is positioned between the second insulating heat conducting wall and a second end of the thermocouple pair, and the second end is the opposite end of the first end; The conductive sheet is electrically connected with the first semiconductor and the second semiconductor which are adjacently distributed; and when current flows through the conductive sheet and the thermocouple pair, heat of the first insulating heat conducting wall is transferred to the second insulating heat conducting wall. In some embodiments, the electrical signal comprises a pulse modulated signal; and the parameters of the pulse modulation signals are used for adjusting the heat dissipation power, wherein the parameters comprise frequency and/or duty ratio. In some embodiments, the first insulating heat conducting wall is of unitary construction with the inner wall of the non-heat dissipating region and/or the second insulating heat conducting wall is of unitary construction with the outer wall of the non-heat dissipating region. In some embodiments, the first insulating heat conducting wall is made of the same material as the non-heat dissipating region, and/or the second insulating heat conducting wall is made of the same material as the non-heat dissipating region. In some embodiments, the heat dissipating region is located at or above a central location of the non-heat dissipating region. In some embodi