CN-115663098-B - LED light-emitting device and manufacturing method thereof

CN115663098BCN 115663098 BCN115663098 BCN 115663098BCN-115663098-B

Abstract

The invention is applicable to the technical field of LED packaging, and provides an LED light-emitting device and a manufacturing method thereof. The LED light-emitting device comprises a support, an LED chip and an encapsulation adhesive layer, wherein the support comprises a substrate and a surrounding dam, the substrate is provided with a front face and a back face which are opposite, the surrounding dam is provided with a bottom face and a top face which are opposite, the bottom faces of the LED chip and the surrounding dam are arranged on the front face of the substrate, the surrounding dam surrounds the LED chip to form a chip mounting area for mounting the LED chip and bearing the encapsulation adhesive layer, the encapsulation adhesive layer is encapsulated above the LED chip, the surrounding dam and the encapsulation adhesive layer are transparent or semitransparent, and the top of the encapsulation adhesive layer is provided with transparent or semitransparent hollow particles. The LED light-emitting device and the manufacturing method thereof provided by the invention have the advantages of high product brightness and good user experience.

Inventors

WANG DONGDONG
YANG LIMIN
SUN PINGRU
WANG CHUANHU
Tan Panfeng
LI CHUNLIANG
HUANG HUI
WU PIANPIAN

Assignees

芜湖聚飞光电科技有限公司

Dates

Publication Date: 20260512
Application Date: 20221104

Claims (10)

1. The LED light-emitting device is characterized by comprising a support, an LED chip and an encapsulation adhesive layer, wherein the support comprises a substrate and a surrounding dam, the substrate is provided with a front face and a back face which are opposite, the surrounding dam is provided with a bottom face and a top face which are opposite, the bottom face of the LED chip and the bottom face of the surrounding dam are arranged on the front face of the substrate, the surrounding dam surrounds the LED chip to form a chip mounting area for mounting the LED chip and bearing the encapsulation adhesive layer, the encapsulation adhesive layer is encapsulated above the LED chip, the surrounding dam and the encapsulation adhesive layer are transparent or semitransparent, transparent or semitransparent hollow particles are arranged at the top of the encapsulation adhesive layer, the height of the surrounding dam is the distance from the front face of the substrate to the top face of the surrounding dam, the height of the encapsulation adhesive layer is the distance from the top face of the surrounding dam to the top end of the encapsulation adhesive layer, the height of the encapsulation adhesive layer is larger than the height of the mounting area of the LED chip, the encapsulation adhesive layer is not covered by the hollow particles, the fluorescent particles are not covered by the encapsulation adhesive layer, and the fluorescent particles are not covered by the fluorescent particles, and the fluorescent particles are at least arranged in the encapsulation adhesive layer, and the fluorescent particles can be observed from the inside the encapsulation adhesive layer.
2. The LED lighting device of claim 1, wherein the outer surface of the encapsulation adhesive layer is curved and has a shape with a lower size and a higher size, the top of the encapsulation adhesive layer is positioned right above the chip mounting area, and the hollow particles cover the right above the LED lighting device.
3. An LED lighting device as recited in claim 1, wherein at least a portion of said encapsulation layer is uncovered by hollow particles, said hollow particles being at least directly over said LED chip.
4. An LED lighting device as recited in claim 2, wherein the projected area of the hollow particle footprint onto the bottom surface of said encapsulant layer is between 20% and 80% of the bottom surface area of said encapsulant layer.
5. The LED light-emitting device according to claim 1, wherein the encapsulation adhesive layer comprises a first encapsulation adhesive layer and a second encapsulation adhesive layer, wherein the bottom of the first encapsulation adhesive layer is encapsulated on the front surface of the substrate, the bottom of the second encapsulation adhesive layer is encapsulated on the top of the first encapsulation adhesive layer, fluorescent powder is arranged in the first encapsulation adhesive layer, most of the fluorescent powder is located on the bottom of the first encapsulation adhesive layer, and the top surface of the first encapsulation adhesive layer is lower than the top surface of the dam portion.
6. An LED lighting device as recited in claim 5, wherein said second encapsulant layer comprises 1% -5% of said hollow particles by mass.
7. An LED lighting device as recited in claim 6, wherein said hollow particles have a median particle diameter of from 15 μm to 100 μm.
8. The LED lighting device of any one of claims 1 to 7, wherein the top surface of the dam portion is inclined toward the inside of the dam portion.
9. A method of manufacturing an LED lighting device according to any one of claims 1 to 8, comprising the steps of: Preparing a bracket and arranging an encapsulation adhesive layer with hollow particles on the bracket, wherein the thickness of the surface of the encapsulation adhesive layer, which is not covered by the hollow particles, is at least larger than the height of the dam part, fluorescent powder is arranged in the encapsulation adhesive layer, and the fluorescent powder can be observed when the part, which is not covered by the hollow particles, of the outer side of the encapsulation adhesive layer is observed inwards; the height of the packaging adhesive layer protruding out of the support is larger than that of the support.
10. A method of manufacturing an LED lighting device as recited in claim 9, wherein, The step of setting the packaging adhesive layer comprises the following steps: After a first packaging colloid containing fluorescent powder is arranged in the surrounding dam part, settling the fluorescent powder through a centrifugal process, and solidifying or semi-solidifying the first packaging colloid through a quick baking process; And a second packaging colloid mixed with hollow particles is arranged above the first packaging colloid, and the hollow particles are converged at the top of the second packaging colloid through baking to form a hollow particle converging area.

Description

LED light-emitting device and manufacturing method thereof Technical Field The invention belongs to the technical field of LED packaging, and particularly relates to an LED light-emitting device and a manufacturing method thereof. Background With the development of the liquid crystal display technology in recent years, the development trend of large screen is presented, along with the demand pulling of high dynamic HDR and 'home economy', the Mini LED display technology is gradually permeated in the aspects of medium and large-size application fields including TV, commercial display and electronic contests, the main stream of the Mini backlight technology is blue light LEDs matched with quantum dot films at present, and the adopted bead surface dot or white glue spraying technology (such as CN 112186090A) is adopted, the scheme has a light emitting angle of 160 DEG, but the light blocking layer (white glue) has larger light blocking, so that the central light intensity of the LED beads has larger sacrifice, the luminous flux of the lamp beads is seriously lower, the brightness of the product is not high, and the experience effect is poor. In the prior art, there are schemes that adopt transparent support, for example, CN107086263B discloses a display device and a four-side light-emitting LED thereof, the transparent support is formed on a substrate by adopting a thermoplastic mode, the transparent support generally adopts transparent plastics, such as PPA (poly (p-phenylene terephtalate), PCT (polyethylene terephthalate), thermoplastic resin, the light transmittance of the thermoplastic resin is insufficient, the side light-emitting intensity is affected, and the top is provided with a reflective white glue layer, the light intensity loss of the top is larger, and the actual experience effect is poor. Disclosure of Invention The invention aims to overcome the defects of the prior art, and provides an LED light-emitting device and a manufacturing method thereof, which can reduce the light intensity loss at the top of the LED light-emitting device, are beneficial to improving the brightness of the LED light-emitting device and have good actual experience effect. The LED light-emitting device comprises a support, an LED chip and a packaging adhesive layer, wherein the support comprises a substrate and a surrounding dam, the substrate is provided with a front face and a back face which are opposite, the surrounding dam is provided with a bottom face and a top face which are opposite, the bottom face of the LED chip and the bottom face of the surrounding dam are arranged on the front face of the substrate, the surrounding dam surrounds the LED chip to form a chip mounting area for mounting the LED chip and bearing the packaging adhesive layer, the packaging adhesive layer is packaged above the LED chip, the surrounding dam and the packaging adhesive layer are transparent or semitransparent, transparent or semitransparent hollow particles are arranged at the top of the packaging adhesive layer, the height of the surrounding dam is the distance from the front face of the substrate to the top face of the surrounding dam, the height of the packaging adhesive layer protruding out of the support is the distance from the top face of the surrounding dam to the top end of the packaging adhesive layer, and the packaging adhesive layer protrudes out of the height of the support is larger than the height of the surrounding dam. Optionally, the outer surface of the packaging adhesive layer is curved and has a shape with a large lower part and a small upper part, the top of the packaging adhesive layer is positioned right above the chip mounting area, and the hollow particles cover right above the LED light-emitting device. Optionally, at least a portion of the encapsulation glue layer is not covered by hollow particles, and the hollow particles are at least covered directly above the LED chip. Optionally, the projected area of the hollow particles covered on the bottom surface of the encapsulation adhesive layer accounts for 20% -80% of the area of the bottom surface of the encapsulation adhesive layer, or the thickness of the surface of the encapsulation adhesive layer, which is not covered by the hollow particles, is at least greater than the height of the dam. Optionally, the packaging adhesive layer comprises a first packaging adhesive layer and a second packaging adhesive layer, the bottom of the first packaging adhesive layer is packaged on the front surface of the substrate, the bottom of the second packaging adhesive layer is packaged on the top of the first packaging adhesive layer, fluorescent powder is arranged in the first packaging adhesive layer, most of the fluorescent powder is located on the bottom of the first packaging adhesive layer, and the top surface of the first packaging adhesive layer is lower than the top surface of the surrounding dam portion. Optionally, the mass content of the hollow particles i