CN-115682925-B - Inspection method and inspection device

Abstract

The invention provides an inspection method and an inspection device. The inspection apparatus (a) according to the present embodiment includes an illumination device capable of radiating 1 st light of the 1 st wavelength band and reference light having a reference wavelength band overlapping the 1 st wavelength band, an imaging device for imaging an object to be inspected and outputting a pixel signal, and an image processing device. The illumination device irradiates the 1 st light and the reference light to the object to be inspected at different timings within one photographing time. The image processing device calculates 1 st reflectance, which is the reflectance in the 1 st band of the object, based on the pixel signal, and determines the physical properties of the object based on the 1 st reflectance.

Inventors

• NAKAYA SHINYA

Assignees

• 松下知识产权经营株式会社

Dates

Publication Date

20260505

Application Date

20220725

Priority Date

20210728

Claims (10)

1. 1. An inspection method for detecting an object contained in an inspected object by photographing by an inspection device, The inspection device is provided with: A lighting device capable of irradiating 1 st light of a1 st wavelength band and reference light of a reference wavelength band overlapping the 1 st wavelength band; an imaging device for imaging the subject and outputting pixel signals, and An image processing apparatus is provided with a processing unit, The inspection method comprises the following steps: a step in which the illumination device irradiates the 1 st light and the reference light to the subject at different timings within one imaging time; the image processing device calculates 1 st reflectance, which is the reflectance in the 1 st band of the object, from a1 st image based on the pixel signal, which is an image of the object based on the 1 st light, and a reference image, which is an image of the object based on the reference light, and And determining physical properties of the object based on the 1 st reflectance.
2. 2. An inspection method for detecting an object contained in an inspected object by photographing by an inspection device, The inspection device is provided with: a lighting device capable of irradiating 1 st light of a1 st wavelength band, 2 nd light of a 2 nd wavelength band, and reference light of a reference wavelength band overlapping the 1 st wavelength band and the 2 nd wavelength band; an imaging device for imaging the subject and outputting pixel signals, and An image processing apparatus is provided with a processing unit, The inspection method comprises the following steps: a step in which the illumination device irradiates the subject with the 1 st light, the 2 nd light, and the reference light at different timings from each other within one imaging time; The image processing apparatus calculates a1 st reflectance, which is a reflectance in the 1 st band, and a2 nd reflectance, which is a reflectance in the 2 nd band, of the object from a1 st image, which is an image of the object based on the 1 st light, a2 nd image, which is an image of the object based on the 2 nd light, and a reference image, which is an image of the object based on the reference light, based on the pixel signals, and And determining physical properties of the object based on the 1 st reflectance and the 2 nd reflectance by the image processing apparatus.
3. 3. The inspection method according to claim 2, wherein, The image processing apparatus compares the 1 st reflectance and the 2 nd reflectance with spectral reflectance data indicating spectral reflectances of a plurality of substances, thereby determining physical properties of the object.
4. 4. A method of inspection according to claim 2 or 3, comprising: And generating, by the image processing apparatus, a remaining one image from any two images among the 1 st image, the 2 nd image, and the reference image when the object is present in the object.
5. 5. The inspection method of claim 4, comprising: and a step in which the image processing device synthesizes the feature amounts of the 1 st image and the 2 nd image to generate the reference image.
6. 6. The inspection method of claim 4, comprising: The image processing device subtracts the feature amount of the 1 st image from the feature amount of the reference image to generate the 2 nd image.
7. 7. The inspection method according to claim 5 or 6, wherein, The feature quantity is a luminance value or brightness of the object.
8. 8. A method of inspection according to claim 2 or 3, further comprising: A step in which, when a plurality of the objects are present in the subject, the image processing apparatus generates the 1 st image, the 2 nd image, and the reference image for each of the plurality of objects; The image processing device classifies the 1 st image, the 2 nd image and the reference image according to each of the objects, and And calculating the 1 st reflectivity and the 2 nd reflectivity based on the 1 st image, the 2 nd image, and the reference image classified into the same group.
9. 9. The inspection method according to any one of claims 1 to 3, comprising: The image processing apparatus determines the size of the object using the reference image.
10. 10. An inspection apparatus for detecting an object included in an object to be inspected by photographing, the inspection apparatus comprising: A lighting device capable of irradiating 1 st light of a1 st wavelength band and reference light of a reference wavelength band overlapping the 1 st wavelength band; an imaging device for imaging the subject and outputting pixel signals, and An image processing apparatus is provided with a processing unit, The illumination device irradiates the 1 st light and the reference light to the object to be inspected at different timings within one photographing time, The image processing device calculates a1 st reflectance, which is a reflectance in the 1 st band of the object, from a1 st image based on the 1 st light and a reference image, which is an image of the object based on the reference light, and determines physical properties of the object based on the 1 st reflectance.

Description

Inspection method and inspection device Technical Field The present disclosure relates to an inspection apparatus and an inspection method for an inspected object. Background In the field of devices such as semiconductors, electronic devices, and secondary batteries, inspection apparatuses are known that detect an object (foreign matter, defect, etc.) of an object to be inspected using an image sensor. In patent document 1, a plurality of spectral images of a wavelength band are generated, and a feature amount of the spectral image is compared with a feature amount of normal data, thereby detecting a foreign object or the like (object) mixed into an object to be inspected (object to be inspected). That is, in patent document 1, the object is detected by using the difference in physical properties between the object and the object. Prior art literature Patent literature Patent document 1 Japanese patent laid-open publication 2016-138789 Disclosure of Invention An inspection method according to one embodiment of the present disclosure is an inspection method for inspecting an object included in an object by photographing by an inspection device including an illumination device capable of irradiating 1 st light of a1 st wavelength band and reference light having a reference wavelength band overlapping the 1 st wavelength band, a photographing device for photographing the object and outputting a pixel signal, and an image processing device, the inspection method including a step of irradiating the 1 st light and the reference light to the object at different timings within one photographing time, a step of calculating 1 st reflectance, which is a reflectance in the 1 st wavelength band, of the object based on the pixel signal, and a step of determining physical properties of the object based on the 1 st reflectance by the image processing device. An inspection method according to another embodiment of the present disclosure is an inspection method for inspecting an object included in an object by capturing an image by an inspection device including an illumination device capable of radiating 1 st light of a 1 st wavelength band, 2 nd light of a2 nd wavelength band, and reference light of a reference wavelength band overlapping the 1 st wavelength band and the 2 nd wavelength band, an image capturing device for capturing the object and outputting a pixel signal, and an image processing device, the inspection method including a step of irradiating the 1 st light, the 2 nd light, and the reference light to the object at timings different from each other within one capturing time, and a step of calculating 1 st reflectance, which is a reflectance in the 1 st wavelength band, and 2 nd reflectance, which are a reflectance in the 2 nd wavelength band, of the object based on the pixel signal, and a step of determining physical properties of the object based on the 1 st reflectance and the 2 nd reflectance. An inspection apparatus according to one embodiment of the present disclosure is an inspection apparatus that detects an object included in an object by performing imaging, and includes an illumination apparatus that can irradiate 1 st light of a1 st wavelength band and reference light of a reference wavelength band overlapping the 1 st wavelength band, an imaging apparatus that images the object and outputs a pixel signal, and an image processing apparatus that irradiates the 1 st light and the reference light to the object at different timings within one imaging time, wherein the image processing apparatus calculates 1 st reflectance, which is reflectance in the 1 st wavelength band, of the object based on the pixel signal, and determines physical properties of the object based on the 1 st reflectance. Drawings Fig. 1 is a side view of an inspection apparatus according to embodiment 1. Fig. 2 is a plan view of the inspection apparatus according to embodiment 1. Fig. 3 is a plan view showing the structure of the imaging element according to embodiment 1. Fig. 4 is a timing chart showing the imaging timing of the imaging device and the irradiation timing of the illumination device in the inspection device according to embodiment 1. Fig. 5 is a flowchart illustrating the overall operation of the image processing apparatus according to embodiment 1. Fig. 6 is a diagram showing an example of an image of a sheet captured by the imaging element according to embodiment 1. Fig. 7 is a diagram showing an example of the brightness value of the sheet captured by the imaging element according to embodiment 1. Fig. 8 is a flowchart illustrating a flow of a physical property determination process of the image processing apparatus according to embodiment 1. Fig. 9 is a graph showing a spectral reflectance curve showing spectral reflectances of a plurality of substances. Fig. 10A is a diagram for explaining a method of determining the size of an object according to embodiment 1. Fig. 10B is a diagram for explaining a method of dete