CN-115696717-B - Film circuit board and keyboard device thereof

Abstract

The invention provides a thin film circuit board and a keyboard device thereof. The film circuit board is used in a key structure of the keyboard device, and the key structure comprises an elastic element. The thin film circuit board comprises a first thin film substrate and a second thin film substrate. The first film substrate comprises a first conductive contact and a second conductive contact which are arranged on the top surface. The elastic element is perpendicularly projected towards the first film substrate to form a projection area on the top surface, and the first conductive contact and the second conductive contact are located in the projection area. The thin film conducting module is arranged between the elastic element and the first thin film substrate and is positioned in the projection area. The thin film conducting module comprises a third conductive contact, and the first conductive contact and the second conductive contact respectively correspond to the third conductive contact.

Inventors

• ZHUANG CHUANGSHU
• LI DAN

Assignees

• 致伸科技股份有限公司

Dates

Publication Date

20260505

Application Date

20210726

Claims (10)

1. 1. A film circuit board for a key structure of a keyboard device, the key structure comprising an elastic element, the film circuit board comprising: A first thin film substrate including a first conductive contact and a second conductive contact disposed on a top surface, the elastic element perpendicularly projecting toward the first thin film substrate to form a projection region on the top surface, and the first conductive contact and the second conductive contact are located in the projection region, and The thin film conducting module is arranged between the elastic element and the first thin film substrate and is positioned in the projection area, the thin film conducting module comprises a third conductive contact, the first conductive contact and the second conductive contact are respectively corresponding to the third conductive contact, the thin film conducting module comprises a second thin film substrate and a spacing substrate which are overlapped with each other, the second thin film substrate is positioned between the elastic element and the spacing substrate, the second thin film substrate is provided with a bottom surface facing the first thin film substrate, the third conductive contact is arranged on the bottom surface, the spacing substrate is positioned between the first thin film substrate and the second thin film substrate, and the spacing substrate enables the first conductive contact and the second conductive contact to be respectively provided with a spacing distance with the third conductive contact.
2. 2. The thin film circuit board of claim 1, comprising a conductive state and a non-conductive state, wherein the spacer substrate comprises a through hole, the through hole is located between the first conductive contact, the second conductive contact and the third conductive contact of the thin film conductive module of the first thin film substrate, and in the conductive state, the third conductive contact passes through the through hole to contact the first conductive contact and the second conductive contact.
3. 3. The thin film circuit board of claim 1, wherein the first thin film substrate, the second thin film substrate and the spacer substrate are made of polyethylene terephthalate.
4. 4. The thin film circuit board of claim 1, wherein the elastic element comprises a surrounding wall and an annular bottom, the surrounding wall extends towards the direction close to the first thin film substrate and is connected with the annular bottom, the annular bottom is perpendicularly projected towards the first thin film substrate to form the projection area, and the annular bottom has an outer diameter length and an inner diameter length.
5. 5. The thin film circuit board of claim 4, wherein the second thin film substrate has a first outer diameter length, the spacer substrate has a second outer diameter length, the outer diameter length of the annular bottom, the first outer diameter length of the first thin film substrate, and the second outer diameter length of the spacer substrate are equal to each other.
6. 6. The thin film circuit board of claim 4, wherein the second thin film substrate has a first outer diameter length, the spacer substrate has a second outer diameter length, the first outer diameter length of the first thin film substrate is equal to the second outer diameter length of the spacer substrate, and the first outer diameter length of the first thin film substrate and the second outer diameter length of the spacer substrate are respectively smaller than the inner diameter length of the annular bottom.
7. 7. The thin film circuit board of claim 1, wherein a region area of the projection region formed on the first thin film substrate by the elastic element is smaller than a surface area of the top surface of the first thin film substrate.
8. 8. The thin film circuit board of claim 1, wherein the first thin film substrate further comprises a first metal line and a second metal line, the first metal line being disposed on the top surface and extending from the first conductive contact to one side outside the projection area, the second metal line being disposed on the top surface and extending from the second conductive contact to the other side outside the projection area.
9. 9. The thin film circuit board of claim 8, wherein at least one of the first metal line and the second metal line is a silver paste line.
10. 10. A keyboard device comprises A plurality of key structures, each key structure comprising: A key cap; an elastic element disposed under the key cap, and A thin film circuit board disposed below the elastic element, the thin film circuit board comprising: A first thin film substrate including a first conductive contact and a second conductive contact disposed on a top surface, the elastic element perpendicularly projecting toward the first thin film substrate to form a projection region on the top surface, and the first conductive contact and the second conductive contact are located in the projection region, and The thin film conducting module is arranged between the elastic element and the first thin film substrate and is positioned in the projection area, and comprises a third conductive contact, wherein the first conductive contact and the second conductive contact respectively correspond to the third conductive contact; the thin film conducting module comprises a second thin film substrate and a spacing substrate which are overlapped with each other, wherein the second thin film substrate is positioned between the elastic element and the spacing substrate, the second thin film substrate is provided with a bottom surface facing the first thin film substrate, the third conductive contact is arranged on the bottom surface, the spacing substrate is positioned between the first thin film substrate and the second thin film substrate, and the spacing substrate enables a spacing distance to be formed between the first conductive contact and the second conductive contact and between the third conductive contact respectively.

Description

Film circuit board and keyboard device thereof Technical Field The present invention relates to the field of input devices, and in particular, to a thin film circuit board applied to a keyboard device. Background With the technological change, electronic devices are becoming more convenient for human life, so it is an important task to make the operation of the electronic devices more humanized. Common input devices of electronic devices include a mouse device, a keyboard device, and a track ball device, wherein the keyboard device is used for a user to directly input characters and symbols into a computer, and thus considerable attention is paid. The keyboard device comprises a plurality of key structures, wherein each key structure mainly comprises a key cap, a scissor-type connecting assembly, a thin film circuit board and a key bottom plate which are stacked in sequence, and if the keyboard device belongs to a model of a luminous keyboard, a backlight module is additionally arranged below the key bottom plate. Specifically, the thin film circuit board is provided with a thin film switch, an elastic element is arranged between the key cap and the thin film circuit board, the scissor type connecting component is connected between the key cap and the key bottom plate and comprises a first frame and a second frame pivoted to the first frame, and therefore the first frame and the second frame can swing relatively to each other. When the keycaps of any key structure are touched and moved downwards relative to the key bottom plate, the first frame and the second frame of the scissor type connecting assembly are changed from the opening and closing state to the overlapping state, and the downward moving keycaps squeeze the elastic elements, so that the elastic elements are propped against and trigger the corresponding membrane switches, and the keyboard device generates corresponding key signals. When the keycap of the key structure is not touched any more, the keycap can move upwards relative to the key bottom plate according to the elastic restoring force of the elastic element, at the moment, the first frame and the second frame can be changed from the superposition state to the opening and closing state, and the keycap can restore to the original position. The film circuit board of the conventional keyboard device comprises an upper film substrate, a lower film substrate and a middle film substrate interposed between the upper film substrate and the lower film substrate. The lower surface of the upper layer film substrate is provided with a first circuit pattern, and the first circuit pattern is provided with a plurality of upper contacts and a plurality of upper silver colloid circuits which respectively correspond to the key structures. The upper surface of the lower film substrate is provided with a second circuit pattern, and the second circuit pattern is provided with a plurality of lower contacts and a plurality of lower silver colloid circuits which respectively correspond to the upper contacts. In addition, the middle layer film substrate is provided with a plurality of openings corresponding to the upper contacts and the lower contacts respectively. Each upper contact and the corresponding lower contact form the membrane switch together. However, the conventional thin film circuit board is formed by stacking an upper thin film substrate, a lower thin film substrate and an intermediate thin film substrate, which have substantially the same size (e.g., the same surface area), so that the keyboard device cannot be thinned due to such a structural design. Therefore, how to improve the above problems is a focus of attention of those skilled in the art. Disclosure of Invention The invention provides a thin film circuit board. Another object of the present invention is to provide a keyboard device having a thin film circuit board. Other objects and advantages of the present invention will be further appreciated from the technical features disclosed in the present invention. In order to achieve one or a part or all of the above or other objects, the present invention provides a film circuit board for a key structure of a keyboard device, wherein the key structure comprises an elastic element. The thin film circuit board comprises a first thin film substrate and a thin film conducting module. The first film substrate comprises a first conductive contact and a second conductive contact which are arranged on the top surface, the elastic element is perpendicularly projected towards the first film substrate to form a projection area on the top surface, and the first conductive contact and the second conductive contact are positioned in the projection area. The thin film conducting module is arranged between the elastic element and the first thin film substrate and is positioned in the projection area. The thin film conducting module comprises a third conductive contact, and the first conductive contact and the