Search

CN-115696769-B - Automatic tin plating device and tin plating method for PCB

CN115696769BCN 115696769 BCN115696769 BCN 115696769BCN-115696769-B

Abstract

The invention discloses an automatic tin plating device and a tin plating method of a PCB, which relate to the technical field of automatic tin plating of circuit boards and comprise a tin plating table; the device comprises a tinning table, a placement mechanism, a tinning mechanism and a tin plating mechanism, wherein the placement mechanism is arranged on the bottom shell wall of the tinning table and is used for fixing a PCB (printed circuit board) and simultaneously conveniently taking and placing the PCB, the tinning mechanism is arranged on the top shell wall of the tinning table and is positioned below the tinning mechanism, and the tinning mechanism has the functions of scaling powder coating, tinning and cleaning. The circuit board body is conveniently fixed and clamped through the structure in the placement mechanism, the circuit board body is conveniently taken in the fixing and clamping processes, the tinning efficiency is improved, the circuit board body is conveniently and automatically tinned through the structure in the tinning mechanism, the surface of the circuit board body can be cleaned in the tinning process, the circuit board body is prevented from being polluted by solder paste splashed outside a circuit, and the circuit board body is ensured to be tidy.

Inventors

  • BI BO
  • XU LICHENG

Assignees

  • 毕波

Dates

Publication Date
20260512
Application Date
20221115

Claims (6)

  1. 1. An automatic tin plating device of a PCB circuit board, comprising: A tin plating table (1); placement mechanism (2), place mechanism (2) and install on the bottom shell wall of tinning table (1), place mechanism (2) are used for fixed PCB circuit board, conveniently get it simultaneously and put, place mechanism (2) include: Tripod (21), rack (22) are installed at the top of tripod (21), circuit board body (25) have been placed to the inside of rack (22), and the inner wall fixedly connected with spring (23) of rack (22), one end fixedly connected with rubber stripper plate (24) of spring (23), two rubber stripper plates (24) are located the both sides of circuit board body (25) respectively, and circuit board fixed subassembly (26) and locating component (27) are all installed to the both sides of rack (22); the circuit board fixing assembly (26) includes: The rotary rack comprises a rotary shaft (261), wherein a first groove is formed in the top of the rack (22), the rotary shaft (261) is rotationally connected with the first groove, an L-shaped fixing piece (262) is fixedly sleeved on the outer ring of the rotary shaft (261), and a positioning groove (263) is formed in one side of the L-shaped fixing piece (262); the positioning assembly (27) comprises: The connecting block (271), recess two has all been seted up to the both sides outer wall of rack (22), connecting block (271) and recess two sliding connection, one side fixedly connected with spring two (275) of connecting block (271), one end and recess two fixed connection of spring two (275), the fixed cover of inner circle of connecting block (271) is equipped with pull rod (272) and connecting plate (273), pull rod (272) run through recess two, one side fixedly connected with locating shaft (274) of connecting plate (273), one end of locating shaft (274) runs through recess two, and locating shaft (274) are pegged graft with constant head tank (263); Tinning mechanism (3), tinning mechanism (3) are installed on the top shell wall of tinning platform (1), place mechanism (2) and be located the below of tinning mechanism (3), tinning mechanism (3) have and paint scaling powder, tinning and clean integration function.
  2. 2. The automatic tin plating apparatus of a PCB circuit board of claim 1, wherein The inner wall of the placement frame (22) is provided with a sliding groove, one side of the rubber extrusion plate (24) is fixedly connected with a sliding block, and the sliding block is in sliding connection with the sliding groove.
  3. 3. The automatic tin plating apparatus of a PCB circuit board of claim 2, wherein: The tinning mechanism (3) comprises: the servo motor (31), the top fixed connection of servo motor (31) and tin-plating platform (1) through the bolt, and the output shaft fixedly connected with transmission shaft (32) of servo motor (31), the top of tin-plating platform (1) is run through to the one end of transmission shaft (32) to fixedly connected with cam (33).
  4. 4. An automatic tin plating apparatus of a PCB circuit board according to claim 3, wherein: The outer ring cover of cam (33) is equipped with fretwork frame (35), one side welding of fretwork frame (35) has mount (34), mount (34) rotate and are connected with scaling powder brush roller (36) and tinning brush roller (37), and the top fixedly connected with guide block of mount (34), the guide way has been seted up at the top of tinning table (1), guide block and guide way sliding connection.
  5. 5. The automatic tin plating apparatus of a PCB circuit board of claim 4, wherein: The bottom of mount (34) is through connecting rod one (38) fixedly connected with connecting rod two (39), connecting rod two (39) fixedly connected with two cleaning brush (310), scaling powder brush roll (36) and tinning brush roll (37) are located the centre of two cleaning brush (310).
  6. 6. An automatic tin plating method of a PCB circuit board automatic tin plating device, adopting the automatic tin plating device of a PCB circuit board according to claim 5, characterized by comprising the following steps: S1, pulling a pull rod (272) to drive a connecting block (271) to slide in a groove II, wherein the connecting block (271) drives a positioning shaft (274) to slide through a connecting plate (273) while sliding, when the positioning shaft (274) is separated from a positioning groove (263), an L-shaped fixing piece (262) can rotate, and when the long shaft of the L-shaped fixing piece (262) is far away from a rack (22) body, a circuit board body (25) is placed in the L-shaped fixing piece; s2, after the circuit board body (25) is turned into the rack (22), the pull rod (272) is loosened, the connecting block (271) drives the positioning shaft (274) to be reinserted into the positioning groove (263) through the acting force of the second spring (275), and when the positioning shaft (274) is positioned in the positioning groove (263), the L-shaped fixing piece (262) cannot rotate to fix the circuit board body (25); S3, starting a servo motor (31) after fixing the circuit board body (25), wherein the servo motor (31) drives a cam (33) to rotate in an inner ring of a hollowed-out frame (35) through a transmission shaft (32), and the cam (33) drives a fixing frame (34) to do linear reciprocating motion on the top shell wall of the tinning table (1) through the hollowed-out frame (35) and a guide block; s4, in the process of linear reciprocating motion of the fixing frame (34), the fixing frame (34) drives all structures connected with the fixing frame to move together, wherein a cleaning brush (310) far away from the hollowed-out frame (35) is firstly contacted with the circuit board body (25), and dirt on the surface of the circuit board body (25) is cleaned through the cleaning brush (310); s5, after cleaning dirt on the surface of the circuit board body (25), a soldering flux brush roller (36) can smear a layer of soldering flux on the surface of the circuit board body (25), then a layer of tin is plated on the surface of the circuit board body (25) when the tin plating brush roller (37) passes through the surface of the circuit board body, and then a cleaning brush (310) close to a layer of the hollowed-out frame (35) can clean the dirt on the surface of the circuit board body (25) again, so that the tin plating is finished repeatedly; And S6, finally, the pull rod (272) is pulled to drive the connecting block (271) to slide in the second groove, the connecting block (271) drives the positioning shaft (274) to slide through the connecting plate (273) while sliding, the L-shaped fixing piece (262) can rotate after the positioning shaft (274) is separated from the positioning groove (263), and the circuit board body (25) is taken out from the L-shaped fixing piece (262) after the long shaft of the L-shaped fixing piece is far away from the body of the placing rack (22).

Description

Automatic tin plating device and tin plating method for PCB Technical Field The invention relates to the technical field of automatic tin plating of circuit boards, in particular to an automatic tin plating device and a tin plating method of a PCB. Background The names of the circuit boards are ceramic circuit boards, aluminum oxide ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper plates, impedance boards, PCBs, ultrathin circuit boards, printed (copper etching technology) circuit boards and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, and an FPC circuit board (the FPC circuit board is also called a flexible circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility). Therefore, the soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through the procedures of pressing and the like and has FPC characteristics and PCB characteristics. In the prior art, as a 'printed circuit board tinning device' with the Chinese patent number of CN206389628U, the device comprises a base, a cover plate, a fixed seat and a brush, wherein the cover plate is hinged on the base, the fixed seat is fixedly arranged on the base, a plurality of through holes with the same size as a position to be tinned on the surface of the printed circuit board are formed in the cover plate, a layer of cover film is paved on the surface of the cover plate, the width of the cover film is smaller than that of the cover plate but larger than that of the fixed seat, and through holes corresponding to the position to be tinned on the surface of the printed circuit board are formed in the cover film. The printed circuit board fixing device has the advantages that the printed circuit board is fixed by the fixing seat, the positions needing tin plating are located by the cover plate and the through holes on the cover film, the tin plating is performed manually, the tin plating quality is good, the tin plating can be completed by only manufacturing the cover film corresponding to the circuit board in different forms, the manufacturing time is short, the cost is low, and the device is suitable for tin plating operation of various and small-batch printed circuit boards. However, in the prior art, the manual tin brushing is quite low in efficiency, and the surface of the PCB is also polluted, so that the PCB is difficult to clean after being dried due to the fact that the tin paste is not cleaned timely. Disclosure of Invention The invention aims to solve the technical problems that the manual tin brushing efficiency is quite low and the surface of a PCB is polluted in the prior art, and provides an automatic tin plating device and a tin plating method for the PCB. In order to achieve the above purpose, the present invention provides the following technical solutions: an automatic tin plating device of a PCB circuit board, comprising: A tinning table; The placing mechanism is arranged on the bottom shell wall of the tinning table and is used for fixing the PCB and simultaneously facilitating taking and placing of the PCB; Tinning mechanism, tinning mechanism installs on the top shell wall of tinning platform, place the below that mechanism is located tinning mechanism, tinning mechanism has and paints scaling powder, tinning and clean integration function. Preferably: The placement mechanism includes: Tripod, the rack is installed at the top of tripod, circuit board body has been placed to the inside of rack, and the inner wall fixedly connected with spring one of rack, the one end fixedly connected with rubber stripper plate of spring one, and two rubber stripper plates are located the both sides of circuit board body respectively, and circuit board fixed subassembly and locating component are all installed to the both sides of rack. Preferably: The circuit board fixing assembly includes: The rotary shaft, recess one has been seted up at the top of rack, pivot and recess one rotate to be connected, and the fixed cover in outer lane of pivot is equipped with L shape mounting, the constant head tank has been seted up to one side of L shape mounting. Preferably: The positioning assembly includes: The connecting block, recess two has all been seted up to the both sides outer wall of rack, connecting block and recess two sliding connection, one side fixedly connected with spring two of connecting block, the one end and the recess two fixed connection of spring two. Preferably: The inner ring of the connecting block is fixedly sleeved with a pul