CN-115699784-B - Photosensitive assembly with anti-shake function and corresponding camera module

Abstract

The invention relates to a photosensitive assembly with an anti-shake function, which comprises a circuit board, a photosensitive chip, a base, a supporting seat and a driving module, wherein the photosensitive chip is arranged on the upper surface of the circuit board, the base is positioned below the circuit board and connected with the circuit board through a supporting shaft, the supporting seat surrounds the periphery of the base, the top surface of the supporting seat is suitable for being provided with a lens assembly, and the driving module comprises a plurality of sub-lifting driving modules which are arranged between the base and the circuit board and distributed around the supporting shaft. The invention also provides a corresponding camera module. The invention can realize the anti-shake function of the photosensitive assembly with smaller space cost and can realize optical anti-shake on a plurality of degrees of freedom.

Inventors

• CHEN FEIFAN
• RONG QI
• YUAN DONGLI
• Wei Hangang

Assignees

• 宁波舜宇光电信息有限公司

Dates

Publication Date

20260508

Application Date

20210330

Priority Date

20200416

Claims (20)

1. 1. A photosensitive assembly having an anti-shake function, comprising: A circuit board; a photosensitive chip attached to the wiring board; the base is positioned below the circuit board and connected with the circuit board through a supporting shaft, wherein the supporting shaft has elasticity; A support base, wherein the support base is positioned at the edge part of the base, the support base surrounds the circuit board with a space between the support base and the circuit board, the support base is used for installing an optical lens, and The driving module is arranged between the bottom surface of the circuit board and the base and comprises a multi-point lifting driving module so as to realize the controlled movement of the circuit board relative to the base, so that the photosensitive chip can perform jitter compensation independently of the optical lens.
2. 2. The photosensitive assembly of claim 1, wherein the multi-point lift drive module comprises four sub-lift drive modules corresponding to four corners of the photosensitive chip, the four sub-lift drive modules being configured to be capable of being lifted integrally when the four sub-lift drive modules are lifted simultaneously in a direction parallel to the z-axis.
3. 3. The photosensitive assembly of claim 2, wherein the circuit board moves downward when the four sub-lift driving modules are simultaneously lowered.
4. 4. The photosensitive assembly of claim 2, wherein the circuit board has a rectangular shape, and the sub-lift driving modules are disposed at positions corresponding to four corners of the circuit board, respectively.
5. 5. The photosensitive assembly of claim 2, wherein the sub-lift drive module comprises a first magnetic element coupled to the bottom surface of the wiring board and a second magnetic element coupled to the base.
6. 6. The photosensitive assembly of claim 5, wherein the first magnetic element comprises a metal core coupled to a bottom surface of the circuit board and a coil disposed on the metal core, or wherein the first magnetic element is a magnet.
7. 7. The photosensitive assembly of claim 5, wherein the second magnetic element comprises a metal core coupled to the top surface of the base and a coil disposed on the metal core.
8. 8. The photosensitive assembly of claim 5, wherein the second magnetic element is a magnet that is embedded or partially embedded in the base.
9. 9. The photosensitive assembly of claim 2, further comprising a flexible support member connecting the base and the wiring board, a plurality of the flexible support members providing distributed flexible support at a plurality of locations of the wiring board.
10. 10. The photosensitive assembly of claim 9, wherein the resilient support member comprises a plurality of springs, two ends of the springs being connected to the bottom surface of the circuit board and the top surface of the base, respectively.
11. 11. A photosensitive assembly according to claim 3, wherein the sub-lift drive module is further adapted to synchronously drive the circuit board up or down to adjust the height of the circuit board relative to the base.
12. 12. The photosensitive assembly of claim 2, wherein the drive module further comprises a second drive module comprising a shape memory alloy push rod, a push rod block, a bottom surface extension block and a base extension block, wherein the base extension block is formed by extending upwards from the top surface of the base, two ends of the shape memory alloy push rod are respectively connected with the base extension block and the push rod block, the bottom surface extension block is formed by extending from the bottom surface of the circuit board, and the push rod block is arranged opposite to the side surface of the bottom surface extension block.
13. 13. The photosensitive assembly of claim 12, wherein said pusher block is spaced from a side of said floor extension block when said shape memory alloy pusher is at ambient temperature, said shape memory alloy pusher block being adapted to extend after an increase in temperature to contact said pusher block and urge said floor extension block to move in a horizontal direction.
14. 14. The photosensitive assembly of claim 1, wherein the drive module further comprises a second drive module comprising a bottom surface extension block and a shape memory alloy wire, one end of the shape memory alloy wire is connected to the bottom surface extension block, the other end is connected to the support base, and the bottom surface extension block is formed by extending downwards from the bottom surface of the circuit board.
15. 15. The photosensitive assembly of claim 1, wherein the drive module further comprises a second drive module comprising a bottom surface extension block and a shape memory alloy wire, one end of the shape memory alloy wire is connected to the bottom surface extension block, the other end is connected to a base extension block, the base extension block is formed by extending upward from a top surface of the base, and the bottom surface extension block is formed by extending downward from a bottom surface of the circuit board.
16. 16. The photosensitive assembly of claim 1, wherein the driving module further comprises a second driving module, the second driving module comprises a bottom surface extending block, a shape memory alloy push rod and a push rod block, two ends of the shape memory alloy push rod are respectively connected with the supporting seat and the push rod block, the bottom surface extending block is formed by extending downwards from the bottom surface of the circuit board, and the push rod block is arranged opposite to the side surface of the bottom surface extending block.
17. 17. The photosensitive assembly of claim 14, 15 or 16, wherein the drive modules comprise at least one x-axis drive module and at least one y-axis drive module, wherein the x-axis drive module is the second drive module disposed along an x-axis direction adapted to drive the wiring board to move along an x-axis, and the y-axis drive module is the second drive module disposed along a y-axis direction adapted to drive the wiring board to move along a y-axis.
18. 18. The photosensitive assembly of claim 17, wherein the x-axis drive module is disposed on an x-axis of the circuit board, wherein the x-axis is a central axis of the circuit board that is parallel to the x-axis.
19. 19. The photosensitive assembly of claim 18, wherein the y-axis drive module is disposed on a y-axis of the circuit board, wherein the y-axis is a central axis of the circuit board parallel to the y-axis.
20. 20. The photosensitive assembly of claim 17, wherein the x-axis drive modules have an even number and the even number of the x-axis drive modules are symmetrically arranged on both sides of an x-axis line of the circuit board, wherein the circuit board is driven to translate along an x-axis by synchronously applying a driving force through the x-axis drive modules on both sides of the x-axis line, wherein the circuit board is driven to rotate about a z-axis by applying a driving force through the x-axis drive modules located on a single side of the x-axis line, and wherein the x-axis line is a central axis line of the circuit board parallel to the x-axis line.

Description

Photosensitive assembly with anti-shake function and corresponding camera module RELATED APPLICATIONS The application claims priority to a photosensitive assembly with anti-shake function and a corresponding camera module, and Chinese patent application No. 202010299235.0 filed on 16 th 4 th 2020, which is incorporated herein by reference in its entirety. Technical Field The invention relates to the technical field of camera modules, in particular to a photosensitive assembly with an anti-shake function and a corresponding camera module. Background With the popularity of mobile electronic devices, related technologies of camera modules for helping users acquire images (e.g., video or images) applied to mobile electronic devices have been rapidly developed and advanced, and in recent years, camera modules have been widely used in various fields such as medical treatment, security, industrial production, etc. Currently, in the consumer electronics field (such as the mobile phone field), an optical anti-shake function has become one of the common functions of the camera module. When an electronic device (e.g., a smart phone) takes a picture, shake is unavoidable for various reasons. For example, when a smart phone is held for shooting, a photographer often has difficulty in holding the mobile phone for a long time, the mobile phone is easy to be unstable due to the key action during shooting, and the situation can cause shaking of pictures in a view-finding frame to influence the imaging quality of a camera module. Currently, optical anti-shake is generally implemented by an optical image stabilizer. The optical image stabilizer is Optical Image Stabilizer, abbreviated OIS. In the prior art, an image capturing module with an optical anti-shake function is generally configured with an optical image stabilizer on an optical lens. In particular, in order to improve the imaging quality of the camera module, most of the solutions adopted at present are to equip the lens with a voice coil motor, and drive the movement of the lens through the voice coil motor, so as to correct the shake of the lens and effectively improve the imaging quality. However, the anti-shake effect of the voice coil motor disposed in the optical lens is limited. On the one hand, the camera module needs to rely on a photosensitive chip to image, and in many actual shooting scenes, not only the optical lens but also the photosensitive chip may shake. For example, when a photographer shakes due to instability of a hand-held mobile phone, not only the position of the optical lens but also the position of the photosensitive chip may shift, and adjusting the position of the optical lens alone may be insufficient to correct the problem of the frame shift. On the other hand, the driving capability of the voice coil motor itself disposed in the optical lens is also limited, for example, the stroke of the voice coil motor is limited, and when the jitter amplitude is large, it is difficult to correct the jitter. In order to effectively improve the imaging quality of the camera module, an anti-shake technology for a photosensitive chip appears in the prior art. For example, it has been proposed to provide a pan/tilt head at the bottom of a photosensitive assembly, and the photosensitive assembly is mounted on the pan/tilt head to realize anti-shake. However, the structure of the cradle head occupies a larger volume, which increases the thickness of the mobile phone, and is not in line with the trend of light and thin smart phone. Moreover, because the volume of the cradle head is larger, for smart phones with extremely precious internal space, the design difficulty of the mobile phone can be remarkably increased by adopting the cradle head-based anti-shake scheme, and the space of other modules (such as a battery) is occupied. Therefore, there is an urgent need for an anti-shake solution for a photosensitive assembly that can be miniaturized. Disclosure of Invention The invention aims to overcome the defects of the prior art and provide an anti-shake solution for a photosensitive assembly, which can realize miniaturization. The invention provides a photosensitive assembly with an anti-shake function, which comprises a circuit board, a photosensitive chip, a base, a supporting seat and a driving module, wherein the photosensitive chip is arranged on the upper surface of the circuit board, the base is positioned below the circuit board and is connected with the circuit board through a supporting shaft, the supporting seat surrounds the peripheral edge of the base, the top surface of the supporting seat is suitable for being provided with a lens assembly, and the driving module comprises a plurality of sub-lifting driving modules, and the sub-lifting driving modules are arranged between the base and the circuit board and are distributed around the supporting shaft. The plurality of sub lifting driving modules are respectively arranged at different positions