CN-115703205-B - Surface topography flattening equipment and method for improving topography flatness of electrostatic chuck

Abstract

The invention discloses surface topography flattening equipment which comprises an electrostatic chuck, a temperature control part, a polishing piece and a temperature control part, wherein the electrostatic chuck is provided with a surface to be polished, the temperature control part is arranged opposite to the surface to be polished, the polishing piece is provided with a polishing surface, the polishing surface is used for contacting the surface to be polished of the electrostatic chuck, the temperature control part is used for heating or cooling the polishing piece to enable the polishing piece to expand when being heated or shrink when being cooled, and the polishing surface of the polishing piece polishes the surface to be polished of the electrostatic chuck. The surface topography planarization apparatus is capable of polishing a surface of an electrostatic chuck.

Inventors

• WU HAO
• WU LEI
• YE RUBIN
• Ivan bidukov

Assignees

• 中微半导体设备(上海)股份有限公司

Dates

Publication Date

20260512

Application Date

20210805

Claims (20)

1. 1. A surface topography planarization apparatus, comprising: An electrostatic chuck having a surface to be polished; The temperature control part is arranged opposite to the surface to be polished; a polishing member having a polishing surface for contacting a surface to be polished of the electrostatic chuck; The polishing device comprises a polishing piece, a temperature control part, a first cooling device, a heating device and an electrostatic chuck, wherein the temperature control part is used for heating or cooling the polishing piece, the heating device and the first cooling device are arranged in the temperature control part and used for heating the polishing piece, the first cooling device is used for cooling the polishing piece, and the heating device and the first cooling device are repeatedly switched to form a heat-cold circulation of the polishing piece so that the polishing piece is heated and expanded or cooled and contracted, and a polishing surface of the polishing piece polishes a surface to be polished of the electrostatic chuck.
2. 2. The surface topography planarization apparatus of claim 1, further comprising a driving device for driving the temperature control portion and/or the electrostatic chuck to move, the driving device being configured to bring the temperature control portion, the polishing member, and the electrostatic chuck into contact with each other when the temperature control portion heats the polishing member.
3. 3. The surface topography planarization apparatus of claim 2, wherein the polishing member further comprises a non-polishing surface opposite the polishing surface, the non-polishing surface of the polishing member being coupled to the temperature control portion by a thermal grease.
4. 4. The surface topography planarization apparatus of claim 3, wherein the thermally conductive grease material comprises silicone grease or carbon fiber doped silica gel.
5. 5. The surface topography planarization apparatus of claim 2, wherein said first cooling means comprises: A first cooling chamber; a first inlet communicating with the first cooling chamber, and A first outlet in communication with the first cooling cavity; When the first inlet is connected with the cooling medium, the cooling medium flows out after passing through the first inlet, the first cooling cavity and the first outlet in sequence, and takes away part of heat of the temperature control part.
6. 6. The surface topography planarization apparatus of claim 1, further comprising: An electrode disposed within the electrostatic chuck; and the direct current power supply is connected with the electrode and is used for generating electrostatic attraction on the surface of the electrostatic chuck so as to adsorb the polishing piece.
7. 7. The surface topography planarization apparatus of claim 1, further comprising: the second cooling device is arranged in the electrostatic chuck and used for cooling the electrostatic chuck.
8. 8. The surface topography planarization apparatus of claim 7, wherein said second cooling means comprises: A second cooling chamber; a second inlet in communication with the second cooling chamber; A second outlet in communication with the second cooling chamber; when the second inlet is connected with the cooling medium, the cooling medium flows out after passing through the second inlet, the second cooling cavity and the second outlet in sequence, and takes away part of heat of the electrostatic chuck.
9. 9. A surface topography planarization apparatus, comprising: An electrostatic chuck having a surface to be polished; The temperature control part is arranged opposite to the surface to be polished; a polishing member having a polishing surface for contacting a surface to be polished of the electrostatic chuck; The driving device is used for driving the temperature control part and/or the electrostatic chuck to move, and when the temperature control part heats the polishing piece, the driving device is used for enabling the temperature control part, the polishing piece and the electrostatic chuck to be in contact with each other; the electrostatic chuck is arranged on the bearing table, the driving device is used for driving the bearing table to drive the electrostatic chuck to move up and down, the polishing piece is arranged on the electrostatic chuck, and the polishing surface of the polishing piece is attached to the surface to be polished of the electrostatic chuck; the polishing device comprises a polishing piece, a temperature control part, a driving device and an electrostatic chuck, wherein the temperature control part is used for heating or cooling the polishing piece, the temperature control part comprises a heating device which is used for heating the temperature control part, whether the polishing piece is heated or not is controlled by the driving device to control whether the polishing piece is contacted with the temperature control part, the thermal cooling circulation of the polishing piece is formed by repeatedly switching to enable the polishing piece to be contacted with the temperature control part and not contacted with the temperature control part, the polishing piece is enabled to be heated and expanded or cooled and contracted, and the polishing surface of the polishing piece polishes the surface to be polished of the electrostatic chuck.
10. 10. A surface topography planarization apparatus, comprising: An electrostatic chuck having a surface to be polished; The temperature control part is arranged opposite to the surface to be polished; a polishing member having a polishing surface for contacting a surface to be polished of the electrostatic chuck; The temperature control part comprises an infrared radiation source and is used for heating the polishing piece; And the surface of the electrostatic chuck is polished by repeatedly controlling the heat of the infrared radiation source to reach or not to reach the surface of the polishing piece so as to form a heat-cold cycle of the polishing piece, and the polishing piece is heated to expand or cooled to shrink.
11. 11. The surface topography planarization apparatus of claim 10, further comprising a spacer plate extendable between the infrared radiation source and the polishing member, wherein the infrared radiation source stops heating the polishing member when the spacer plate is extended between the infrared radiation source and the polishing member, and wherein the infrared radiation source heats the polishing member when the spacer plate is extended between the infrared radiation source and the polishing member, and wherein the spacer plate is extended between the infrared radiation source and the polishing member by repeated switching to cause the polishing member to form a thermal-cold cycle.
12. 12. The surface topography planarization apparatus of claim 10, wherein said polishing member is cycled hot and cold by repeatedly turning said infrared radiation source on and off.
13. 13. The surface topography planarization apparatus of any one of claims 1-12, further comprising: And the electrostatic chuck and the polishing piece are arranged in the processing cavity.
14. 14. The surface topography planarization apparatus of claim 13, further comprising: And the vacuumizing device is used for adjusting the vacuum degree of the processing cavity.
15. 15. The surface topography planarization apparatus of any one of claims 1-12, wherein a hardness of the polishing member material is greater than or equal to a hardness of the electrostatic chuck material.
16. 16. The surface topography planarization apparatus of claim 15, wherein the electrostatic chuck is sinter molded from an alumina powder containing a doping element comprising at least one of magnesium, silicon, or titanium, and wherein the polishing member comprises a semiconductor material or a metal material.
17. 17. The surface topography planarization apparatus of any one of claims 1-12, further comprising: The first temperature measuring module is used for measuring the temperature of the temperature control part; And the second temperature measuring module is used for measuring the temperature of the electrostatic chuck.
18. 18. A method of improving the flatness of an electrostatic chuck surface topography, comprising: providing a surface topography flattening apparatus as claimed in any of claims 1 to 17; And controlling the polishing piece to form a hot-cold circulation through the temperature control part, so that the polishing piece expands or contracts to polish the surface to be polished of the electrostatic chuck.
19. 19. The method of improving the flatness of an electrostatic chuck surface topography as set forth in claim 18, further comprising: and controlling the temperature of the surface to be polished of the electrostatic chuck so as to ensure that the surface to be polished of the electrostatic chuck is always maintained within a set temperature range.
20. 20. The method of claim 19, wherein the surface to be polished of the electrostatic chuck has a set temperature in the range of-10 ℃ to 80 ℃.

Description

Surface topography flattening equipment and method for improving topography flatness of electrostatic chuck Technical Field The invention relates to the technical field of semiconductor equipment, in particular to surface topography flattening equipment and a method for improving the surface topography flatness of an electrostatic chuck. Background The JR (Johnsen-Rahbek, johnsen-rabek) electrostatic chuck (ELECTROSTATIC sucker, ESC) used at present can generate a larger electrostatic adsorption force when a lower voltage is provided, and the Al 2O3 powder doped with Mg, si, ti and other elements is required to be sintered and molded in the manufacturing process, which inevitably causes non-uniformity of the surface state of the ESC in the molding process, thereby affecting the temperature uniformity of the wafer adsorbed on the ESC in the plasma etching process, and directly affecting the uniformity of the etching result. Disclosure of Invention The invention aims to provide surface topography flattening equipment and a method for improving the surface topography flatness of an electrostatic chuck, wherein the surface topography flattening equipment is used for repeatedly switching a heating device and a first cooling device to form a heat-cold cycle, so that a polishing piece expands or contracts, and the polishing surface is polished by the polishing surface. In order to achieve the above purpose, the present invention is realized by the following technical scheme: The surface topography flattening equipment comprises an electrostatic chuck, a temperature control part, a polishing piece and a polishing piece, wherein the electrostatic chuck is provided with a surface to be polished, the temperature control part is arranged opposite to the surface to be polished, the polishing piece is provided with a polishing surface, the polishing surface is used for contacting the surface to be polished of the electrostatic chuck, the temperature control part is used for heating or cooling the polishing piece to enable the polishing piece to expand when being heated or shrink when being cooled, and the polishing surface of the polishing piece polishes the surface to be polished of the electrostatic chuck. Optionally, the polishing device further comprises a driving device, wherein the driving device is used for driving the temperature control part and/or the electrostatic chuck to move, and the driving device is used for enabling the temperature control part, the polishing piece and the electrostatic chuck to be in contact with each other when the temperature control part heats the polishing piece. Optionally, a heating device and a first cooling device are arranged in the temperature control part, the heating device is used for heating the polishing piece, the first cooling device is used for cooling the polishing piece, and the heating device and the first cooling device are repeatedly switched to form the heat-cold circulation. Optionally, the polishing piece further comprises a non-polished surface opposite to the polished surface, and the non-polished surface of the polishing piece is connected with the temperature control part through heat conduction grease. Optionally, the material of the heat conduction grease comprises silicone grease or silica gel doped with carbon fibers. Optionally, the first cooling device includes: A first cooling chamber; a first inlet communicating with the first cooling chamber, and A first outlet in communication with the first cooling cavity; When the first inlet is connected with the cooling medium, the cooling medium flows out after passing through the first inlet, the first cooling cavity and the first outlet in sequence, and takes away part of heat of the temperature control part. Optionally, the method further comprises: An electrode disposed within the electrostatic chuck; and the direct current power supply is connected with the electrode and is used for generating electrostatic attraction on the surface of the electrostatic chuck so as to adsorb the polishing piece. Optionally, the method further comprises: the second cooling device is arranged in the electrostatic chuck and used for cooling the electrostatic chuck. Optionally, the second cooling device includes: A second cooling chamber; a second inlet in communication with the second cooling chamber; A second outlet in communication with the second cooling chamber; when the second inlet is connected with the cooling medium, the cooling medium flows out after passing through the second inlet, the second cooling cavity and the second outlet in sequence, and takes away part of heat of the electrostatic chuck. The polishing device comprises a polishing piece, a temperature control part, a driving device, a heating device and a heat and cold circulation control device, wherein the polishing piece is arranged on the electrostatic chuck, the temperature control part is used for heating the temperature control part, the driving de