CN-115707199-B - Multilayer circuit board and manufacturing method thereof

CN115707199BCN 115707199 BCN115707199 BCN 115707199BCN-115707199-B

Abstract

The utility model provides a multilayer circuit board, includes the first circuit substrate, glue layer stack structure and the second circuit substrate of range upon range of setting, first circuit substrate includes first conducting layer, be provided with first conductive post on the first conducting layer, the second circuit substrate includes the second conducting layer, be provided with the second conductive post on the second conducting layer, glue layer stack structure has offered and has held first conductive post with the opening of second conductive post, the lateral wall of first conductive post with the lateral wall of second conductive post is connected through soldering tin in order to electrically connect first conductive layer with the second conductive layer. The application also provides a manufacturing method of the multilayer circuit board. According to the multilayer circuit board and the manufacturing method thereof, the side wall of the first conductive column and the side wall of the second conductive column are connected through soldering tin, so that electric connection among a plurality of circuit substrates is realized, the thinning is facilitated, and an electric connection structure among the plurality of circuit substrates is prepared without punching and copper plating procedures, so that the flow is simplified.

Inventors

LI YANG
WANG CHAO
LI YANLU
LIU LIKUN

Assignees

宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司

Dates

Publication Date: 20260512
Application Date: 20210812

Claims (10)

1. The utility model provides a multilayer circuit board, its characterized in that, including the first circuit substrate, glue layer lamination and the second circuit substrate of range upon range of setting, first circuit substrate includes first conductive layer, be provided with first conductive column on the first conductive layer, the second circuit substrate includes the second conductive layer, be provided with the second conductive column on the second conductive layer, glue layer lamination has offered the opening that holds first conductive column with the second conductive column, the lateral wall of first conductive column with the lateral wall of second conductive column is connected through the soldering tin in order to electrically connect first conductive layer with the second conductive layer.
2. The multi-layer circuit board of claim 1, wherein the side walls of the first conductive post and the side walls of the second conductive post are each provided with a conductive oxidation preventing layer, and the solder is sandwiched between the two oxidation preventing layers.
3. The multi-layer circuit board of claim 1, wherein the first circuit substrate further comprises a first insulating layer disposed on a side of the first conductive layer, the second circuit substrate further comprises a second insulating layer disposed on a side of the second conductive layer, one end of the first conductive post away from the first conductive layer is connected to the second insulating layer, and one end of the second conductive post away from the second conductive layer is connected to the first insulating layer.
4. The multi-layer circuit board of claim 3, wherein the first circuit substrate further comprises a third conductive layer disposed on a side of the first insulating layer facing away from the first conductive layer, the second circuit substrate further comprises a fourth conductive layer disposed on a side of the second insulating layer facing away from the second conductive layer, and solder masks are disposed on both the third conductive layer and the fourth conductive layer.
5. The multi-layer circuit board of claim 1, wherein two second conductive posts are disposed on the second conductive layer at intervals, the two second conductive posts and the first conductive post are commonly received in the opening, and the solder is disposed around the end and side walls of the first conductive post and connected to the side walls of the two second conductive posts.
6. The multilayer circuit board of claim 5, wherein the adhesive lamination comprises a third insulating layer and first and second adhesive layers disposed on opposite surfaces of the third insulating layer, the first adhesive layer being bonded to the first circuit substrate, the second adhesive layer being bonded to the second circuit substrate, the first and second conductive layers being in contact with opposite surfaces of the third insulating layer, respectively.
7. The manufacturing method of the multilayer circuit board is characterized by comprising the following steps of: providing a first circuit substrate comprising a first insulating layer and a first conductive layer which are stacked, wherein the first conductive layer comprises a connection pad; pressing a dry film on one side of the first conductive layer, which is away from the first insulating layer, and exposing and developing the dry film to form a through hole so as to expose the connecting pad; Forming a first conductive column on the connection pad, and then removing the dry film; forming soldering tin on the side wall of the first conductive column; Providing a second circuit substrate, which comprises a second insulating layer and a second conductive layer which are stacked, wherein a second conductive column is arranged on the second conductive layer; providing a glue lamination structure provided with an opening; And sequentially pressing the second circuit substrate, the adhesive lamination structure and the first circuit substrate together, wherein the first conductive column and the second conductive column pass through the opening and are respectively connected with the second insulating layer and the first insulating layer, and the first conductive column and the second conductive column are connected through soldering tin.
8. The method of manufacturing a multi-layer circuit board of claim 7, further comprising, prior to the step of forming solder on the same side of the connection pad and the first conductive post, forming an electrically conductive oxidation preventing layer on the same side of the connection pad and the first conductive post, wherein the solder is formed on the oxidation preventing layer.
9. The manufacturing method of the multilayer circuit board is characterized by comprising the following steps of: providing a first circuit substrate comprising a first insulating layer and a first conductive layer which are stacked, wherein the first conductive layer comprises a connection pad; pressing a dry film on one side of the first conductive layer, which is away from the first insulating layer, and exposing and developing the dry film to form a through hole so as to expose the connecting pad; Forming a first conductive column on the connection pad, and then removing the dry film; forming soldering tin at one end of the first conductive column, which is far away from the connecting pad; Providing a second circuit substrate, which comprises a second insulating layer and a second conductive layer which are stacked, wherein two second conductive columns are arranged on the second conductive layer at intervals; providing a glue lamination structure provided with an opening; And sequentially pressing the second circuit substrate, the glue lamination structure and the first circuit substrate together, wherein the first conductive column and the two second conductive columns penetrate through the opening and are respectively connected with the second insulating layer and the first insulating layer, the first conductive column is positioned between the two second conductive columns, and the first conductive column and the two second conductive columns are connected through soldering tin.
10. The method of manufacturing a multi-layer circuit board of claim 9, further comprising, before forming solder on an end of the first conductive post facing away from the connection pad, forming a conductive oxidation-resistant layer on an end of the first conductive post facing away from the connection pad, wherein the solder is formed on the oxidation-resistant layer.

Description

Multilayer circuit board and manufacturing method thereof Technical Field The present invention relates to the field of circuit boards, and more particularly, to a multilayer circuit board capable of reducing thickness and a method for manufacturing the same. Background Consumer electronic products are increasingly being developed towards thinness, shortness and intelligence, and circuit boards (FPCs) as important components are being used in a large number of applications, and the requirements for manufacturing FPCs are increasing. In the prior art, for the manufacturing method of the multilayer circuit board, an inner layer circuit board is generally provided firstly, then a copper-clad plate is pressed on the inner layer circuit board through an adhesive layer, then a through hole or a blind hole is formed in the copper-clad plate, copper plating is carried out on the copper-clad plate to manufacture the through hole or the blind hole into a conductive hole, then an outer layer conductive circuit is formed by manufacturing the copper-clad plate, and the conductive hole is used for conducting the outer layer conductive circuit and the inner layer circuit board. However, the manufacturing process is long, and the conductive holes formed by electroplating occupy the space on the surface of the outer conductive circuit, so that the product requirements cannot be met under the high density trend. Disclosure of Invention In view of the above, the present invention provides a method for manufacturing a multi-layer circuit board and a multi-layer circuit board manufactured by the method. The first aspect of the application provides a multilayer circuit board, which comprises a first circuit substrate, a glue lamination structure and a second circuit substrate which are arranged in a lamination manner, wherein the first circuit substrate comprises a first conductive layer, a first conductive column is arranged on the first conductive layer, the second circuit substrate comprises a second conductive layer, a second conductive column is arranged on the second conductive layer, an opening for accommodating the first conductive column and the second conductive column is formed in the glue lamination structure, and the side wall of the first conductive column and the side wall of the second conductive column are connected through soldering tin to electrically connect the first conductive layer and the second conductive layer. The second aspect of the present application provides a method for manufacturing a multilayer circuit board, comprising the steps of: providing a first circuit substrate comprising a first insulating layer and a first conductive layer which are stacked, wherein the first conductive layer comprises a connection pad; pressing a dry film on one side of the first conductive layer, which is away from the first insulating layer, and exposing and developing the dry film to form a through hole so as to expose the connecting pad; Forming a first conductive column on the connection pad, and then removing the dry film; forming soldering tin on the side wall of the first conductive column; Providing a second circuit substrate, which comprises a second insulating layer and a second conductive layer which are stacked, wherein a second conductive column is arranged on the second conductive layer; providing a glue lamination structure provided with an opening; And sequentially pressing the second circuit substrate, the adhesive lamination structure and the first circuit substrate together, wherein the first conductive column and the second conductive column pass through the opening and are respectively connected with the second insulating layer and the first insulating layer, and the first conductive column and the second conductive column are connected through soldering tin. The third aspect of the present application provides a method for manufacturing a multilayer circuit board, comprising the steps of: providing a first circuit substrate comprising a first insulating layer and a first conductive layer which are stacked, wherein the first conductive layer comprises a connection pad; pressing a dry film on one side of the first conductive layer, which is away from the first insulating layer, and exposing and developing the dry film to form a through hole so as to expose the connecting pad; Forming a first conductive column on the connection pad, and then removing the dry film; forming soldering tin at one end of the first conductive column, which is far away from the connecting pad; Providing a second circuit substrate, which comprises a second insulating layer and a second conductive layer which are stacked, wherein two second conductive columns are arranged on the second conductive layer at intervals; providing a glue lamination structure provided with an opening; And sequentially pressing the second circuit substrate, the glue lamination structure and the first circuit substrate together, wherein the first