CN-115732420-B - Transient self-destructible integrated circuit device

Abstract

The application provides a transient self-destructible integrated circuit device which comprises a substrate, a packaging tube shell, a groove, a porous partition plate, a photosensitive polymer, a sensor and a light-transmitting cover plate, wherein the packaging tube shell is buckled on the substrate, a cavity is formed in the packaging tube shell, the top opening of the groove is arranged on one side of the packaging tube shell, which is away from the substrate, the porous partition plate is arranged in the cavity and is in butt joint with the bottom of the groove to seal the bottom of the groove, the photosensitive polymer is arranged in the groove and is used for generating corrosive solution under illumination, the sensor is arranged between the substrate and the porous partition plate, and the light-transmitting cover plate is arranged at the top opening of the groove and is used for sealing the top opening, so that light rays can enter the groove through the light-transmitting cover plate. The application has simple structure and low cost, and can realize controllable self-destruction according to the external illumination condition.

Inventors

• ZHU ZHIYUAN
• Pu Maoqiu
• PENG DEGUANG

Assignees

• 重庆兆光科技股份有限公司

Dates

Publication Date

20260508

Application Date

20221130

Claims (10)

1. 1. A transient self-destructible integrated circuit device comprising: A substrate; a packaging tube shell which is buckled on the substrate and is internally provided with a cavity; the top opening of the groove is arranged on one side of the packaging tube shell, which is away from the substrate; The porous partition plate is arranged in the cavity and is in butt joint with the bottom of the groove so as to seal the bottom of the groove; A photopolymer disposed in the recess for generating a corrosive solution under light; A sensor disposed between the substrate and the porous separator; the light-transmitting cover plate is arranged at the top opening of the groove and is used for sealing the top opening, so that light rays penetrate through the light-transmitting cover plate and enter the groove.
2. 2. The transient self-destructible integrated circuit device of claim 1, wherein a sealing layer is disposed on a side of the porous partition facing away from the recess for cooperating with the package housing and the substrate to form a sealed space for accommodating the sensor.
3. 3. The transient self-destructible integrated circuit device of claim 1, wherein the porous spacer has a porous structure disposed adjacent the sidewall of the recess, whereby the generated corrosive solution flows into the space in which the sensor is disposed.
4. 4. The transient self-destructible integrated circuit device of claim 2, wherein the sealing layer comprises a material selected from the group consisting of copper, aluminum, potassium and magnesium.
5. 5. The transient self-destructible integrated circuit device of claim 1, wherein the light transmissive cover plate comprises a material selected from the group consisting of silicate, acrylic, polycarbonate, polymethyl methacrylate, polystyrene, and polydiallyldiglycol carbonate.
6. 6. The transient self-destructible integrated circuit device of claim 1, wherein the photopolymer comprises diazonium salt compounds, triazines, onium salt compounds, or sulfonates.
7. 7. The transient self-destructible integrated circuit device of claim 1, wherein the sidewalls of the recess interface with the porous barrier through a bonding layer.
8. 8. The transient self-destructible integrated circuit device of claim 1, wherein the light transmissive cover plate is sealingly connected to the package housing by an adhesive.
9. 9. The transient self-destructible integrated circuit device of claim 1, wherein the package housing interfaces with the substrate by bonding.
10. 10. The transient self-destructible integrated circuit device of claim 1, wherein the material of the package case comprises ceramic.

Description

Transient self-destructible integrated circuit device Technical Field The invention relates to the field of semiconductor packaging, in particular to a transient self-destructible integrated circuit device. Background With the rapid development of semiconductor industry and microelectronic technology, electronic devices and electronic equipment have become an indispensable part of human life and play an increasingly important role in information security, national defense and military industry, telecommunication, life education, medical health, and the like. The protection of information in a chip not only relates to national defense and military security, but also relates to protection of personal privacy, enterprise intellectual property and other aspects. The concept of transient electronics is different from the requirement of electronics on long-time and stable operation, namely, the transient electronics can reliably operate in the design working time, and when the scheduled task is completed or the scheduled task needs to be terminated, the equipment can be partially or completely destroyed and degenerated under the triggering of environmental factors or instructions, so that the purposes of information safety, hardware high and new technology theft prevention and the like are realized. At present, most devices for realizing the self-destruction function at home and abroad have complex structures, high manufacturing cost and how to realize the self-destruction device package with simple structure and low cost become a current difficult problem. Disclosure of Invention In view of the problems in the prior art, the application provides a transient self-destructible integrated circuit device, which mainly solves the problems that the prior related device has a complex structure, is high in cost and is difficult to ensure information security. In order to achieve the above and other objects, the present invention adopts the following technical scheme. The application provides a transient self-destructible integrated circuit device, comprising: A substrate; a packaging tube shell which is buckled on the substrate and is internally provided with a cavity; the top opening of the groove is arranged on one side of the packaging tube shell, which is away from the substrate; The porous partition plate is arranged in the cavity and is in butt joint with the bottom of the groove so as to seal the bottom of the groove; A photopolymer disposed in the recess for generating a corrosive solution under light; A sensor disposed between the substrate and the porous separator; the light-transmitting cover plate is arranged at the top opening of the groove and is used for sealing the top opening, so that light rays penetrate through the light-transmitting cover plate and enter the groove. In an embodiment of the application, a sealing layer is arranged on one side of the porous partition plate, which is away from the groove, and is used for forming a sealing space for accommodating the sensor in cooperation with the packaging tube shell and the substrate. In one embodiment of the present application, the porous partition plate is provided with a porous structure near the side wall of the groove, and the generated corrosive solution flows into the space where the sensor is located through the porous structure. In one embodiment of the present application, the sealing layer is made of copper, aluminum, potassium or magnesium. In one embodiment of the present application, the transparent cover plate is made of silicate, acryl, polycarbonate, polymethyl methacrylate, polystyrene or polydiallyldiglycol carbonate. In one embodiment of the present application, the photosensitive polymer comprises diazonium salt compounds, triazine compounds, onium salt compounds or sulfonate compounds. In one embodiment of the application, the side walls of the grooves are butted with the porous separator by a bonding layer. In one embodiment of the present application, the transparent cover plate is hermetically connected to the package tube through an adhesive. In one embodiment of the application, the package housing is interfaced with the substrate by bonding. In one embodiment of the present application, the material of the package comprises ceramic. As described above, the transient self-destructible integrated circuit device provided by the application has the following beneficial effects. The photosensitive polymer is filled in the groove, after external light passes through the light-transmitting cover plate and enters the groove, the photosensitive polymer can generate corrosive solution under the action of illumination, the corrosive solution can flow into the space where the sensor is located along the aperture of the porous partition plate, the sensor structure is destroyed, the self-destruction of the device is realized, the information safety is ensured, the whole structure is simple, the packaging cost is low, and the economic req