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CN-115734696-B - Fingerprint identification module, manufacturing method thereof and electronic equipment

CN115734696BCN 115734696 BCN115734696 BCN 115734696BCN-115734696-B

Abstract

The application relates to a fingerprint identification module, a manufacturing method thereof and electronic equipment, wherein the manufacturing method of the fingerprint identification module comprises the following steps of preparing a fingerprint identification sensor, wherein the fingerprint identification sensor comprises a metal layer; the method includes preparing a resin layer on one side of a metal layer, irradiating a light beam to the resin layer on a side of the resin layer facing away from the metal layer, wherein the resin layer includes a cover region covering the metal layer, and the metal layer is configured to reflect the light beam incident on the cover region such that the reflected light beam is incident again on the cover region from a surface of the metal layer. The manufacturing method of the fingerprint identification module can solve the problem of inaccurate coating in the wet process of the fingerprint identification module.

Inventors

  • ZHONG JINFENG

Assignees

  • 业泓科技(成都)有限公司
  • 业泓科技股份有限公司

Dates

Publication Date
20260505
Application Date
20221118

Claims (8)

  1. 1. The manufacturing method of the fingerprint identification module is characterized by comprising the following steps: Preparing a fingerprint identification sensor, wherein the fingerprint identification sensor comprises a metal layer; Preparing a resin layer on one side of the metal layer; Irradiating a light beam to the resin layer at a side of the resin layer facing away from the metal layer; Wherein the resin layer includes a covering area covering the metal layer; The metal layer is configured to reflect a light beam incident on the covered region such that the reflected light beam is incident on the covered region again from a surface of the metal layer; the resin layer further includes a peripheral region not covering the metal layer and adjacent to the covered region; The method further comprises the steps of: Removing material of the resin layer in the peripheral region from the surface of the fingerprint recognition sensor; Wherein at least 10% of the energy of the light beam is absorbed by the resin layer when the light beam passes through the resin layer for the first time, and a part of the energy is absorbed when the light beam passes through the resin layer for the second time after being reflected by the metal layer, so that the total energy absorbed by the covering area is higher than the total energy absorbed by the peripheral area, thereby ensuring that the covering area is cured and the peripheral area remains uncured.
  2. 2. The method for manufacturing a fingerprint recognition module according to claim 1, wherein the light beam passes through the resin layer once, and 30% -70% of the energy of the light beam is absorbed by the resin layer.
  3. 3. The method of claim 1, wherein the resin layer has a thickness of 20 μm ±3 μm.
  4. 4. The method for manufacturing a fingerprint recognition module according to claim 1, wherein the wavelength range of the light beam is 306 nm-380 nm.
  5. 5. The method for manufacturing a fingerprint recognition module according to any one of claims 1 to 4, wherein the resin layer comprises the following raw materials in parts by weight: 60% -90% of resin; 5% -30% of monomer; 2% -10% of an initiator; 2% -5% of auxiliary agent.
  6. 6. The method for manufacturing a fingerprint recognition module according to any one of claims 1 to 4, wherein the metal layer includes a first metal electrode layer and a second metal electrode layer; The fingerprint identification sensor further comprises a piezoelectric film layer arranged between the first metal electrode layer and the second metal electrode layer; Preparing the resin layer on one side of the metal layer comprises printing the resin layer on one side of the second metal electrode layer away from the piezoelectric film layer.
  7. 7. The utility model provides a fingerprint identification module which characterized in that includes: a fingerprint identification sensor, the fingerprint identification sensor comprising a metal layer, and The manufacturing method of the fingerprint identification module of any one of claims 1-6 is adopted to prepare the resin layer on one side surface of the fingerprint identification sensor, so that the orthographic projection of the resin layer on the surface of the fingerprint identification sensor overlaps with the orthographic projection of the metal layer on the surface of the fingerprint identification sensor.
  8. 8. An electronic device comprising the fingerprint recognition module of claim 7.

Description

Fingerprint identification module, manufacturing method thereof and electronic equipment Technical Field The present application relates to the field of fingerprint recognition technologies, and in particular, to a fingerprint recognition module, a manufacturing method thereof, and an electronic device. Background At present, in the wet coating process of the fingerprint identification module, the alignment accuracy of the coating ink of different layers is poor in the lamination and coating process due to the characteristic of easy flow of the coating ink. Disclosure of Invention Accordingly, it is necessary to provide a fingerprint recognition module, a manufacturing method thereof and an electronic device for solving the problem of poor alignment accuracy of the coating ink in the wet coating process of the fingerprint recognition module. According to one aspect of the present application, there is provided a method for manufacturing a fingerprint identification module, the method comprising the steps of: Preparing a fingerprint identification sensor, wherein the fingerprint identification sensor comprises a metal layer; Preparing a resin layer on one side of the metal layer; Irradiating a light beam to the resin layer at a side of the resin layer facing away from the metal layer; Wherein the resin layer includes a covering area covering the metal layer; The metal layer is configured to reflect a light beam incident on the footprint such that the reflected light beam is re-incident on the footprint from a surface of the metal layer. In some embodiments the beam passes through the resin layer once, at least 10% of the energy of the beam being absorbed by the resin layer. In some embodiments, the light beam passes through the resin layer once, and 30% -70% of the energy of the light beam is absorbed by the resin layer. In some embodiments, the resin layer has a thickness of 20 μm±3 μm. In some embodiments, the wavelength range of the light beam is 306 nm-380 nm. In some embodiments, the resin layer comprises, by weight, 60% -90% of resin, 5% -30% of monomer, 2% -10% of initiator and 2% -5% of auxiliary agent. In some embodiments, the metal layer comprises a first metal electrode layer and a second metal electrode layer, the fingerprint identification sensor further comprises a piezoelectric film layer arranged between the first metal electrode layer and the second metal electrode layer, and preparing the resin layer on one side of the metal layer comprises printing the resin layer on one side of the second metal electrode layer away from the piezoelectric film layer. In some embodiments, the resin layer further includes a peripheral region not overlying the metal layer and adjacent to the footprint, and the method further includes removing material of the resin layer at the peripheral region from the surface of the fingerprint identification sensor. According to another aspect of the application, a fingerprint identification module is further provided, which comprises a fingerprint identification sensor and a resin layer, wherein the fingerprint identification sensor comprises a metal layer, and the resin layer is prepared on one side surface of the fingerprint identification sensor by adopting the manufacturing method of the fingerprint identification module, so that the orthographic projection of the resin layer on the surface of the fingerprint identification sensor overlaps with the orthographic projection of the metal layer on the surface of the fingerprint identification sensor. According to another aspect of the present application, there is also provided an electronic device including the fingerprint identification module as described above. According to the manufacturing method of the fingerprint identification module, the resin layer prepared on the surface of the metal layer is irradiated by the light beam, the light beam is reflected by the metal layer, so that the reflected light beam can be incident to the region of the resin layer overlapped with the metal layer again, and when the resin layer simultaneously has the region overlapped with the metal layer and the region not overlapped with the metal layer, the curing degree of the overlapped region is different from that of the non-overlapped region. Based on the method, the irradiation condition of the light beam is adjusted according to the manufacturing requirement, and the accurate transfer printing of the patterns of the resin layer can be realized, so that the problem of inaccurate coating in the wet process of the fingerprint identification module is solved. Drawings Fig. 1 is a schematic diagram showing a structure of an ultrasonic fingerprint recognition module in the related art; FIG. 2 is a flow chart illustrating a method for fabricating a fingerprint recognition module according to an embodiment of the application; FIG. 3 is a schematic process diagram illustrating a method for manufacturing a fingerprint recognition module accor