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CN-115735148-B - Micromechanical device

CN115735148BCN 115735148 BCN115735148 BCN 115735148BCN-115735148-B

Abstract

A micromechanical device (1 a), in particular a micromirror device, is proposed, which has at least one first micromechanical component (2 a) and one second micromechanical component (3 a). The first component (2 a) and the second component (3 a) are directly or indirectly connected to each other. The first micromechanical component (2 a) has a first sub-body (4 a) and at least one second sub-body (5 a). The first sub-body (4 a) extends in a first plane (20 a) and the second sub-body (5 a) extends in a second plane (21 a) different from the first plane (20 a). The first plane (20 a) and the second plane (21 a) extend parallel to each other, and the first plane (20 a) extends above the second plane (21 a). The second sub-body (5 a) is arranged in the transition region to the second micromechanical component (3 a). The second extension (26 a) of the second sub-body (5 a) in the longitudinal direction is larger than the first extension (25 a) of the first sub-body (4 a) in the longitudinal direction.

Inventors

  • SCHARY TIMO
  • J. Thomasco
  • K. Dessel
  • F. Sartz

Assignees

  • 罗伯特·博世有限公司

Dates

Publication Date
20260508
Application Date
20210528
Priority Date
20200702

Claims (20)

  1. 1. Micromechanical device (1 a,1b,1 c), having at least: -a first micromechanical component (2 a,2b,2 c), and A second micromechanical component (3 a,3b,3 c), Wherein the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) are connected to each other directly or indirectly, wherein the first micromechanical component (2 a,2b,2 c) has a first sub-body (4 a,4b,4 c) and at least one second sub-body (5 a,5b,5 c), wherein the first sub-body (4 a,4b,4 c) extends in a first plane (20 a), the second sub-body (5 a,5b,5 c) extends in a second plane (21 a) which is different from the first plane (20 a), wherein the first plane (20 a) and the second plane (21 a) extend parallel to each other, wherein the first plane (20 a) extends above the second plane (21 a), wherein the second sub-body (5 a,5b,5 c) is arranged in a transition region (25 a, 255 c) in the longitudinal direction of the second micromechanical component (3 a, 255 b, 255 c) in the longitudinal direction (25 a, 255 c).
  2. 2. Micromechanical device (1 a,1b,1 c) according to claim 1, characterized in that the second micromechanical component (3 a,3b,3 c) is arranged in a third plane (22 a) of the micromechanical device (1 a,1b,1 c), which is different from the first plane (20 a) and the second plane (21 a), wherein the third plane (22 a) runs parallel to the first plane (20 a) and the second plane (21 a).
  3. 3. Micromechanical device (1 a,1b,1 c) according to claim 1, characterized in that the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) are composed of silicon in one piece.
  4. 4. A micromechanical device (1 a,1b,1 c) according to claim 3, characterized in that the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) is at least partially directly adjoining the second micromechanical component (3 a,3b,3 c).
  5. 5. The micromechanical device (1 a,1b,1 c) according to any of claims 1 or 2, characterized in that the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) are composed of silicon, wherein the micromechanical device (1 a,1b,1 c) additionally has at least one silicon dioxide layer (7 a,7b,7 c), the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) being connected by means of the silicon dioxide layer (7 a,7b,7 c).
  6. 6. Micromechanical device (1 a,1b,1 c) according to claim 5, characterized in that the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) is at least partially directly adjacent to the silicon dioxide layer (7 a,7b,7 c).
  7. 7. The micromechanical device (1 a,1b,1 c) according to any of claims 1 to 4, characterized in that the micromechanical device (1 a,1b,1 c) is configured as a micromirror device, wherein the first micromechanical component (2 a,2b,2 c) is configured as a micromirror and the second micromechanical component (3 a,3b,3 c) is configured as an elastic spring element.
  8. 8. Micromechanical device (1 a,1b,1 c) according to any of the claims 1 to 4, characterized in that the shape of the second sub-body (5 a,5b,5 c) in the longitudinal direction and/or the second extension (26 a,26b,26 c) and/or the height of the second sub-body (5 a,5b,5 c) are selected according to a predetermined mechanical stress distribution of the micromechanical device (1 a,1b,1 c).
  9. 9. The micromechanical device (1 a,1b,1 c) according to any of claims 1 to 4, characterized in that the first sub-body (4 a,4b,4 c) and the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) each have a rectangular cross section.
  10. 10. Micromechanical device (1 a,1b,1 c) according to claim 2, characterized in that the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) has a first sub-face (30 b,30 c) which extends at least partially in a fourth plane, wherein the fourth plane extends obliquely to the first plane (20 a) and/or the second plane (21 a) and/or the third plane (22 a).
  11. 11. Micromechanical device (1 a,1b,1 c) according to claim 2, characterized in that the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) has a second sub-face (9 a,9b,9 c) which extends in a fifth plane (23 a), wherein the fifth plane (23 a) extends parallel to the first plane (20 a) and/or the second plane (21 a) and/or the third plane (22 a).
  12. 12. Micromechanical device (1 a,1b,1 c) according to claim 11, characterized in that the longitudinal extension (34 a) of the second sub-face (9 a,9b,9 c) of the second sub-body (5 a,5b,5 c) is greater than the height (33 a) of the second sub-body (5 a,5b,5 c).
  13. 13. Micromechanical device (1 a,1b,1 c) according to any of claims 1 to 4, characterized in that the height (33 b) of the first sub-body (4 a,4b,4 c) is greater than the height (33 a) of the second sub-body (5 a,5b,5 c).
  14. 14. Micromechanical device (1 a,1b,1 c) according to claim 13, characterized in that the height (33 a) of the second sub-body (5 a,5b,5 c) and the height (33 b) of the first sub-body (4 a,4b,4 c) are at least 1:10.
  15. 15. Micromechanical device (1 a,1b,1 c) according to claim 1, characterized in that the second extension (26 a,26b,26 c) of the second sub-body (5 a,5b,5 c) in the second plane (21 a) in the longitudinal direction is larger than the first extension (25 a,25b,25 c) of the first sub-body (4 a,4b,4 c) in the first plane (20 a) in the longitudinal direction.
  16. 16. A micromechanical device (1 a,1b,1 c) according to claim 3, characterized in that the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) consist of crystalline silicon in one piece.
  17. 17. Micromechanical device (1 a,1b,1 c) according to claim 4, characterized in that the underside of the second sub-body (5 a,5b,5 c) of the first micromechanical component (2 a,2b,2 c) is at least partially directly adjoining the second micromechanical component (3 a,3b,3 c).
  18. 18. Micromechanical device (1 a,1b,1 c) according to claim 5, characterized in that the first micromechanical component (2 a,2b,2 c) and the second micromechanical component (3 a,3b,3 c) are connected in a material-locking manner by means of the silicon dioxide layer (7 a,7b,7 c).
  19. 19. Micromechanical device (1 a,1b,1 c) according to claim 11, characterized in that a fifth plane (23 a) is configured as a separation plane of the first sub-body (4 a,4b,4 c) and the second sub-body (5 a,5b,5 c).
  20. 20. Micromechanical device (1 a,1b,1 c) according to claim 13, characterized in that the total height of the first sub-body (4 a,4b,4 c) is greater than the total height of the second sub-body (5 a,5b,5 c).

Description

Micromechanical device Technical Field The present invention relates to a micromechanical device, in particular a micromirror device, and to a method for producing a micromechanical device. Background From document US 2018/0307038 A1 a micromirror device is known as micromechanical device, wherein the mirror plate and the spring element are arranged in different planes parallel to one another and are connected to one another by further elements in the middle plane. Whereby the dynamic deformation of the mirror element should be reduced. The problem that arises here is that, at the right-angle transition from the mirror plate to the connecting element, stress peaks occur locally in the event of a deflection of the mirror, which can lead to a fracture of the component in the edge. Based on this prior art, the object of the present invention is to develop a micromechanical device that is more stable with respect to dynamic loading. Disclosure of Invention To solve this object, a micromechanical device according to claim 1 and a method for producing a micromechanical device according to claim 15 are proposed. Micromechanical devices represent in particular micromirror devices. Alternatively, the micromechanical device is in particular configured as a micromechanical pressure sensor or a micromechanical inertial sensor or a micromechanical pump. The micromechanical device has at least a first micromechanical component and a second micromechanical component. The first and second components are directly or indirectly connected to each other. Preferably, the first and/or the second micromechanical component is made of a semiconductor material, in particular silicon. The first micromechanical component has a first sub-body and at least one second sub-body. The first micromechanical component is in particular integrally formed. The first sub-body extends in a first plane and the second sub-body extends in a second plane, which is different from the first plane. The first plane and the second plane extend parallel to each other, wherein the first plane extends above the second plane. In particular, the first plane and the second plane are horizontally extending planes. In particular, the first sub-body and the second sub-body are separated from each other along a separation plane, in particular a horizontal separation plane. The second sub-body is arranged in a transition region to the second micromechanical component. The transition region here represents in particular an indirect or direct connection region of the first micromechanical component to the second micromechanical component. The second extension of the second sub-body in the longitudinal direction, in particular in the second plane, is greater than the first extension of the first sub-body in the longitudinal direction, in particular in the first plane. The extension in the longitudinal direction of the respective sub-body is here in particular the distance from the outer edge to the outer edge of the first and second sub-body in the horizontal direction. Preferably, the first sub-region and the second sub-region overlap at least partially, and a resulting step between the first sub-body and the second sub-body protruding towards the outside causes a division of the dynamic load occurring to the two edges. Thus, the micromechanical device withstands higher dynamic loads. Preferably, the first sub-body is arranged centrally above the second sub-body. Preferably, the second micromechanical component is arranged in a third plane of the micromechanical device, which is different from the first plane and the second plane. The third plane here runs parallel to the first plane and the second plane. The second micromechanical component thus has a carrier function for the first micromechanical component. Preferably, the first micromechanical component and the second micromechanical component are formed in one piece from silicon, in particular crystalline silicon. In this case, the second sub-body of the first micromechanical component is at least partially directly adjacent to the second micromechanical component. In the transition region between the first micromechanical component and the second micromechanical component, the two micromechanical components are accordingly not separated from one another in terms of material. Such a micromechanical device has the advantage in terms of production technology that only a single, in particular plate-shaped, silicon substrate is required for production. Alternatively, the first micromechanical component and the second micromechanical component are preferably made of silicon. The micromechanical device additionally has at least one silicon dioxide layer. The first micromechanical component and the second micromechanical component are connected, in particular in a material-locking manner, by means of a silicon dioxide layer. Preferably, the second sub-body of the first micromechanical component is at least partially direc