CN-115752747-B - Bionic infrared sensor

Abstract

The application discloses a bionic infrared sensor. The bionic infrared sensor comprises a Fresnel lens structure, a bionic thermal expansion bag and a bionic flexible strain sensor, wherein the Fresnel lens is used for converging infrared light, the bionic thermal expansion is used for containing thermal expansion liquid, the thermal expansion liquid is used for absorbing infrared light converged by the Fresnel lens structure and converting infrared heat into liquid expansion, and the bionic flexible strain sensor is used for converting strain caused by the liquid thermal expansion into an electric signal to be read. The bionic infrared sensor is prepared from solid-liquid multi-materials, combines a bionic structure, realizes infrared sensing through thermal expansion, and has the characteristics of high efficiency, simplicity, low cost, intelligence and the like.

Inventors

• CHEN DAOBING
• XUE LONGJIAN
• Lei Daifeng
• Xiao Kangjian
• LI GANG
• LIU HONGTAO
• LIU SHENG

Assignees

• 武汉大学

Dates

Publication Date

20260512

Application Date

20221205

Claims (8)

1. 1. The bionic infrared sensor is characterized by comprising a Fresnel lens structure, a bionic thermal expansion bag and a bionic flexible strain sensor; the bionic thermal expansion bag is made of flexible materials and is used for containing thermal expansion liquid, and the thermal expansion liquid is used for absorbing infrared rays converged by the Fresnel lens structure and converting infrared heat into liquid expansion; the bionic thermal expansion bag comprises a bionic thermal expansion bag body, a bionic flexible strain sensor, a transparent rigid cover, a transparent flexible strain sensor, a liquid expansion device and a liquid expansion device, wherein the transparent rigid cover is used for limiting the expansion direction of the bionic thermal expansion bag, the upper half part of the bionic thermal expansion bag is fixed by the transparent rigid cover, the lower half part of the bionic thermal expansion bag is an expandable area which is not fixed by the transparent rigid cover, the bionic flexible strain sensor is attached to the lower half part of the bionic thermal expansion bag, strain of the liquid expansion device is converted into strain of the bionic flexible strain sensor through the strain of the lower half part of the bionic thermal expansion bag, and the bionic flexible strain sensor converts a strain signal into an electric signal.
2. 2. The biomimetic infrared sensor of claim 1, further comprising a heat dissipation chamber for transferring and dissipating heat.
3. 3. The biomimetic infrared sensor of claim 1, wherein the thermal expansion fluid is a liquid metal material, a polymer material containing C-H and O-H chemical groups, and mixtures thereof.
4. 4. A biomimetic infrared sensor according to claim 3, wherein said liquid metal material is mercury, gallium alloy.
5. 5. The bionic infrared sensor according to claim 1, wherein the bionic flexible strain sensor is made of conductive ink or conductive polymer material.
6. 6. The bionic infrared sensor according to claim 5, wherein the conductive polymer material is formed by compounding at least one selected from graphene, carbon nanotubes, carbon black, gold silver copper nanoparticles, and at least one selected from polylactic acid, TPU, silica gel, and latex.
7. 7. The biomimetic infrared sensor according to claim 1, wherein the fresnel lens structure comprises a combination of more than two layers of fresnel lens units, and the focal lengths of different fresnel lens units are the same.
8. 8. The biomimetic infrared sensor according to claim 1, wherein the biomimetic flexible strain sensor has micro-nano level groove structures, corrugated structures, prismatic island structures or pyramid island structures, the spacing between the micro-nano level groove structures is not more than 2 μm, and the front-back spacing and the left-right spacing of the island structures are respectively not more than 2 μm and not more than 10 μm.

Description

Bionic infrared sensor Technical Field The application relates to the technical field of sensors, in particular to a bionic infrared sensor. Background Infrared sensors are conventionally classified into thermal detectors (based on thermal effects) and photon detectors (based on photoelectric effects) according to detection mechanisms. The advantages of the heat type are that it can be operated at normal temperature, no wavelength dependence, low cost, easy miniaturization, etc., and the disadvantages are low sensitivity, slow response, low sensitivity, etc. The advantages of the photon type are high sensitivity, rapid response, high sensitivity, etc., and the disadvantages are cooling (liquid nitrogen), wavelength dependence, high price, complex equipment, difficult miniaturization, etc. With one key parameter of the sensitivity threshold of the infrared sensor, the sensitivity threshold of most of the thermal infrared sensors on the market is lower than 2×10 -4W m-2, which can not meet the requirement of the intelligent equipment on the infrared sensor, and the photon type infrared sensor with higher sensitivity has huge volume and can not be miniaturized and miniaturized. Therefore, how to realize the infrared sensor with high sensitivity and miniaturization is a scientific problem to be solved in the field of infrared sensors. The living and reproduction competition of the living beings in billions applies the natural law to the extreme, develops various excellent perception functions, brings inspiration to the development of the human sensing technology, and also provides a natural blue book for the engineering bionic high-performance sensor. In the aspect of an infrared sensing system, a near-perfect infrared sensing organ is evolved by biology, for example, research shows that the sensitivity threshold of an infrared sensor of a part of fire-trace insects is estimated to be 3×10 -9W m-2～2×10-7W m-2, and the sensitivity of the infrared sensor far exceeds that of the existing thermal infrared sensor, and meanwhile, the infrared sensor has the advantages of small volume, miniaturization, high efficiency and the like. Therefore, the bionic infrared sensor has the advantages of small size, microminiaturization, high sensitivity and the like. Disclosure of Invention In view of the above, the present application provides a bionic infrared sensor capable of improving sensitivity. The application provides a bionic infrared sensor, which comprises a Fresnel lens structure, a bionic thermal expansion bag and a bionic flexible strain sensor, wherein the Fresnel lens structure is arranged on the Fresnel lens structure; The Fresnel lens is used for converging infrared light, the bionic thermal expansion is used for containing thermal expansion liquid, the thermal expansion liquid is used for absorbing the infrared light converged by the Fresnel lens structure and converting infrared heat into liquid expansion, and the bionic flexible strain sensor is used for converting strain caused by the liquid thermal expansion into an electric signal to be read. Optionally, a transparent rigid cover is also included to limit the direction of expansion of the thermal expansion bladder. Optionally, a heat dissipation cavity is further included for transferring and dissipating heat. Optionally, the thermal expansion liquid is a liquid metal material, a polymer material containing C-H and O-H chemical groups, or a mixture thereof. Optionally, the liquid metal material is mercury, gallium alloy. Optionally, the bionic flexible strain sensor is made of conductive ink or conductive polymer material. Optionally, the conductive polymer material is formed by compounding at least one selected from graphene, carbon nanotubes, carbon black and gold, silver and copper nanoparticles with at least one selected from polylactic acid, TPU, silica gel and latex. Optionally, the bionic thermal expansion bag is made of flexible materials. Optionally, the fresnel lens structure comprises more than two layers of fresnel lens units, and the focal lengths of the different fresnel lens units are the same. Optionally, the bionic flexible strain sensor is provided with a micro-nano-level groove structure, a corrugated structure, a prismatic island structure or a pyramid island structure, the distance between the micro-nano-level grooves is not more than 2 μm, and the front-back distance and the left-right distance of the island structure are respectively not more than 2 μm and not more than 10 μm. The bionic infrared sensor disclosed by the application converts infrared signals in a mode of infrared light, heat, mechanical strain and electric signals, and has the characteristics of high efficiency, simplicity, low cost, intellectualization and the like. Drawings The technical solution and other advantageous effects of the present application will be made apparent by the following detailed description of the specific embodiments of the present application