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CN-115775762-B - Electrostatic chuck with multiple heating area structures

CN115775762BCN 115775762 BCN115775762 BCN 115775762BCN-115775762-B

Abstract

The invention relates to an electrostatic chuck with a structure of a plurality of heating areas. The electrostatic chuck of the plurality of heating structures comprises a plurality of micro-multi-heater zones (11_1 to 11_n), each micro-multi-heater zone being individually controllable by heating by a heating element, a switching module (13) comprising individual switching means (14_1 to 14_n) connected to each of the plurality of micro-multi-heater zones (11_1 to 11_n), and a switching control module (15) controlling the operation of the switching module (13), wherein different parts of a wafer fixed to the electrostatic chuck are individually heated by each micro-multi-heater zone (11_1 to 11_n).

Inventors

  • Cui Youying
  • LI XIANGYU

Assignees

  • 自适应等离子体技术公司

Dates

Publication Date
20260505
Application Date
20210907

Claims (5)

  1. 1. An electrostatic chuck of a multiple heating zone configuration, comprising: a plurality of micro multi-heater zones (11_1 to 11_n), each micro multi-heater zone being individually heated by a heating element; A switch module (13) comprising individual switching means (14_1 to 14_N) connected to each of the plurality of micro multi-heater zones (11_1 to 11_N), and A switch control module (15) for controlling the operation of the switch module (13), Different portions of the wafer secured to the electrostatic chuck are independently heated by each of the micro-multi-heater regions (11_1 to 11_n), The electrostatic chuck further comprises AC heater regions (21_1 to 21_L) disposed inside a ceramic layer (42) formed over the micro multi-heater regions (11_1 to 11_N), A groove or a receiving space is formed in an upper portion of an operation body (41) made of an aluminum material and formed with a Cooling Line (CL) inside, a micro multi-area plate (43) is provided separately from a bottom surface of a heating adjustment area (RA) formed in a structure protruding upward of the operation body (41) through a partition wall (411), The micro multi-heater areas (11_1 to 11_N) are arranged on the upper surface of the micro multi-area board (43), and an optical communication circuit module (44), a driving module (45) and a power circuit module (46) for transmitting control information of each multi-heater area (11_1 to 11_N) are arranged on the lower surface of the micro multi-area board (43).
  2. 2. The electrostatic chuck of claim 1, wherein the plurality of heating zone structures, The AC heater regions (21_1 to 21_l) are provided with 2 to 50, and the operation is controlled by each semiconductor switch (22_1 to 22_l).
  3. 3. The electrostatic chuck of a multiple heating zone configuration of claim 1, further comprising: a temperature sensor for detecting the temperature of each AC heater region (21_1 to 21_l).
  4. 4. The electrostatic chuck of claim 1, wherein the plurality of heating zone structures, The micro multi-heater areas (11_1 to 11_n) are provided with 50 to 500.
  5. 5. The electrostatic chuck of claim 1, wherein the plurality of heating zone structures, The interior of the heating adjustment area (RA) is filled with a hot glue.

Description

Electrostatic chuck with multiple heating area structures Technical Field The present invention relates to an electrostatic chuck of a multiple heating zone structure, and more particularly, to an electrostatic chuck of a multiple heating zone structure formed with multiple heating zones divided from each other so that each zone can be individually heated and controlled. Background An electrostatic chuck (electrostatic chuck) used during an etching process, which is one of semiconductor manufacturing processes, may have a wafer clamping function (wafer clamping) and a temperature control function (temperature controlling). During the etching process, it is necessary to maintain a uniform temperature of the wafer to ensure process uniformity, so that process yield can be improved. To ensure such temperature uniformity of the electrostatic chuck, the temperature of the electrostatic chuck (ESC) needs to be controlled, for which international publication No. WO 2011/049620 discloses a heating plate having a flat heater area for semiconductor processing. In addition, WO 2013/049589 discloses an electrostatic chuck for controlling temperature in a process chamber. In order to maintain uniform temperature characteristics of the wafer, it is necessary to control the temperature of an electrostatic chuck for fixing the wafer, and a heating device may be provided at an insulating layer formed at an upper portion of the electrostatic chuck to control the temperature. However, it is difficult to uniformly control the temperature of the entire electrostatic chuck or the entire wafer by such a heating device. By heating by such heating means, temperature deviations may occur between different parts of the wafer and compensation for such local temperature deviations is required. For this reason, the electrostatic chuck in contact with the wafer is divided into a plurality of regions, and temperature control is required for each region individually. In addition, a method is also required to be formulated so that the device for temperature control does not affect the process. However, the prior art does not disclose such a technique. The present invention is directed to solving the problems occurring in the prior art and has the following objects. Prior art literature Patent literature Prior art 1 International publication No. WO 2011/049620 (lamb research company, 2011.04.28 discloses a heating plate having a flat heater region for semiconductor processing, Prior art 2 International publication No. WO 2013/049589 (applied materials Co., ltd., 2013.04.04 discloses) has an electrostatic chuck with temperature control. Disclosure of Invention First, the technical problem to be solved The invention aims to provide an electrostatic chuck with a structure of a plurality of heating areas, which can control the overall temperature distribution of the electrostatic chuck by independently controlling the temperature of each area divided into a plurality of areas. (II) technical scheme According to a preferred embodiment of the present invention, an electrostatic chuck of a multiple heating zone configuration includes a plurality of micro-multi-heater zones, each of which can be individually heated by a heating element, a switching module including individual switching devices connected to each of the plurality of micro-multi-heater zones, and a switching control module controlling operation of the switching module, wherein different portions of a wafer secured to the electrostatic chuck are individually heated by each of the micro-multi-heater zones. According to another preferred embodiment of the present invention, there is further provided an AC heater region disposed on the ceramic layer formed over the micro multi-heater region, wherein the AC heater region is provided with 2 to 50 and the operation is controlled by each semiconductor switch. According to another preferred embodiment of the present invention, the micro multi-heater zones are provided in a micro multi-zone plate. According to still another preferred embodiment of the present invention, the micro multi-zone plate is disposed inside a heating adjustment zone formed on the operation body of the metal material. According to yet another preferred embodiment of the present invention, further comprising a temperature sensor detecting the temperature of each AC heater zone. According to still another preferred embodiment of the present invention, an optical communication circuit module, a driving module, and a power circuit module that transmit control information of each heater region are provided in the micro multi-region board. According to a further preferred embodiment of the invention, the mini-multiple heater zones are provided with 50 to 500. According to a further preferred embodiment of the invention, the operating body is made of an aluminum material. According to yet another preferred embodiment of the present invention, further comprising a cooling line fo