CN-115793803-B - Immersed cooling system and cooling device

Abstract

The utility model relates to an immersion cooling system and cooling device, cooling device includes box, heat dissipation module and cooling module. The cooling module comprises a cooling plate and a cooling fin group, the cooling plate covers the opening of the box body, the cooling plate is provided with a cooling channel, the cooling channel is arranged on the cooling plate and comprises an inlet and an outlet, the inlet and the outlet are respectively positioned on two sides of the cooling plate, one side of the cooling fin group is contacted with the surface of the cooling plate, and the other side of the cooling fin group is positioned in the box body. With the structure, the usage amount of the heat transfer fluid injected into the box body is lower than that of the traditional immersed cooling device.

Inventors

• CHEN HUA
• LIN SHENGYAN
• LIANG QUANYI

Assignees

• 纬创资通股份有限公司

Dates

Publication Date

20260505

Application Date

20211025

Priority Date

20210909

Claims (20)

1. 1. An immersion cooling system, comprising: a box body, which comprises an opening for communicating the box body to the outside of the box body; a heat transfer fluid located in the case; A heat dissipation module in the box body, and The cooling module comprises a cooling plate and a radiating fin group, the cooling plate covers the opening, the cooling plate is provided with a cooling channel, the cooling channel is arranged on the cooling plate, the cooling channel comprises an inlet and an outlet, the inlet and the outlet are respectively positioned at two sides of the cooling plate, one side of the radiating fin group contacts the cooling plate, and the other side of the radiating fin group is positioned in the box body; the heat dissipation module and the heat dissipation fin group are respectively positioned in the separation areas, and the heat transfer fluid in each separation area is conveyed in opposite flow directions.
2. 2. A submerged cooling system according to claim 1, further comprising a fluid conveying device, an outlet of the fluid conveying device facing the heat dissipating module, the fluid generated at the outlet of the fluid conveying device flowing towards the heat dissipating module.
3. 3. The submerged cooling system of claim 2, wherein the fluid delivery device is positioned at the deflector that separates the heat dissipating module from the set of heat dissipating fins.
4. 4. A submerged cooling system according to claim 3, wherein the deflector has a turn arranged at or adjacent to the outlet of the fluid conveying means.
5. 5. The submerged cooling system of claim 4, wherein the turning part is a straight vertical plate, the straight vertical plate is parallel to the surface of the fluid transporting device, or the turning part is an inclined plate, and an included angle is formed between the inclined plate and the surface of the fluid transporting device, and the included angle is smaller than 90 degrees.
6. 6. A submerged cooling system according to claim 3, further comprising a plurality of fluid conveying devices, wherein each of the fluid conveying devices is arranged in two groups opposite to each other and on two sides in the tank, the outlet of each of the fluid conveying devices faces the heat dissipating module and the heat dissipating fin group, and the fluid flow direction generated at the outlet of each of the fluid conveying devices is conveyed to the heat dissipating module and the heat dissipating fin group.
7. 7. A submerged cooling system according to claim 6, further comprising a plurality of heat dissipating modules, wherein the outlet of each of the fluid transporting devices faces each of the heat dissipating modules and directs the heat transfer fluid to each of the heat dissipating modules.
8. 8. The submerged cooling system of claim 6, wherein the flow guiding member comprises a plurality of flow guiding plates, each of the flow guiding plates being adjacent to the outlet of each of the fluid transporting devices, each of the flow guiding plates being configured to guide the heat transfer fluid transported by each of the fluid transporting devices to the heat dissipating module and the heat dissipating fin set, each of the flow guiding plates being an inclined plate, each of the inclined plates having an angle with respect to a surface of each of the fluid transporting devices, each of the angles being less than 90 degrees.
9. 9. The submerged cooling system of claim 8, further comprising a circuit board and a plurality of electronic components, wherein each of the electronic components is disposed on the circuit board, the circuit board is disposed in the housing, and each of the heat dissipation modules is respectively coupled to each of the electronic components.
10. 10. The submerged cooling system of claim 2, further comprising a circuit board and a cpu, wherein the cpu is disposed on the circuit board, the circuit board is disposed in the tank, and the heat dissipation module is coupled to the cpu.
11. 11. The immersion cooling system according to claim 10, further comprising a plurality of expansion elements, each expansion element being disposed on the circuit board and located on a side of the cpu.
12. 12. A submerged cooling system according to claim 10, wherein the heat dissipating module comprises a base and a plurality of heat dissipating fins, each of the heat dissipating fins being disposed on the base, the base comprising a plurality of baffles, each of the baffles being disposed on two sides of each of the heat dissipating fins, each of the baffles having a thickness greater than a thickness of each of the heat dissipating fins, the base and each of the heat dissipating fins being integrally formed as a one-piece member or the base and each of the heat dissipating fins being separately formed as two-piece members.
13. 13. The submerged cooling system of claim 12, wherein the base has a plurality of locking members, each of the cooling fins is arranged on the base in a cross-shaped arrangement, and each of the locking members is locked around the cooling fins and is locked to the circuit board.
14. 14. A submerged cooling system according to claim 12, wherein the thickness of each of the cooling fins is in the range of between 0.8mm and 1.2mm and the distance between each of the cooling fins is in the range of between 2.8mm and 3.6 mm.
15. 15. The submerged cooling system of claim 12, wherein a long side of each of the heat sinks and a long side of the heat sink group are parallel to the direction of flow of the heat transfer fluid, and each of the heat transfer fluid passes between each of the heat sinks and the heat sink group.
16. 16. A submerged cooling system according to claim 2, wherein the cooling channel comprises a flow channel arranged in the cooling plate in a continuous S-shaped manner, the inlet being located at one side of the cooling plate and connected to the flow channel, and the outlet being located at the other side of the cooling plate and connected to the flow channel.
17. 17. A cooling device, comprising: a box body, which comprises an opening for communicating the box body to the outside of the box body; A heat dissipation module in the box body, and The cooling module comprises a cooling plate and a radiating fin group, the cooling plate covers the opening, the cooling plate is provided with a cooling channel, the cooling channel is arranged on the cooling plate, the cooling channel comprises an inlet and an outlet, the inlet and the outlet are respectively positioned at two sides of the cooling plate, one side of the radiating fin group contacts the cooling plate, and the other side of the radiating fin group is positioned in the box body; the heat dissipation module and the heat dissipation fin group are respectively positioned in the separation areas, and the heat transfer fluid in each separation area is conveyed in opposite flow directions.
18. 18. The cooling device of claim 17, further comprising a fluid delivery device having an outlet facing the heat dissipating module, the fluid generated at the outlet of the fluid delivery device flowing toward the heat dissipating module, the fluid delivery device being positioned on the baffle separating the heat dissipating module from the set of heat dissipating fins.
19. 19. A cooling apparatus adapted to contain a heat transfer fluid, the cooling apparatus comprising: a box body, including an opening for connecting the interior of the box body to the exterior of the box body, the heat transfer fluid being positioned in the box body; A heat dissipation module in the box body, and The cooling module comprises a cooling plate and a radiating fin group, the cooling plate covers the opening, the cooling plate is provided with a cooling channel, the cooling channel is arranged on the cooling plate, the cooling channel comprises an inlet and an outlet, the inlet and the outlet are respectively positioned at two sides of the cooling plate, one side of the radiating fin group contacts the cooling plate, and the other side of the radiating fin group is positioned in the box body; the heat dissipation module and the heat dissipation fin group are respectively positioned in the separation areas, and the heat transfer fluid in each separation area is conveyed in opposite flow directions.
20. 20. The cooling device of claim 19, further comprising a fluid delivery device having an outlet facing the heat sink module, the fluid generated at the outlet of the fluid delivery device flowing toward the heat sink module, the fluid delivery device being positioned on the baffle separating the heat sink module from the set of heat sink fins.

Description

Immersed cooling system and cooling device Technical Field The present disclosure relates to cooling systems, and particularly to an immersion cooling system and a cooling device. Background With the rapid development of server efficiency, the server generates a large amount of heat energy during operation, so as to avoid poor server operation efficiency caused by accumulation of heat energy, the main board in the server is generally soaked in a heat dissipation liquid, the heat energy generated by a heating component on the main board is absorbed by the heat dissipation liquid, and the heat dissipation liquid circulates to the outside of a box body of the server to exchange heat with water or air, so that the heat dissipation liquid amount required by the heat exchange mode is large, and leakage is easy to cause when entering and exiting the box body. Disclosure of Invention According to some embodiments, an immersion cooling system includes a tank, a heat transfer fluid, a heat dissipating module, and a cooling module. The box body comprises an opening, and the opening is used for communicating the box body to the outside of the box body. The heat transfer fluid is located in the tank. The heat dissipation module is located in the box body. The cooling module comprises a cooling plate and a cooling fin group, the cooling plate covers the opening, the cooling plate is provided with a cooling channel, the cooling channel is arranged on the cooling plate, the cooling channel comprises an inlet and an outlet, the inlet and the outlet are respectively positioned at two sides of the cooling plate, one side of the cooling fin group is contacted with the cooling plate, and the other side of the cooling fin group is positioned in the box body. In some embodiments, the submerged cooling system further comprises a fluid delivery device having an outlet facing the heat dissipating module, the fluid generated at the outlet of the fluid delivery device flowing toward the heat dissipating module. In some embodiments, the submerged cooling system further includes a flow guiding member located in the tank, the flow guiding member having a flow guiding plate that forms two separate areas in the tank, the fluid conveying device being located in the flow guiding plate, the flow guiding plate separating the heat dissipating module from the heat dissipating fin set, the heat dissipating module and the heat dissipating fin set being located in separate areas, respectively, the heat transfer fluid in the separate areas being conveyed in opposite flow directions. In some embodiments, the baffle has a turn disposed at or adjacent to the outlet of the fluid delivery device. In some embodiments, the turning portion is a vertical plate, the vertical plate is parallel to the surface of the fluid delivery device, or the turning portion is an inclined plate, and an included angle is formed between the inclined plate and the surface of the fluid delivery device, and the included angle is smaller than 90 degrees. In some embodiments, the immersion cooling device further includes a plurality of fluid delivery devices, each of the fluid delivery devices is disposed in two sets opposite to each other and arranged on two sides of the housing, and an outlet of each of the fluid delivery devices faces the heat dissipation module and the heat dissipation fin set, respectively, and a fluid flow direction generated at the outlet of each of the fluid delivery devices is delivered to the heat dissipation module and the heat dissipation fin set, respectively. In some embodiments, the submerged cooling device further comprises a plurality of heat dissipating modules, and the outlet of each fluid delivery device faces each heat dissipating module and directs the heat transfer fluid to each heat dissipating module. In some embodiments, the flow guiding member has a plurality of flow guiding plates, each of the flow guiding plates is located at an outlet of each of the fluid conveying devices, each of the flow guiding plates is used for guiding the heat transfer fluid conveyed by each of the fluid conveying devices to the heat dissipating module and the heat dissipating fin set, each of the flow guiding plates is an inclined flat plate, and each of the inclined flat plates has an included angle with a surface of each of the fluid conveying devices, and each of the included angles is smaller than 90 degrees. In some embodiments, the immersion cooling apparatus further includes a circuit board and a plurality of electronic components, each of the electronic components is disposed on the circuit board, the circuit board is disposed in the case, and each of the heat dissipation modules is respectively coupled to each of the electronic components. In some embodiments, the submerged cooling device further includes a circuit board and a central processing unit, the central processing unit is disposed on the circuit board, the circuit board is disposed in the bo