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CN-115815729-B - Reflow oven airflow circulation assembly

CN115815729BCN 115815729 BCN115815729 BCN 115815729BCN-115815729-B

Abstract

The invention belongs to the technical field of reflow soldering, and discloses an airflow circulation assembly of a reflow soldering furnace, which comprises a main body of the reflow soldering device, wherein an inlet chain wheel driven device is fixedly arranged on one side of the top of the main body of the reflow soldering device; according to the invention, the purpose of uniformly heating the PCB is achieved by arranging the wind shield, the exhaust hole, the centralized guide plate and the like, the PCB is preheated by the exhaust groove and the exhaust hole, the temperature of exhaust air between two exhaust bins of the PCB gradually rises in the moving process until the PCB moves to the middle part between the two exhaust bins, the air at the left end and the right end of the inside of the exhaust bin is respectively exhausted through the middle parts of the inner sides of the two exhaust bins under the guidance of the centralized guide plate, the solder paste on the surface of the PCB is melted, the components are connected with the PCB, the PCB is heated more uniformly, the PCB is gradually heated, the stability of the solder paste is increased, and the effect of uniformly heating the PCB is achieved.

Inventors

  • SHI JUN

Assignees

  • 苏州利亚得智能装备有限公司

Dates

Publication Date
20260508
Application Date
20221118

Claims (10)

  1. 1. The reflow oven airflow circulation assembly comprises a reflow oven main body (1) and is characterized in that an inlet chain wheel driven device (2) is fixedly arranged on one side of the top of the reflow oven main body (1), a first wind shielding curtain box (3) is fixedly arranged on one side of the top of the reflow oven main body (1) away from the inlet chain wheel driven device (2), a wind direction guide assembly (12) is fixedly arranged on the top of the interior of the reflow oven main body (1), a control host (4) is fixedly arranged on the front surface of the reflow oven main body (1), a link area (5) is fixedly arranged on one side of the top of the reflow oven main body (1) away from the wind direction guide assembly (12), a cooling area (7) is fixedly arranged on one side of the top of the reflow oven main body (1) away from the link area (5), a second wind shielding curtain box (8) is fixedly arranged on one side of the top of the reflow oven main body (1) away from the cooling area (7), and a driving mechanism (9) is fixedly arranged on one side of the top of the reflow oven main body (1) away from the second wind shielding curtain box (8); Wind direction guide subassembly (12) are including exhaust chute (121), hole for airing exhaust (122), concentrated guide board (123), deep bead (124), diffuser plate (125), bin for airing exhaust (126), inside bottom equidistance fixed mounting in bin for airing exhaust (126) has deep bead (124), exhaust chute (121) and hole for airing exhaust (122) have been seted up to one side equidistance in bin for airing exhaust (126) inside bottom of deep bead (124), the middle part fixed mounting at the inside top in bin for airing exhaust (126) has concentrated guide board (123), the bottom fixed mounting in bin for airing exhaust (126) has diffuser plate (125), the longitudinal middle axiality in bin for airing exhaust (121), hole for airing exhaust (122), deep bead (124), the top fixed mounting in bin for airing exhaust (126) has heating element (10), the top fixed mounting in bin for airing exhaust (126) has power component (6), the front fixed mounting in bin for airing exhaust (126) has circulating assembly (11), wind direction guide subassembly (12) symmetry respectively fixed mounting in inside top and bottom of reflow apparatus main part (1).
  2. 2. The reflow soldering furnace airflow circulating assembly according to claim 1, wherein the heating assembly (10) comprises a protective shell (101), a diversion bin (102), a guide bin (103), a heating plate (104) and a first guide plate (105), the top of the exhaust bin (126) is fixedly provided with the protective shell (101), one side of the protective shell (101) is fixedly provided with the diversion bin (102), one side of the diversion bin (102) is fixedly provided with the guide bin (103), the first guide plate (105) is fixedly arranged in the diversion bin (102), the heating plate (104) is fixedly arranged in the protective shell (101), and the heating assembly (10) is bilaterally symmetrical with the longitudinal middle axial surface of the exhaust bin (126).
  3. 3. The reflow soldering furnace airflow circulation assembly as set forth in claim 2, wherein the power assembly (6) comprises a transmission shaft (601), a motor (602), an air inlet (603), an electromagnetic valve (604), an impeller (605) and an oxygen detector (606), the motor (602) is fixedly arranged at the top of the air exhaust bin (126), the transmission shaft (601) is fixedly arranged at the output end of the motor (602), the impeller (605) is fixedly arranged at the outside of the transmission shaft (601), the air inlet (603) is fixedly arranged at the top of the protective shell (101), the electromagnetic valve (604) is fixedly arranged at the front of the air inlet (603), the oxygen detector (606) is fixedly arranged at the front of the air exhaust bin (126), and the power assembly (6) is bilaterally symmetrical with the longitudinal middle axial surface of the air exhaust bin (126).
  4. 4. The reflow soldering furnace airflow circulation assembly as set forth in claim 3, wherein the circulation assembly (11) comprises an air inlet bin (111), an air inlet pipe (112), an expansion plate (113) and a second guide plate (114), the air inlet bin (111) is fixedly installed at the left end and the right end of the front face of the air exhaust bin (126), the second guide plate (114) is fixedly installed in the air inlet bin (111), the air inlet pipe (112) is fixedly installed at the top of the air inlet bin (111), the expansion plate (113) is fixedly installed at the bottom of the air inlet bin (111), and the circulation assembly (11) is symmetrical front and back with the transverse central axis of the air exhaust bin (126).
  5. 5. The reflow soldering furnace airflow circulating assembly as set forth in claim 1, wherein the height of the wind deflector (124) increases gradually from the left and right ends to the middle, the top of the wind deflector (124) is arc-shaped, the left and right ends of the interior of the air exhaust bin (126) are arc-shaped, and the direction of the wind deflector (124) is opposite to the arc direction of the air exhaust bin (126).
  6. 6. The reflow soldering furnace airflow circulating assembly as set forth in claim 1, wherein the exhaust groove (121) and the exhaust hole (122) are located at one side of the wind shield (124), the sizes of the exhaust hole (122) and the exhaust groove (121) gradually decrease from the left end and the right end to the middle, the left side and the right side of the centralized guide plate (123) are concave, the centralized guide plate (123) is located at the middle of the top inside the exhaust bin (126), and the height of the centralized guide plate (123) is larger than the height inside the exhaust bin (126).
  7. 7. The reflow soldering furnace airflow circulating assembly as set forth in claim 2, wherein the guiding chambers (103) are respectively communicated with the left and right ends of the interior of the exhaust chamber (126), the guiding chambers (103) are respectively communicated with the distribution chambers (102), the distribution chambers (102) are respectively communicated with the interior of the protective shell (101), and rectangular holes are formed in the surface of the heating plate (104).
  8. 8. A reflow oven air flow circulation assembly in accordance with claim 4, wherein one side of the air inlet pipe (112) is in communication with the interior of the air inlet bin (111), and the other side of the air inlet pipe (112) is in communication with the interior of the protective housing (101) and is remote from the side of the impeller (605).
  9. 9. A reflow oven airflow circulation assembly in accordance with claim 3, wherein the impeller (605) is located inside the protective housing (101), the impeller (605) is turbine shaped, and the impeller (605) is located on one side of the heating plate (104).
  10. 10. A reflow oven airflow circulating assembly in accordance with claim 4, wherein the height of the bottom of the air inlet bin (111) is greater than the height of the bottom of the air exhaust bin (126), and the width of the second guide plate (114) gradually increases from bottom to top.

Description

Reflow oven airflow circulation assembly Technical Field The invention belongs to the technical field of reflow soldering, and particularly relates to an airflow circulation assembly of a reflow soldering furnace. Background The reflow soldering technology is mainly applied to the technical field of electronics, and air or nitrogen is heated to a high enough temperature through a heating circuit in the equipment and then blown to a circuit board on which components are already attached, so that solder on two sides of the components is melted and then bonded with a main board. With the development of the whole SMT technology becoming perfect, various SMC (surface mounted device) components and SMD (surface mounted device) appear, and reflow soldering process technology and equipment which are part of the mounting technology are correspondingly developed, so that the application of the technology is becoming widespread. The invention discloses a Chinese patent with publication number CN200910035695.6, which discloses an air outlet plate of a reflow soldering furnace, and aims to solve the problems that the reflow soldering furnace in the current market is only provided with a layer of air outlet plate at the top of an air outlet pipe, the main effect of the air outlet plate is to play a role in diversion, hot air flow is sprayed on a PCB plate through the air outlet pipe, and is rebounded, the air flow circulates to the top of the reflow soldering furnace from air passages at two sides, but the air flow for heating the PCB plate in the reflow soldering furnace is provided with the air flow with higher temperature directly sprayed from the air outlet pipe, and the air flow with lower temperature after the heating of the PCB plate is finished, so that the air flow in the reflow soldering furnace is also disordered, and the air flow is unevenly distributed. Above-mentioned reflow soldering air current circulation subassembly sets up a plurality of air exit generally, makes the air current even with the PCB board contact, but current reflow soldering air current circulation subassembly sets up the circulation air inlet around a plurality of air exits, because circulation air inlet is linked together with the gas vent, the in-process air current of admitting air can't fully contact with the PCB board, the air current just is absorbed by circulation subassembly, leads to the air current can't fully contact with the PCB board, leads to reducing PCB board heating efficiency, has increased the heating time simultaneously, increases PCB board reflow soldering cost. Disclosure of Invention In order to solve the problems in the prior art, the invention provides a reflow soldering furnace airflow circulation assembly, the impeller rotates at a high speed to exhaust air, air enters the reflow soldering device main body from the left end and the right end of the reflow soldering device main body, the air is guided by the wind shield at the left end to be discharged from the air exhaust groove and the air exhaust hole respectively to heat the top and the bottom of the PCB, the temperature of the air discharged between two air exhaust bins of the PCB in the moving process is gradually increased until the PCB moves to the middle part between the two air exhaust bins, solder paste on the surface of the PCB is melted, components and parts are connected with the PCB, so that the PCB is heated more uniformly, the PCB is gradually heated, the stability of the solder paste is increased, and the advantage of uniform heating of the PCB is achieved. In order to achieve the purpose, the invention provides the technical scheme that the reflow oven airflow circulation assembly comprises a reflow oven main body, wherein an inlet chain wheel driven device is fixedly arranged on one side of the top of the reflow oven main body, a first wind shielding curtain box is fixedly arranged on one side of the top of the reflow oven main body far away from the inlet chain wheel driven device, an airflow direction guide assembly is fixedly arranged on the top of the interior of the reflow oven main body, a control host is fixedly arranged on the front surface of the reflow oven main body, a link area is fixedly arranged on one side of the top of the reflow oven main body far away from the airflow direction guide assembly, a cooling area is fixedly arranged on one side of the top of the reflow oven main body far away from the link area, a second wind shielding curtain box is fixedly arranged on one side of the top of the reflow oven main body far away from the cooling area, and an outlet driving mechanism is fixedly arranged on one side of the top of the reflow oven main body far away from the second wind shielding curtain box; The wind direction guiding assembly comprises an air exhaust groove, an air exhaust hole, a concentrated guiding plate, a wind shield, a diffusion plate and an air exhaust bin, wherein the wind shield is fixedly installed at the