Search

CN-115816286-B - Quartz wafer grinding device

CN115816286BCN 115816286 BCN115816286 BCN 115816286BCN-115816286-B

Abstract

The application provides a quartz wafer grinding device which comprises a lower grinding plate and an upper grinding plate, wherein the grinding plate is provided with a grinding toothed plate, the grinding toothed plate is simultaneously connected with an annular fluted disc and a circular toothed plate in a meshed mode, the grinding toothed plate can rotate along the direction opposite to the rotation direction of the circular toothed plate, a vertical plate and a reset piece are arranged in the grinding toothed plate, the reset piece is installed between a group of vertical plates in a meshed mode, one vertical plate comprises two vertical plates, one vertical plate part extends out of the upper end face of the grinding toothed plate, the other vertical plate part extends out of the lower end face of the grinding toothed plate, and the vertical plate is enabled to have a first state of partially extending out of the grinding toothed plate and a second state of wholly retracting into the grinding toothed plate through rotation of the reset piece. The grinding toothed plate is jacked up through the vertical plate, and the vertical plates at the upper part and the lower part are flush with the surface of the quartz wafer, so that the problem of poor grinding effect of the bottom of the quartz wafer is solved, and the double-sided grinding effect of the quartz wafer is improved.

Inventors

  • LUO XIAOPING
  • LIAO XIAOHUA
  • YU HUIZHEN

Assignees

  • 万安县泰鑫电子有限责任公司

Dates

Publication Date
20260505
Application Date
20221208

Claims (8)

  1. 1. A quartz wafer polishing apparatus, comprising a lower polishing plate (20) and an upper polishing plate (43); The grinding plate (20) is provided with a grinding toothed plate (30), and the grinding toothed plate (30) is simultaneously connected with the annular fluted disc (21) and the circular toothed plate (22) in a meshed manner, so that the grinding toothed plate (30) can rotate in the direction opposite to the rotation direction of the circular toothed plate (22); A vertical plate (32) and a reset piece (33) are arranged in the grinding toothed plate (30), the reset piece (33) is installed between a group of vertical plates (32) in a meshed mode, one group of vertical plates (32) comprises two vertical plates (32), one vertical plate (32) extends out of the upper end face of the grinding toothed plate (30), the other vertical plate (32) extends out of the lower end face of the grinding toothed plate (30), and the vertical plate (32) is enabled to have a first state of partially extending out of the grinding toothed plate (30) and a second state of being fully retracted into the grinding toothed plate (30) by rotating the reset piece (33); the reset piece (33) comprises a toothed ring and a torque spring, and the middle part of the torque spring is fixedly connected with the toothed ring.
  2. 2. The quartz wafer grinding device according to claim 1, wherein the annular fluted disc (21) and the circular toothed plate (22) are both arranged on the lower grinding plate (20), the circular toothed plate (22) is positioned at the center of the annular fluted disc (21), and the annular fluted disc (21) is in transmission connection with a driving motor arranged in the base (11) through a transmission shaft (23); The grinding toothed plate (30) is arranged between the circular toothed plate (22) and the annular fluted disc (21), and the grinding toothed plate (30) is meshed with the inner ring insection of the annular fluted disc (21) and the outer ring insection of the circular toothed plate (22) at the same time.
  3. 3. A quartz wafer grinding apparatus according to claim 1, wherein the reset member (33) comprises: The mounting columns are arranged in the grinding toothed plate (30), and two ends of each mounting column are respectively fixed on the inner wall of the grinding toothed plate; a toothed ring movably sleeved on the mounting column, and And the torque spring is sleeved on the mounting column, and the end part of the torque spring is fixedly connected with the mounting column.
  4. 4. A quartz wafer polishing apparatus as in claim 3, wherein said mounting posts are provided with stop pins on their outer walls, said toothed ring being disposed between a set of said stop pins, wherein a set of said stop pins comprises two of said stop pins.
  5. 5. Quartz wafer grinding device according to claim 1, characterized in that it further comprises a frame (10), a moving assembly (40) being arranged above the frame (10), the moving assembly (40) being connected to the upper grinding plate (43) such that the upper grinding plate (43) can be moved in a vertical direction.
  6. 6. A quartz wafer grinding apparatus according to claim 5, wherein the moving assembly (40) comprises: a cylinder (41) mounted on the frame (10), and And a connecting piece (42) connected with the movable end of the air cylinder (41), wherein one end of the connecting piece (42) away from the air cylinder (41) is connected with the upper grinding plate (43).
  7. 7. The quartz wafer polishing apparatus as recited in claim 6, wherein the frame (10) is provided with a control panel (12), the control panel (12) being electrically connected to the cylinder (41) and a driving motor provided inside the base (11).
  8. 8. The quartz wafer polishing apparatus as recited in claim 1, wherein the outer wall of the upper polishing plate (43) is circumferentially provided with a through hole in which a transfusion tube is installed.

Description

Quartz wafer grinding device Technical Field The invention relates to the technical field of grinding, in particular to a quartz wafer grinding device. Background After the 21 st century, IT information revolution has progressed from analog to digital, and large-capacity information such as data, music, audio and video has been used in combination with wireless and wired networks between media developed independently, through networks and various media. The quartz chip of the crystal product serves as an important part in the digital information society. The quartz wafer needs to be ground on the upper surface and the lower surface in the production process, however, when the traditional grinding device is used, the bottom of the quartz wafer is always level with the lower end surface of the grinding plate in the grinding process, so that the phenomenon of poor grinding effect of the bottom of the quartz wafer is caused, and the processing effect of the quartz wafer is affected. Disclosure of Invention Therefore, the main purpose of the present invention is to solve the technical problem of poor polishing effect of the bottom of the quartz wafer. The invention provides a quartz wafer grinding device which comprises a lower grinding plate and an upper grinding plate, wherein the grinding plate is provided with a grinding toothed plate, the grinding toothed plate is simultaneously connected with an annular fluted disc and a circular toothed plate in a meshed mode, the grinding toothed plate can rotate in the direction opposite to the rotation direction of the circular toothed plate, a vertical plate and a reset piece are arranged in the grinding toothed plate, the reset piece is installed between a group of vertical plates in a meshed mode, one group of vertical plates comprises two vertical plates, one vertical plate part extends out of the upper end face of the grinding toothed plate, the other vertical plate part extends out of the lower end face of the grinding toothed plate, and the vertical plate is enabled to have a first state of partially extending out of the grinding toothed plate and a second state of being wholly retracted into the grinding toothed plate by rotating the reset piece. In some embodiments of the invention, the annular fluted disc and the circular fluted disc are both arranged on the lower grinding plate, the circular fluted disc is positioned at the center of the annular fluted disc, the annular fluted disc is in transmission connection with a driving motor arranged in the base through a transmission shaft, wherein the grinding toothed plate is arranged between the circular fluted disc and the annular fluted disc, and the grinding toothed plate is meshed with inner ring insections of the annular fluted disc and outer ring insections of the circular fluted disc at the same time. In some embodiments of the invention, the reset piece comprises a mounting column arranged in the grinding toothed plate, two ends of the mounting column are respectively fixed on the inner wall of the grinding toothed plate, a toothed ring movably sleeved on the mounting column, and a torque spring sleeved on the mounting column, wherein the end part of the torque spring is fixedly connected with the mounting column, and the middle part of the torque spring is fixedly connected with the toothed ring. In some embodiments of the present invention, a limiting pin is disposed on an outer wall of the mounting post, and the toothed ring is disposed between a set of the limiting pins, wherein a set of the limiting pins includes two of the limiting pins. In some embodiments of the present invention, the quartz wafer polishing apparatus further comprises a frame, and a moving assembly is disposed above the frame, and is connected to the upper polishing plate, so that the upper polishing plate can move in a vertical direction. In some embodiments of the invention, the moving assembly includes a cylinder mounted on the frame and a connector coupled to a movable end of the cylinder, the connector coupled to the upper lapping plate at an end of the connector remote from the cylinder. In some embodiments of the present invention, a control panel is disposed on the frame, and the control panel is electrically connected to the cylinder and a driving motor disposed inside the base. In some embodiments of the present invention, a through hole is circumferentially arranged on the outer wall of the upper grinding plate, and an infusion tube is installed in the through hole. According to the quartz wafer grinding device provided by the invention, the grinding toothed plate is jacked up through the vertical plate, and the vertical plate at the upper part and the vertical plate at the lower part are all flush with the surface of the quartz wafer. Drawings FIG. 1 is a schematic diagram illustrating an assembly of a quartz wafer polishing apparatus according to an embodiment of the present invention; FIG. 2 is a top view of a lower p