CN-115831892-B - Electrostatic force microcirculation heat abstractor

CN115831892BCN 115831892 BCN115831892 BCN 115831892BCN-115831892-B

Abstract

The invention discloses an electrostatic force microcirculation heat dissipation device, which comprises a liquid storage box body, a base station which is arranged on the liquid storage box body and is in direct contact with a chip, a plurality of micro-channels which vertically extend out from the base station and capacitor plates which are added on two sides of the micro-channels in pairs, wherein the chip is arranged at the interval of the micro-channels, the micro-channels are rectangular through type channel structures, and channel walls of the channel structures are made of resin materials and separate cooling liquid and the capacitor plates in the micro-channels. The up-and-down flow of the internal coolant and the circulation flow inside the tank can be driven by applying voltage to the capacitive plates at both sides of the micro-channel. The invention omits the traditional driving pump, relies on electrostatic force as a power source, realizes heat dissipation of the microchip without occupying a large amount of space, and simultaneously only depends on voltage to work in the working process without current generation, thereby saving energy consumption to a great extent.

Inventors

ZHANG YAMIN
ZHANG BOHAN
FENG SHIWEI
ZHANG MENG
PENG FEI
YANG JIE

Assignees

北京工业大学

Dates

Publication Date: 20260505
Application Date: 20221125

Claims (6)

1. An electrostatic force microcirculation heat dissipation device is characterized by comprising a liquid storage box body (2), a base (3) which is placed on the liquid storage box body (2) and is in direct contact with a chip, a plurality of micro-channels and capacitor plates (4) which are added on two sides of the micro-channels in pairs, wherein the micro-channels are arranged at intervals of the micro-channels, the micro-channels are of rectangular straight-through channel structures, channel walls of the channel structures are made of resin materials, and cooling liquid in the micro-channels and the capacitor plates (4) are separated.
2. The electrostatic force microcirculation heat dissipation device as set forth in claim 1, wherein the base (3) is provided with a hole, and the micro-channels extend vertically upwards from the hole on the base (3), and the micro-channels are horizontally and linearly arranged on the base (3) according to a certain size to form a multi-finger structure.
3. The electrostatic force microcirculation heat dissipation device as set forth in claim 1, wherein a groove (5) for placing the capacitor plate (4) is reserved on the base (3), and fixation of the microchannel and the capacitor plate (4) is satisfied.
4. The electrostatic force microcirculation heat dissipation device is characterized in that a reserved liquid injection port (6) and a sealing cover (7) with matched sizes are arranged on the base station (3) to form a closed environment, and the base station (3) and the liquid storage box body (2) are connected through waterproof sealant or screws.
5. The electrostatic force microcirculation heat dissipation device as set forth in claim 1, wherein the liquid storage tank body (2) at the bottom of the heat dissipation device, the base (3) and the micro-channels arranged on the base (3) in a linear manner are made of insulating material resin, the electrodes of the capacitor plates (4) are copper sheets, and the area of the base (3) where the chips are placed is covered with a layer of heat conducting medium.
6. An electrostatic force microcirculation heat dissipating device according to claim 1, wherein when there is an electric field perpendicular or parallel to the interface of two dielectrics, the force acting at the interface is always perpendicular to the interface and directed from the side with the larger dielectric constant to the side with the smaller dielectric constant, the electric field force acting on the unit area on the interface of two dielectrics is always perpendicular to the unit area and always directed from the side with the larger dielectric constant to the side with the smaller dielectric constant, the coolant is moved in the vertical direction by electrostatic force to replace the driving pump to be the power source for the coolant to flow, and by changing the size of the heat dissipating device and the parameters of the applied voltage, the coolant flows up and down in the set order to generate the flow velocity difference to generate vortex, the peak value appears at the position where the chip is placed, the heat exchanging effect is better at the place where the flow velocity is larger, thus achieving the purpose of dissipating the heat to the chip.

Description

Electrostatic force microcirculation heat abstractor Technical Field The invention relates to the field of chip heat dissipation and the field of chip reliability, which is mainly applied to heat dissipation of micro chips, in particular to an electrostatic force microcirculation heat dissipation device. Background The current electronic chip is developed towards small size and high integration, however, while the performance of the chip is improved, more heat is generated, so that the temperature of the chip is increased, the performance and reliability of the electronic chip are obviously reduced along with the temperature increase, therefore, the chip heat dissipation technology is very important, and the importance of the micro cooling technology of the microchip in the chip is also increased. Among various developed micro-cooling technologies, the micro-channel radiator (MCHS) is attracting attention due to the outstanding characteristics of high convective heat transfer coefficient, compact structure, high surface area to volume ratio, less cooling liquid, uniform temperature, etc. All the prior art micro-channel radiators have the common point that the design comprises a water inlet and a water outlet, and the coolant flows in the micro-channel to take away heat by means of an externally-added driving pump, which means that the driving pump needs to continuously work in order to control the flow speed of the fluid flow and the pressure drop existing when the fluid flows through the channel, so that the driving pump and the externally-connected liquid storage tank occupy a large space and consume more energy. No micro radiator capable of realizing the circulation flow heat dissipation of liquid without driving a pump exists so far, but with the development of a microchip, the design of the micro radiator which gets rid of the power supplied by the traditional driving pump is very necessary. Disclosure of Invention In view of the foregoing, it is desirable to provide a microchannel heat sink with a novel power source independent of the drive pump. The invention aims to provide a novel electrostatic force microcirculation heat dissipation device, which is similar to a finger-shaped structure, a plurality of micro-channels with micron-sized extend above a hollow box body, a microchip is placed on a platform with micro-channel intervals, and the capacitive plates on two sides of the micro-channels can drive internal coolant to flow up and down and circulate inside the box body by applying voltage to the capacitive plates on two sides of the micro-channels. The invention omits the traditional driving pump, relies on electrostatic force as a power source, realizes heat dissipation of the microchip without occupying a large amount of space, and simultaneously only depends on voltage to work in the working process without current generation, thereby saving energy consumption to a great extent. The technical scheme adopted by the invention is that the electrostatic force microcirculation heat dissipation device comprises a liquid storage box body 2, a base 3 which is placed on the liquid storage box body 2 and is in direct contact with a chip, a plurality of micro-channels and capacitor plates 4 which are added on two sides of the micro-channels in pairs, wherein the micro-channels are arranged at intervals of the micro-channels, the micro-channels are rectangular straight-through channel structures, channel walls of the channel structures are made of resin materials, and cooling liquid in the micro-channels and the capacitor plates 4 are separated. Further, the base 3 is provided with a hole, and the micro-channels vertically extend upwards from the hole on the base 3, and the micro-channels are horizontally and linearly arranged on the base 3 according to a certain size to form a multi-finger structure. Further, a groove 5 for placing the capacitor plate 4 is reserved on the base 3, and fixation of the micro-channel and the capacitor plate 4 is satisfied. Further, the base 3 is provided with a reserved liquid injection port 6 and a cover 7 with matched size, so as to form a closed environment. For the liquid filling port 6 and the sealing cover 7, the connection between the base 3 and the liquid storage tank body 2 adopts waterproof sealant or screw fixation. The case 2, the base 3 and the micro-channels arranged on the base 3 are made of insulating material resin, the electrodes of the capacitor plate 4 are copper sheets, and the area (shown as a shadow area in fig. 2) of the base 3 where the chips are placed is covered with a layer of heat conducting medium. When an electric field is perpendicular or parallel to the interface of the two dielectrics, the forces acting at the interface are always perpendicular to the interface and directed from the side with the higher dielectric constant to the side with the lower dielectric constant. At the interface between the two media, the force of the electric field a