CN-115847264-B - Interactive device and interactive method for polishing silicon wafer and polishing equipment

CN115847264BCN 115847264 BCN115847264 BCN 115847264BCN-115847264-B

Abstract

The application relates to the field of semiconductor wafer polishing, in particular to an interaction device for polishing silicon wafers, which comprises a fixed seat, a carrier mechanism and a polishing head mechanism, wherein the baffle is arranged in a containing space and is connected to the fixed seat in a sliding manner along a first direction, the polishing head is in a first state, the baffle is movably arranged on the side edge of the polishing head, the polishing head is in a second state, the baffle is movably arranged under or on the side edge of the polishing head, the cleaning mechanism is arranged on the side edge of the containing space, the cleaning mechanism at least comprises a first mode and a second mode, the baffle is arranged between the polishing head and the carrier in the first mode, the cleaning mechanism enters between the polishing head and the baffle and cleans the polishing head, and the cleaning mechanism does not act in the second mode. Solves the technical problem that the silicon wafer interaction process is easy to pollute, and achieves the technical effect of reducing the silicon wafer interaction pollution.

Inventors

ZHU LIANG
CAO JIANWEI
LI YANGJIAN
ZHENG MENG
HUANG JINTAO
Shan Xianqi
HAN PENGFEI

Assignees

浙江晶盛机电股份有限公司

Dates

Publication Date: 20260512
Application Date: 20221205

Claims (10)

1. An interactive apparatus for polishing a silicon wafer, comprising: A fixed seat (100); -a carrier mechanism (300), said carrier mechanism (300) being slidingly connected to said holder (100) along a first direction, said carrier mechanism (300) comprising: The carrier (310) is used for carrying the silicon wafer, and the carrier (310) moves to form a first station (321) for loading the silicon wafer, a second station (322) for loading or unloading the silicon wafer and a third station (323) for unloading the silicon wafer; The device comprises a head mechanism (200), wherein the head mechanism (200) is positioned above the carrier mechanism (300), a containing space (220) is formed between the head mechanism (200) and the carrier mechanism (300), and the head mechanism (200) comprises: The throwing head (210) is used for loading and unloading silicon wafers, the throwing head (210) is positioned right above the second station (322), the throwing head (210) at least has a first state and a second state, the first state is that the throwing head (210) acts downwards on the carrier (310) to load or unload the silicon wafers, and the second state is that the throwing head (210) does not act; a gear-isolating mechanism (400), the gear-isolating mechanism (400) comprising: A baffle (410), wherein the baffle (410) is positioned in the accommodating space (220), the baffle (410) is connected to the fixed seat (100) in a sliding way along a first direction, the baffle (410) is movably arranged at the side edge of the projectile (210) in a first state, the projectile (210) is movably arranged under or at the side edge of the projectile (210) in a second state, the baffle (410) is movably arranged at the right lower part or the side edge of the projectile (210), and The cleaning mechanism (500) is positioned at the side edge of the accommodating space (220), the cleaning mechanism (500) is provided with at least a first mode and a second mode, the baffle plate (410) is arranged between the projectile head (210) and the carrier (310) in the first mode, the cleaning mechanism (500) enters between the projectile head (210) and the baffle plate (410) and cleans the projectile head (210), and the cleaning mechanism (500) is not operated in the second mode.
2. An interaction device for polishing silicon wafers according to claim 1, wherein the carrier (310) comprises: the first carrier (311), the first carrier (311) moves to form a first station (321) and a second station (322), the first carrier (311) is used for carrying out silicon wafer loading on the first station (321) and carrying out silicon wafer loading on the second station (322); The second carrier (312) is positioned on one side of the first carrier (311), the second carrier (312) moves to form a second station (322) and a third station (323), and the second carrier (312) is used for unloading on the second station (322) and unloading the silicon wafer on the third station (323).
3. An interaction device for polishing silicon wafers according to claim 2, wherein the first carrier (311) and the second carrier (312) have a plurality of groups and are arranged in equal numbers, the carriers (310) are arranged linearly along a first direction, and the number of the polishing heads (210) is equal to the number of the first carriers (311) or the second carriers (312).
4. An interaction device for polishing silicon wafers according to claim 3, wherein the carrier means (300) further comprises: A moving seat (330), wherein the moving seat (330) is connected to the fixed seat (100) in a sliding manner, and the carrier (310) is arranged on the moving seat (330); a first drive assembly (340), the first drive assembly (340) comprising: The screw rod (341) is arranged along a first direction, the screw rod (341) is connected to the fixed seat (100), the screw rod (341) has a rotation degree of freedom of rotating around an axis, and the screw rod (341) is connected with the movable seat (330) through threads; The motor (342), motor (342) is connected in the tip of lead screw (341), motor (342) are used for driving lead screw (341) rotation and make and remove seat (330) driven by lead screw (341).
5. An interaction device for polishing silicon wafers according to claim 1, wherein the barrier mechanism (400) further comprises: -a second drive assembly (420), the second drive assembly (420) for driving the shutter (410) to slide, the second drive assembly (420) comprising: The air cylinder (421) is connected to the fixing seat (100), and the air cylinder (421) acts on the baffle (410) along a first direction, so that the baffle (410) moves along the first direction to reach the position right below the projectile head (210) or the side edge of the projectile head (210).
6. An interaction device for polishing silicon wafers as set forth in claim 1 wherein said baffle (410) comprises: the baffle body (411), the baffle body (411) is used for separating liquid generated by the cleaning mechanism (500) in a first mode, the baffle body (411) is provided with a flow guiding area (412), and the flow guiding area (412) is obliquely arranged and used for guiding the liquid out of the accommodating space (220); And the extension edge (413), the extension edge (413) is vertically fixed on the edge of the baffle body (411), a notch is formed on the extension edge (413) and a liquid discharge area (414) is formed, and the liquid discharge area (414) faces to the outside of the polishing equipment.
7. An interactive apparatus for polishing silicon wafers according to claim 1 or 3 wherein said cleaning mechanism comprises: A brush head assembly is positioned with rotational freedom of horizontal rotation such that the brush head assembly can be rotated into between the baffle (410) and the head (210) to clean the head (210).
8. A method of interacting with an interacting device for polishing silicon wafers according to any one of claims 1 to 7, comprising: Feeding, namely driving the carrier (310) to a first station (321) for silicon wafer feeding, and driving or maintaining the baffle (410) to a second station (322) or a third station (323); the loading step, which is to drive the carrier (310) to a second station (322) for loading the silicon wafer, and drive or keep the baffle (410) to a first station (321) or a third station (323); the carrier (310) is driven or kept to a second station (322) to carry out the silicon wafer blanking, and a baffle (410) is driven or kept to a first station (321) or a third station (323); the carrier (310) is driven to a third station (323) for silicon wafer blanking, and a baffle (410) is driven or kept to a first station (321) or a second station (322); and (3) cleaning, namely driving the baffle plate (410) between the projectile head (210) and the carrier (310), and cleaning the projectile head (210) by a cleaning mechanism (500), wherein the steps are repeated after the cleaning is finished.
9. The interactive method for polishing silicon wafers according to claim 8, wherein the cleaning of the polishing head (210) by the cleaning mechanism (500) comprises: The cleaning mechanism (500) is driven to rotate to enter between the baffle (410) and the projectile head (210), and the cleaning mechanism (500) cleans the projectile head (210); The cleaning mechanism (500) is driven to rotate and reset.
10. A polishing apparatus comprising an interactive device for polishing a silicon wafer according to any one of claims 1 to 7.

Description

Interactive device and interactive method for polishing silicon wafer and polishing equipment Technical Field The application relates to the field of semiconductor wafer polishing, in particular to an interaction device, an interaction method and polishing equipment for polishing silicon wafers. Background Polishing is one of the important processes for manufacturing semiconductor silicon wafer ends, and in order to obtain a silicon wafer with better surface quality, the front surface of the silicon wafer needs to be subjected to final polishing of a mirror surface. The process is to strictly control the surface defects of the silicon wafer which may be generated, and control and reduce the surface contamination of the silicon wafer. In the prior art, in the interaction link between the silicon wafer and the silicon wafer carrier, the defect of insufficient sewage isolation between the silicon wafer carrier and the silicon wafer carrier after cleaning of the silicon wafer carrier in the cleaning process exists in the structure existing on the market, and even the same silicon wafer carrier station is used for executing the adsorption, stripping and cleaning of the silicon wafer carrier. The probability of contamination of the surface of the silicon wafer is greatly improved, the LPD parameter on the surface of the silicon wafer is easily out of standard, and the yield of the silicon wafer is affected. If the foreign matters fall on the adsorption carrier of the silicon wafer, the risk of chip fragmentation in the silicon wafer polishing process exists, and larger loss is brought to production. Therefore, the technical problem in the prior art is that the silicon wafer interaction process is easy to stain. Disclosure of Invention The application provides an interaction device, an interaction method and polishing equipment for polishing silicon wafers, solves the technical problem that the silicon wafers are easy to pollute in the interaction process, and achieves the technical effect of reducing the interaction pollution of the silicon wafers. In a first aspect, the present application provides an interaction device for polishing a silicon wafer, which adopts the following technical scheme: An interactive device for polishing a silicon wafer comprises a fixed seat; the carrier mechanism is connected to the fixing seat in a sliding manner along a first direction and comprises a carrier, the carrier is used for carrying silicon wafers, a first station used for loading the silicon wafers, a second station used for loading the silicon wafers or unloading the silicon wafers and a third station used for unloading the silicon wafers are formed by the carrier moving, the polishing head mechanism is located above the carrier mechanism, a containing space is formed between the polishing head mechanism and the carrier mechanism, the polishing head mechanism comprises a polishing head used for loading the silicon wafers, the polishing head is located right above the second station and at least provided with a first state and a second state, the polishing head acts downwards on the carrier to load the silicon wafers in the first state, the polishing head does not act in the second state, the polishing head mechanism comprises a baffle plate located in the containing space, the baffle plate is connected to the upper side of the carrier mechanism in a sliding manner along the first direction, the polishing head is located in the second state, the polishing head mechanism is located in the second state, the polishing head is located in the second state, and enters the cleaning mode, and at least provided with the second state, the polishing head mechanism is located in the second state, and is placed in the cleaning mode, and is placed between the baffle plate and the cleaning mechanism. Preferably, the carrier comprises a first carrier, a second carrier and a third carrier, wherein the first carrier moves to form a first station and a second station, the first carrier is used for carrying out silicon wafer feeding on the first station and carrying out silicon wafer feeding on the second station, the second carrier is positioned on one side of the first carrier, the second carrier moves to form a second station and a third station, and the second carrier is used for carrying out wafer discharging on the second station and carrying out silicon wafer discharging on the third station. Preferably, the first carriers and the second carriers have a plurality of groups and are equal in number, the carriers are linearly arranged along the first direction, and the number of the throwing heads is equal to the number of the first carriers or the second carriers. Preferably, the carrier mechanism further comprises a moving seat, a first driving assembly and a motor, wherein the moving seat is connected to the fixed seat in a sliding mode, the carrier is arranged on the moving seat, the first driving assembly comprises a screw rod, the