CN-115866877-B - Circuit board with side edge sectionalized metal edge and processing method thereof

Abstract

The invention discloses a circuit board with side section metal binding and a processing method thereof, belonging to the field of circuit board metal binding, wherein the method comprises the steps of integrally binding the side of the circuit board, drilling and milling for vertical section; and adopting the T-shaped cutter to perform depth-control milling along the edge-wrapping side wall to form a horizontal section. The T-shaped cutter specifically comprises a cutter handle, wherein one end of the cutter handle is fixedly connected with a cutting edge, one end of the cutting edge, far away from the cutter handle, is fixedly connected with a plurality of evenly distributed cutting edges, tungsten steel is selected as a material of the T-shaped cutter, and the cutting edges of the T-shaped cutter are staggered three-face cutting edges. According to the invention, the conventional integral edging is adopted, then drilling and milling are carried out for vertical segmentation, then a special T-shaped cutter is used for horizontal milling by combining specific parameters to form horizontal segmentation, and the circuit board with the metal edging on the side wall segmented in the vertical and horizontal directions can be formed by combining the steps.

Inventors

• ZHANG RENJIN
• ZHAO QIANBO
• Zhao Qiangao

Assignees

• 深圳市卡博尔科技有限公司

Dates

Publication Date

20260505

Application Date

20221206

Claims (4)

1. 1. A processing method of a circuit board with side sections covered by metal edges is characterized by comprising the following steps: carrying out integral edge covering on the side edge of the circuit board, and carrying out drilling and milling for vertical segmentation; Determining parameters of a T-shaped cutter, and manufacturing the T-shaped cutter; performing depth-controlled milling along the edge-covered side wall by adopting a T-shaped cutter to form a horizontal section; The T-shaped cutter specifically comprises a cutter handle, wherein one end of the cutter handle is fixedly connected with a cutting edge, and the cutting edge is far away from one end of the cutter handle The end of the T-shaped cutter is fixedly connected with a plurality of evenly distributed cutting points, tungsten steel is selected as the material of the T-shaped cutter, and the cutting points of the T-shaped cutter are staggered Tooth three-sided edge; The number of the cutting points is 2-10; the thickness of the cutting tip is marked as E, and E is 0.1-2mm; the diameter of the cutting tip is marked as D, and the diameter of the D is 4.1-4.4mm; the length from the other end of the cutting edge to the cutting tip is marked as G, and the length from G to G is 3-10mm.
2. 2. The method for manufacturing a circuit board with side-sectional metal edges according to claim 1, wherein the steps of The side edge of the circuit board is integrally covered, and the method is as follows: A pre-process, namely pasting a dry film on the surface of the circuit board at a certain temperature and pressure, aligning with a film, and finally, putting the circuit board on an exposure machine The dry film which is not shielded by the film is polymerized by the irradiation of ultraviolet light, a required circuit pattern is formed on the surface of the board, and then the film passes through The dry film which does not undergo polymerization is washed off by the action of the developing solution, and the dry film which undergoes polymerization is remained on the plate surface as etching Etching the etching resist layer, etching copper without dry film protection by etching liquid, and removing by stripping liquid Forming copper conductors of each layer by using the dry film on the copper surface; Laminating, filling the circuit and the base material by using the resin flow characteristic of the prepreg under the action of certain temperature and pressure, and heating When the curing reaction is carried out to a certain extent, the layers of circuits are bonded together to form a multilayer circuit board; Drilling holes, namely drilling through holes for connecting lines between layers at preset positions on the board surface by utilizing a drilling machine and a drilling tool; Milling slot holes, and forming smooth side walls by adopting different milling cutters through rough milling and finish milling processes; Depositing copper by chemical oxidation-reduction reaction mechanism to deposit resin and glass fiber on non-conductive part of the wall The thickness of the layer metal copper is 0.5-1 mu m, so that the subsequent copper electroplating process is convenient to carry out; plating the plate, namely electroplating copper with the thickness of 5-15 mu m on the plate surface and the hole wall on which the copper is deposited by an electrochemical principle to ensure that The chemical copper with very thin protection is not damaged by the post-processing, so that the hole is free of copper; the outer dry film is tightly adhered to the copper surface by heating and pressurizing, and clients are exposed on the dry film by the image transfer principle The required line pattern; pattern electroplating to thicken copper in circuit and hole to preset standard and etching unused copper on board surface with tin as protective layer Removing the useful circuit pattern; Drilling holes, namely drilling the preset positions in the vertical direction with drilling cutters with corresponding cutter diameters according to the intervals of design binding metals to remove binding Cutting off the boundary position between the arc and the straight line of the slot hole by a small drill to form a wrapping edge The boundary between the region and the non-wrapping region is removed in the subsequent etching step if some burr copper wires exist at the cutting edge of the drill and the metal Forming a smooth interface; Milling half holes, cutting edges of the metal-plated grooves by a milling cutter before etching, and milling positions of the two ends where metal wrapping is not needed So that the metal hemming burrs at the interface are removed during etching to form a smooth transition; etching the outer layer, etching the exposed copper surface by using alkaline etching liquid and tin as a protective layer, and then etching the copper surface by nitric acid Removing the tin layer to form straight, upper and lower and left and right uniformly segmented edge-covering metal; The solder resist character is coated with a layer of solder resist ink on the board surface in a screen printing mode, and the solder resist ink is exposed to be soldered through exposure and development The disk and the hole are covered with a solder mask layer at other positions to prevent short circuit, character layers are further screen printed on the solder mask oil surface, The marking function is realized, and the subsequent pasting, maintenance and identification are facilitated; Depositing gold, namely carrying out surface gold coating treatment on the edge-coated metal to protect a copper surface, and finally forming an edge-coated effect; the post-process comprises the following steps of electric measurement, namely, testing the open circuit and the short circuit of the circuit board, and routing, namely, utilizing a numerical control machine tool Cutting the circuit board into required size, checking and final quality check.
3. 3. The method for manufacturing a circuit board with side-sectional metal edges according to claim 1, wherein the steps of After milling to form horizontal segment, the plate is treated by chemical microetching for 1-2 times and dried, and the metal carried out by milling is milled by a milling cutter The burr scraps are removed, and the neat sectional metal edge covering effect can be obtained.
4. 4. A circuit board with side section metal edge is characterized in that the circuit board with side section metal edge adopts the following steps A processed by the processing method of any one of claims 1 to 3.

Description

Circuit board with side edge sectionalized metal edge and processing method thereof Technical Field The invention relates to the field of circuit board metal edge covering, in particular to a circuit board with side edge segmentation metal edge covering and a processing method thereof. Background For high frequency and high speed PCBs, it is often desirable to metallize and edge portions of the side walls of the board to form metallized board edge slots so that high speed or microwave signals cannot radiate from the board edges of the PCB. In addition, through the metallization edge-wrapping structure, the grounding reliability and the shielding effect can be improved, and the interference caused by local circuits can be reduced. Most of the existing metallization edging processes are designed into all layers of metallization edging, namely the whole edging of the side wall, and sometimes the edging metal on the opposite side is required to be processed in an array mode in design, namely the edging metal is segmented in the horizontal direction and the vertical direction so as to realize modularized side welding or contact functions, but the process is not common at present. The current local taping process mainly comprises two related technologies, namely, firstly, taping all layers of metallization, then carrying out controlled depth milling, milling redundant layers of metallization taping, and then etching, but firstly, milling redundant layers of metallization taping by controlled depth milling, wherein the defect that the redundant layers of metallization taping can only be milled under a top layer or a bottom layer, a middle section is left, or a lower controlled depth left a half section or an upper controlled depth left a half section, the design of the taping left at the upper end and the lower end cannot be realized, secondly, the flatness of the taping left after milling is influenced by the thickness of the board by conventional controlled depth milling precision is insufficient, secondly, the taping is firstly manufactured through a core board, then, the blind groove is formed through a pressing mode of non-flowing PP windowing, the manufactured taping is sealed in the blind groove, and finally, the blind groove cover is controlled to be deeply uncovered through a process of uncovering the blind groove, and the taping which is made in advance on the core board is similar to the method of a bonding board, but the technology secondly, the technology firstly, the taping Bian Zaiya is finished, the situation that the PP window is not enough is needed, and the copper taping is required to be laminated, and the copper taping is required to be covered on the top surface of the high-flow tape. Aiming at the scheme that part of products are designed into side sectional type metal-covered schemes, the metal-covered schemes are distributed at the upper end and the lower end, the middle part and the left part are hollow out by a certain space distance, the depth-control milling scheme of the first technology cannot realize the horizontal segmentation in the design, the second technology in the background technology is adopted, the method that the upper sub board and the lower sub board are respectively covered and then the middle part is used for windowing PP and then pressing is needed, the process is long and the cost is high, meanwhile, the separation distance is difficult to accurately control because the thickness specification of the PP is fixed, and the implementation is difficult. Therefore, a circuit board with side segment metal edge and a processing method thereof are provided by those skilled in the art to solve the above-mentioned problems in the prior art. Disclosure of Invention The invention aims to provide a circuit board with side section metal bordure and a processing method thereof, wherein the circuit board is vertically segmented by adopting conventional integral bordure and then drilling and milling, then horizontally segmented by combining a special T-shaped tool and specific technological parameters, and the circuit board with side wall metal bordure which is segmented in the vertical and horizontal directions can be formed by combining the technological schemes, so that the problems in the prior art are solved. In order to achieve the above purpose, the present invention provides the following technical solutions: A processing method of a circuit board with side sections and metal edges comprises the following steps: carrying out integral edge covering on the side edge of the circuit board, and carrying out drilling and milling for vertical segmentation; determining parameters of a T-shaped cutter, and manufacturing the T-shaped cutter; And (5) carrying out depth control milling along the edge-covered side wall by adopting a T-shaped cutter to form a horizontal section. The T-shaped cutter is characterized by comprising a cutter handle, wherein one end of the cutter handle is fix