CN-115884503-B - Circuit flexible board with heat insulation function and light-emitting module

CN115884503BCN 115884503 BCN115884503 BCN 115884503BCN-115884503-B

Abstract

The invention discloses a circuit soft board with a heat insulation function and a light-emitting module, wherein the circuit soft board comprises a substrate layer, a circuit layer, a binding pad and a binding pad, wherein the substrate layer comprises a heat insulation part and a bending part, the heat insulation part is adjacent to the bending part, the circuit layer is positioned on the side surface and/or the surface of the substrate layer, the binding pad is electrically connected with the circuit layer, the vertical projection of the binding pad in the substrate layer is positioned in the bending part, the heat insulation part comprises a heat-resisting layer and a heat-radiating layer, the heat-radiating layer is positioned between the heat-resisting layer and a device to be bound and is in contact with the device to be bound, the heat-radiating coefficient of the heat-radiating layer is higher, the heat-radiating coefficient of the device to be bound can effectively radiate, the heat generated by the device to be bound can be prevented from being transmitted to the circuit layer, the heat is controlled between the heat-resisting layer and the heat-radiating layer, the heat is enabled to be conducted to the environment, and the heat is prevented from being conducted to the circuit soft board, and the stability of the structure of the soft board is improved.

Inventors

WANG SHUPENG
ZHU YINGGUANG
ZHANG GUOHUI
LI DONGDONG
HU YONGLAN

Assignees

固安翌光科技有限公司
淮北翌光科技有限公司

Dates

Publication Date: 20260512
Application Date: 20221201

Claims (10)

1. A circuit board with heat insulation function, comprising: the base material layer comprises a heat insulation part and a bending part, wherein the heat insulation part is adjacent to the bending part; a circuit layer located on a side surface of the substrate layer and/or inside the substrate layer; The bonding pad is electrically connected with the circuit layer, and the vertical projection of the bonding pad in the substrate layer is positioned in the bending part; The heat insulation part comprises a heat insulation layer and a heat dissipation layer, wherein the heat dissipation layer is positioned between the heat insulation layer and the device to be bound and is in contact with the device to be bound, the heat dissipation layer is used for dissipating heat of the device to be bound, the heat insulation layer is used for blocking heat generated by the device to be bound from being transferred to the circuit layer, and the heat dissipation layer is exposed between the heat insulation layer and the device to be bound.
2. The circuit board with heat insulation function according to claim 1, wherein, The heat dissipation layer comprises a plurality of hollow structures, and the hollow structures are used for increasing the heat dissipation area of the heat dissipation layer; The hollowed-out pattern of the hollowed-out structure comprises at least one of a polygon, a circle and an ellipse.
3. The circuit board with heat insulation function according to claim 2, wherein, The heat dissipation layer comprises a heat dissipation substrate in contact with the surface of the device to be bound, and a plurality of heat dissipation fins fixed between the heat dissipation substrate and the heat resistance layer, wherein the heat dissipation fins are sequentially arranged at intervals, and a cavity formed between two adjacent heat dissipation fins is used as the hollowed-out structure.
4. The circuit board with heat insulation function according to claim 3, wherein, The planes of the radiating fins are perpendicular to the planes of the radiating substrate, and all the planes of the radiating fins are parallel to each other.
5. The circuit board with heat insulation function according to claim 3, wherein, The planes of every two adjacent radiating fins are intersected with the plane of the radiating substrate to form a radiating support frame.
6. The circuit board with heat insulation function according to any one of claims 1 to 5, wherein, The material of the heat dissipation layer comprises metal, and the material of the heat resistance layer comprises at least one of aerogel and ceramic.
7. The circuit board with heat insulating function according to claim 1, wherein the heat dissipation layer comprises a flexible carbon nanotube adhesive sheet.
8. The circuit board with heat insulation function according to claim 1, wherein the heat conductivity of the heat insulation portion gradually decreases along the direction in which the device to be bonded is directed to the circuit layer.
9. The light-emitting module is characterized by comprising a light-emitting panel and the circuit flexible board with the heat insulation function according to any one of claims 1-8, wherein the circuit flexible board with the heat insulation function is arranged on the non-light-emitting side of the light-emitting panel, and binding pads on the circuit flexible board are bound in a binding area of the light-emitting panel.
10. The lighting module of claim 9, further comprising a graphene film on a side of the light emitting panel away from the circuit board and/or on a side of the light emitting panel near the circuit board.

Description

Circuit flexible board with heat insulation function and light-emitting module Technical Field The embodiment of the invention relates to the technical field of circuit flexible boards, in particular to a circuit flexible board with a heat insulation function and a light-emitting module. Background Along with the high-speed development of electronic products, the types of circuit boards are very many, including hard boards, soft boards and rigid-flex boards. The circuit flexible board (Flexible Printed Circuit, FPC) has the advantages of high wiring density, light weight, thin thickness, flexibility, high flexibility and the like, and has the advantages which are incomparable with other types of circuit boards. At present, a circuit flexible board is made of flexible base materials such as polyimide or polyester film, after the circuit flexible board is bound with a device to be bound, for example, after the circuit flexible board is bound with an Organic Light-Emitting Diode (OLED) screen body, the heat dissipation efficiency of the device to be bound is affected because the circuit flexible board covers the device to be bound or is close to the distance between the device to be bound, and the heat generated by the device to be bound is conducted to the circuit flexible board, so that the structural stability of the flexible board is affected. Therefore, how to improve the heat dissipation efficiency of the device to be bound and prevent the heat generated by the device to be bound from being conducted to the circuit flexible board becomes a technical problem to be solved urgently. Disclosure of Invention The embodiment of the invention provides a circuit flexible board with a heat insulation function and a light-emitting module, which are used for improving the heat dissipation efficiency of a device to be bound, preventing heat generated by the device to be bound from being conducted to the circuit flexible board and ensuring the working characteristics of the device. According to an aspect of the present invention, there is provided a circuit flexible board having a heat insulation function, comprising: the base material layer comprises a heat insulation part and a bending part, wherein the heat insulation part is adjacent to the bending part; a circuit layer located on a side surface of the substrate layer and/or inside the substrate layer; The bonding pad is electrically connected with the circuit layer, and the vertical projection of the bonding pad in the substrate layer is positioned in the bending part; The heat insulation part comprises a heat insulation layer and a heat dissipation layer, wherein the heat dissipation layer is positioned between the heat insulation layer and the device to be bound and is in contact with the device to be bound, the heat dissipation layer is used for dissipating heat of the device to be bound, and the heat insulation layer is used for blocking heat generated by the device to be bound from being transferred to the circuit layer. Optionally, the heat dissipation layer includes a plurality of hollow structures, hollow structure is used for increasing the heat dissipation area of heat dissipation layer. Optionally, the hollowed pattern of the hollowed structure includes at least one of a polygon, a circle and an ellipse. Optionally, the heat dissipation layer includes a heat dissipation substrate contacting with the surface of the device to be bound, and a plurality of heat dissipation fins fixed between the heat dissipation substrate and the heat blocking layer, where the plurality of heat dissipation fins are sequentially arranged at intervals, and a cavity formed between two adjacent heat dissipation fins is used as the hollow structure. Optionally, the planes of the radiating fins and the planes of the radiating substrate are perpendicular to each other, and all planes of the radiating fins are parallel to each other. Optionally, the planes of the radiating fins are intersected with the planes of the radiating substrate, and every two adjacent planes of the radiating fins are intersected with each other to form a radiating support frame. Optionally, the material of the heat dissipation layer comprises metal, and the material of the heat resistance layer comprises at least one of aerogel and ceramic. Optionally, the heat dissipation layer includes a flexible carbon nanotube adhesive sheet. Optionally, the thermal conductivity of the thermal insulation part gradually becomes lower along the direction that the device to be bound points to the circuit layer. According to another aspect of the present invention, there is provided a light emitting module, including a light emitting panel and the circuit flexible board with heat insulation function according to any embodiment of the present invention, wherein the circuit flexible board with heat insulation function is disposed on a non-light emitting side of the light emitting panel, and a binding pad on the circuit flexi