CN-115889618-B - Device for processing pins of electronic element

CN115889618BCN 115889618 BCN115889618 BCN 115889618BCN-115889618-B

Abstract

The invention relates to the technical field of electronic product processing, in particular to a device for processing pins of an electronic element, which comprises a shaping mechanism, a pre-bending mechanism and a transfer mechanism, wherein the shaping mechanism is arranged on a main machine seat and used for shaping pins, the pre-bending mechanism is used for taking materials and pre-bending the pins, the transfer mechanism is used for clamping the electronic element to carry out station transfer, the shaping mechanism is respectively arranged on a primary shaping station and a secondary shaping station, the pre-bending mechanism is arranged on a pre-bending station, and the pre-bending station is arranged on the front end working procedure of the primary shaping station.

Inventors

WEI DANLING
WANG YANQI
ZHOU JING
WANG YI
LI SHAOBO

Assignees

揭阳市美得福电子有限公司
揭阳市揭东区新美得福电子有限公司

Dates

Publication Date: 20260512
Application Date: 20210930

Claims (9)

1. The electronic component pin processing device is characterized by comprising a shaping mechanism arranged on a main machine seat and used for shaping pins, a pre-bending mechanism used for taking materials and pre-bending the pins, and a transfer mechanism used for clamping the electronic components to perform station transfer, wherein the shaping mechanism is respectively arranged on a primary shaping station and a secondary shaping station, the pre-bending mechanism is arranged on the pre-bending station, the pre-bending station is arranged on the front end procedure of the primary shaping station, the shaping mechanism comprises an inner die part used for shaping the pins of the electronic components in an inner mode, an outer die part matched with the inner die part and used for shaping the pins of the electronic components in an outer mode is arranged on the inner side of the outer die part, and the outer die part is arranged on two sides of the inner die part and comprises a compression die part used for carrying out compression molding on the pins of the electronic components.
2. The device for processing pins of an electronic component according to claim 1, wherein a trimming mechanism for trimming pins after primary shaping is provided at a trimming station located between the primary shaping station and the secondary shaping station.
3. The electronic component pin processing device according to claim 1 or 2, wherein the leveling mechanism for leveling the pins is arranged on the leveling station located on the side of the secondary shaping station away from the trimming station.
4. The device for processing pins of an electronic component as set forth in claim 1, wherein a feeding mechanism for feeding and cutting pins is disposed at a feeding station corresponding to a material taking position of the pre-bending mechanism, and a material discharging position of the feeding mechanism is disposed corresponding to the material taking position of the pre-bending mechanism.
5. The device for processing pins of an electronic component as set forth in claim 4, wherein the pre-bending mechanism comprises a material taking slider and a pin bending card, the material taking slider slides back and forth between a material taking position and a material lifting position, and the pin bending card is disposed on an upper side of the material lifting position.
6. The electronic component pin processing device according to claim 5, wherein the feeding mechanism comprises a feeding guide rail, a feeding gear and a cutting edge roller for cutting pins, a blanking port of the feeding guide rail is arranged corresponding to gear teeth of the feeding gear, the cutting edge roller is respectively arranged on two sides of the feeding gear, and a blanking position of the feeding gear is arranged corresponding to a material taking position of the material taking slide block.
7. The device for processing pins of an electronic component according to claim 2, wherein the trimming mechanism comprises an inner trimming block and an outer trimming block for trimming the pins after one trimming, and the inner trimming block is driven by the trimming driving cylinder to move back and forth in the direction of the outer trimming block.
8. The electronic component pin processing device according to claim 1, wherein the transfer mechanisms assembled on the main frame are respectively provided with clamping hands corresponding to the stations, the clamping hands clamp the electronic component and are driven by the transverse transfer driving cylinder to move back and forth on the adjacent stations.
9. The electronic component pin processing apparatus according to claim 3, wherein the leveling mechanism comprises leveling clamping blocks driven by the leveling driving cylinder to move relatively, and the leveling clamping blocks level the pins.

Description

Device for processing pins of electronic element Technical Field The present invention relates to electronic devices, and particularly to a device for processing pins of an electronic device. Background When the electronic component is assembled with a circuit board or other electronic components, the pins of the electronic component are usually required to be changed in shape and shape according to the circuit board or other electronic components, and the existing method for shaping the pins of the electronic component has manual processing or semi-automatic processing, so that the production aging and the efficiency are low, the quality of the produced pins of the product cannot be controlled, the steps of changing the shaping shape of the pins are numerous, the production is influenced by the aging change, the production cost and the labor cost are heavy, and the like, so that the development and the upgrading of the technology for processing the product are required. Disclosure of Invention The invention aims to provide a device for processing pins of an electronic element, which is designed for solving at least one technical problem in the background art. In order to achieve the purpose, the electronic element pin processing device comprises a shaping mechanism, a pre-bending mechanism and a transfer mechanism, wherein the shaping mechanism is arranged on a main machine seat and used for shaping pins, the pre-bending mechanism is used for taking materials and pre-bending the pins, the transfer mechanism is used for clamping the electronic element to perform station transfer, the shaping mechanism is respectively arranged on a primary shaping station and a secondary shaping station, the pre-bending mechanism is arranged on a pre-bending station, and the pre-bending station is arranged on the front end procedure of the primary shaping station. And a trimming mechanism for trimming pins after primary shaping is arranged on the trimming station between the primary shaping station and the secondary shaping station. Wherein, be located the leveling mechanism that is used for carrying out the flattening to the pin on the leveling station that trimming station one side was kept away from to the secondary shaping station. The feeding mechanism for feeding and cutting pins is arranged on a feeding station corresponding to the material taking position of the pre-bending mechanism, and the material discharging position of the feeding mechanism is arranged corresponding to the material taking position of the pre-bending mechanism. The shaping mechanism comprises an inner die part for shaping pins of the electronic element, an outer die part matched with the inner die part and shaping the pins of the electronic element, and pressing die parts for folding and pressing the pins of the electronic element. The pre-bending mechanism comprises a material taking sliding block and a bent pin card, wherein the material taking sliding block slides back and forth on a material taking position and a material starting position, and the bent pin card is arranged on the upper side of the material starting position. The feeding mechanism comprises a feeding guide rail, a feeding gear and a cutting edge roller for cutting pins, wherein a blanking port of the feeding guide rail is correspondingly arranged with gear teeth of the feeding gear, the cutting edge roller is respectively arranged on two sides of the feeding gear, and a blanking position of the feeding gear is correspondingly arranged with a material taking position of the material taking sliding block. The trimming mechanism comprises an inner trimming block and an outer trimming block, wherein the inner trimming block is used for trimming pins after one-time trimming, and the inner trimming block is driven by a trimming driving cylinder to move back and forth towards the direction of the outer trimming block. The transfer mechanism assembled on the main machine base is respectively provided with a clamping hand corresponding to each station, and the clamping hand clamps the electronic element and is driven by the transverse transfer driving cylinder to move back and forth on the adjacent stations. Wherein, leveling mechanism includes the flattening clamp splice that is driven and relative movement by the flattening drive cylinder, and the flattening clamp splice levels the pin. The invention has the advantages that the feeding mechanism, the pre-bending mechanism, the shaping mechanism, the trimming mechanism, the leveling mechanism and the transferring mechanism are arranged, so that the degree of automation of the processing of the pins of the electronic element is improved, the rejection rate and the labor intensity of manual or semi-automatic shaping are obviously reduced, the production time and the production cost of the pin processing process are reduced, and the profit of the product is obviously improved. Drawings FIG. 1 is a schematic diagram of an electronic com