CN-115910905-B - Wafer fixing equipment

CN115910905BCN 115910905 BCN115910905 BCN 115910905BCN-115910905-B

Abstract

The invention discloses wafer fixing equipment, which relates to the technical field of wafer fixing, wherein a cylinder of a driving mechanism and a lifting rod drive a pressing plate of a clamping assembly to move downwards in a limiting block, a roller drives a moving plate to move towards a wafer, a clamping plate on the moving plate clamps and fixes the wafer on a material disc, a plurality of wafers can be clamped and fixed at the same time, when the wafers are loosened, only a piston rod of the cylinder is required to drive the pressing plate to move upwards, the clamping plate can be far away from the wafer under the action of spring force, the wafers are loosened, and the whole process is very convenient for fixing and loosening the wafers.

Inventors

JIANG CHUAN
ZHANG DONGXIANG
YAO JIA
YANG LIPING
XU WANSU

Assignees

安徽天兵电子科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20221024

Claims (3)

1. The wafer fixing equipment is characterized by comprising a workbench (1), an upper footstock (2), clamping assemblies (5) and a driving mechanism (6), wherein the upper footstock (2) is fixed on the workbench (1), a plurality of fixing seats (3) are uniformly distributed along the circumference of the upper footstock (2), each fixing seat (3) is provided with a material disc (4), a plurality of the clamping assemblies (5) are uniformly distributed along the circumference of the material disc (4), and the driving mechanism (6) is arranged in the workbench (1) and is used for driving clamping plates (51) on the clamping assemblies (5) to move so as to fix a wafer; The clamping assembly (5) further comprises a limiting block (52), a moving plate (54), a pressing plate (58) and a spring (57), wherein the limiting block (52) is connected with the material tray (4) through a connecting plate (53), the moving plate (54) is inserted into a mounting groove on the limiting block (52), a clamping plate (51) is fixed at the inner end of the moving plate (54), a guide rod (55) is fixed at the outer end of the moving plate (54), the guide rod (55) is connected onto a support (56) at the outer side of the limiting block (52) in a sliding manner, a retaining tray (561) is fixed at the outer end of the guide rod, the spring (57) is sleeved on the guide rod (55) and is positioned between the support (56) and the retaining tray (561), an opening groove (541) in the moving plate (54) is rotationally connected with a roller (542), the pressing plate (58) is inserted into the limiting block (52) and one side of the pressing plate is provided with an arc-shaped pressing surface (581) which is abutted against the roller (542), and the bottom of the pressing plate (58) is connected with a transverse plate (59), and all plates (59) on the same material tray (4) are connected with the same transverse plate (59); the driving mechanism (6) comprises lifting rods (61) and air cylinders (63), wherein one lifting rod (61) is fixed at the bottom of each connecting disc (591), the lifting rods (61) are connected to the upper top seat (2) in a sliding mode, the lower ends of all the lifting rods (61) are connected to the same lifting plate (62), the cylinder body of each air cylinder (63) is fixed in the workbench (1), and the upper ends of piston rods of the cylinder body are connected with the lifting plate (62); After the wafers to be processed are placed on the material disc (4), after the wafers are placed on the material disc (4), the piston rods of the control cylinders (63) retract, so that the lifting plates (62) and the lifting rods (61) are driven to move downwards, the lifting rods (61) drive the transverse plates (59) and the pressing plates (58) to move downwards through the connecting discs (591), the arc-shaped pressing surfaces (581) on the pressing plates (58) drive the movable plates (54) to move towards the wafers through the rollers (542), the wafers are clamped and fixed through the clamping plates (51) on the movable plates (54), the springs (57) on the guide rods (55) are compressed under the action of the retaining plates (561), then the wafers on the material disc (4) are processed, after the wafers are processed, the piston rods of the control cylinders (63) stretch, so that the pressing plates (58) are driven to move upwards, the movable plates (54) and the clamping plates (51) on the movable plates are driven to move outwards under the action of the elastic force of the springs (57), and the wafers are loosened.
2. A wafer holding apparatus according to claim 1, wherein each of the cross plates (59) is slidably coupled to the guide groove (31) of the holder (3), respectively.
3. A wafer holding apparatus according to claim 1, wherein said clamping plate (51) has an inverted L shape and has a rubber pad (511) provided on an inner wall thereof.

Description

Wafer fixing equipment Technical Field The invention relates to the technical field of wafer fixing, in particular to wafer fixing equipment. Background In the production and manufacturing process of semiconductor devices, in order to ensure the effectiveness of the circuit on the front side of the wafer, the front side of the wafer is processed by a series of processes such as spin coating, exposure, development and the like to provide chips meeting the product requirements, the wafer fixing device cannot be simply placed, and a special device is needed to clamp the wafer fixing device, but the existing wafer fixing device is complex in structure, and only one wafer can be fixed at a time, so that the fixing efficiency of the wafer is low, and the problem needs to be solved. Disclosure of Invention The object of the present invention is to provide a wafer fixing apparatus, which overcomes the above-mentioned drawbacks of the prior art. The wafer fixing device comprises a workbench, an upper top seat, clamping assemblies and a driving mechanism, wherein the upper top seat is fixed on the workbench, a plurality of fixing seats are uniformly distributed along the circumference of the upper top seat, each fixing seat is provided with a material disc, a plurality of the clamping assemblies are uniformly distributed along the circumference of each material disc, and the driving mechanism is arranged in the workbench and used for driving clamping plates on the clamping assemblies to move so as to fix a wafer. Preferably, the clamping assembly further comprises a limiting block, a moving plate, a pressing plate and a spring, wherein the limiting block is connected with the material disc through a connecting plate, the moving plate is inserted into a mounting groove on the limiting block, the clamping plate is fixed at the inner end of the moving plate, the outer end of the moving plate is fixedly provided with a guide rod, the guide rod is slidably connected onto a support on the outer side of the limiting block, the outer end of the guide rod is fixedly provided with a blocking disc, the spring is sleeved on the guide rod and positioned between the support and the blocking disc, an idler wheel is rotationally connected with an opening groove on the moving plate, the pressing plate is inserted into the limiting block, one side of the pressing plate is provided with an arc-shaped pressing surface in contact with the idler wheel, the bottom of the pressing plate is connected with a transverse plate, and all transverse plates on the same material disc are connected with the same connecting disc. Preferably, the driving mechanism comprises lifting rods and air cylinders, one lifting rod is fixed at the bottom of each connecting disc, the lifting rods are slidably connected to the upper top seat, the lower ends of all lifting rods are connected to the same lifting plate, and the cylinder body of each air cylinder is fixed in the workbench, and the upper ends of piston rods of the cylinder body are connected with the lifting plate. Preferably, each transverse plate is respectively and slidably connected in a guide groove on the fixing seat. Preferably, the clamping plate is in an inverted L shape, and a rubber pad is arranged on the inner wall of the clamping plate. The invention has the following advantages: According to the invention, the air cylinder of the driving mechanism and the lifting rod drive the pressing plate of the clamping assembly to move downwards in the limiting block, the roller drives the moving plate to move towards the wafer, the clamping plate on the moving plate clamps and fixes the wafer on the material disc, a plurality of wafers can be clamped and fixed simultaneously, when the wafer is loosened, only the piston rod of the air cylinder drives the pressing plate to move upwards, the clamping plate can be far away from the wafer under the action of spring force, the wafer is loosened, and the whole process is very convenient for fixing and loosening the wafer. Drawings Fig. 1 and 2 are schematic views of the overall three-dimensional structure of the present invention at different angles. Fig. 3 and 4 are schematic views of different angle structures of the invention when the workbench is not installed. Fig. 5 is a partial enlarged view at a in fig. 3. Fig. 6 is a schematic structural view of the driving mechanism of the present invention. Fig. 7 is a schematic view of the structure of the clamping assembly of the present invention. The automatic lifting device comprises a workbench, a top seat, a fixed seat, a 31, a guide groove, a 4, a material disc, a 5, a clamping component, a 51, a clamping plate, a 511, a rubber pad, a 52, a limiting block, a 53, a connecting plate, a 54, a moving plate, a 541, an open slot, a 542, a roller, a 55, a guide rod, a 56, a bracket, a 561, a baffle disc, a 57, a spring, a 58, a pressing plate, 581, an arc-shaped pressing surface, a 59, a transverse plate, 591, a