CN-115922763-B - High-temperature-resistant robot end effector, wafer carrying device and method

CN115922763BCN 115922763 BCN115922763 BCN 115922763BCN-115922763-B

Abstract

The application discloses a high-temperature-resistant mechanical end effector, a wafer carrying device and a high-temperature-resistant mechanical end effector, which comprises an arm and a finger, wherein the tail end of the arm is connected with the finger, the arm comprises a groove, a heat insulation chamber, a vacuum air passage valve and a normal pressure air passage valve are arranged in the groove, the vacuum air passage valve and the normal pressure air passage valve are both connected to the heat insulation chamber, the finger comprises a vacuum air passage and a vacuum chuck, one end of the vacuum air passage is connected with the heat insulation chamber, the other end of the vacuum air passage is connected with the vacuum chuck, when a wafer is required to be adsorbed, the vacuum air passage valve is opened, the normal pressure air passage valve is closed, so that the heat insulation chamber, the vacuum air passage and the vacuum chuck form vacuum, and when the wafer is required to be loosened, the vacuum air passage valve is closed, the normal pressure air passage valve is opened, so that the heat insulation chamber, the vacuum air passage and the vacuum chuck form normal pressure. The application is used for solving the problem that the vacuum adsorption type end effector cannot withstand higher temperature.

Inventors

WANG HEMING
ZHANG JU
JIA HAO
LI JIAXUAN
MIAO YI
ZHU JUNCHI
WANG CHENXU
ZHANG WENLEI
WU YIMING
YANG QI
LIU ENLONG
QU QUANYOU
ZHANG PING
ZHOU WEIQIANG
Nakaka Takashi
Chuan Zheya

Assignees

上海广川科技有限公司

Dates

Publication Date: 20260512
Application Date: 20230131

Claims (9)

1. A high-temperature-resistant mechanical end effector is characterized by comprising an arm and a finger, wherein the tail end of the arm is connected with the finger, the arm comprises a groove, a heat-insulating chamber, a vacuum air passage valve and a normal pressure air passage valve are arranged in the groove, the vacuum air passage valve and the normal pressure air passage valve are connected to the heat-insulating chamber, the finger comprises a vacuum air passage and a vacuum chuck, one end of the vacuum air passage is connected with the heat-insulating chamber, the other end of the vacuum air passage is connected with the vacuum chuck, the internal volume of the heat-insulating chamber is larger than that of the vacuum air passage, when a wafer is required to be adsorbed, the vacuum air passage valve is opened, the normal pressure air passage valve is closed, the sucked high-temperature gas is isolated by the heat-insulating chamber, the vacuum air passage and the vacuum chuck to form vacuum, when the wafer is required to be released, the vacuum air passage valve is opened, and the high-temperature gas in the chamber is blown to the heat-insulating chamber, and the vacuum air passage and the normal pressure chuck are formed.
2. The refractory robotic end effector of claim 1, wherein the arm further comprises a cover plate covering the recess.
3. The high temperature resistant robotic end effector of claim 1, wherein one end of the vacuum gas path valve is connected to the insulating chamber and the other end is connected to a vacuum pump.
4. The high temperature resistant robotic end effector of claim 1, wherein one end of the atmospheric gas circuit valve is connected to the insulating chamber and the other end is connected to an atmospheric gas source.
5. The high temperature resistant robotic end effector of claim 1, wherein the vacuum chuck comprises three suction points, and wherein the three suction points are triangularly distributed in the vacuum chuck.
6. The high temperature resistant robotic end effector of claim 1, wherein said vacuum airway is embedded within said finger.
7. The high temperature resistant robotic end effector of claim 1, wherein the thermally insulating chamber is fabricated from a temperature resistant thermally insulating material.
8. A high temperature resistant wafer handling device comprising the high temperature resistant robotic end effector of any one of claims 1-7.
9. A method of wafer handling using the high temperature resistant robotic end effector of any one of claims 1-7, comprising: When the wafer needs to be adsorbed, the vacuum gas circuit valve is opened, and the normal pressure gas circuit valve is closed, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form vacuum; When the wafer needs to be loosened, the vacuum gas circuit valve is closed, and the normal pressure gas circuit valve is opened, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form normal pressure.

Description

High-temperature-resistant robot end effector, wafer carrying device and method Technical Field The present invention relates to the field of wafer handling, and in particular, to a high temperature resistant robotic end effector, a wafer handling apparatus and a method. Background With the rapid development of high-end wafer fabrication of integrated circuits and the great demands of the market, high-temperature process equipment for wafer fabrication has placed higher demands on the improvement of production efficiency. The traditional wafer conveying mode mainly comprises three modes of clamping type, passive friction type and vacuum adsorption type. For wafers with high temperatures, clamping cannot be used. Passive friction has the natural disadvantages of slow moving speed and low production efficiency. The vacuum adsorption type is a main development direction for improving the conveying efficiency of the high Wen Jingyuan, however, when the vacuum adsorption type is adopted, high-temperature gas in the high-temperature process equipment is sucked into the vacuum pipeline and emits heat to the inside of the end effector along with the vacuum pipeline, so that other electronic components in the end effector can be influenced, the heat insulation effect of the high-temperature pipeline and the passing part of the high-temperature pipeline are subjected to corresponding heat insulation and heat resistance treatment, and the temperature which can be tolerated by the vacuum adsorption type end effector is greatly limited by the factors. Disclosure of Invention The present invention is directed to solving, at least to some extent, one of the problems in the related art. Accordingly, the present invention is directed to a high temperature resistant robotic end effector, wafer handling apparatus and method for solving the problem of inability of a vacuum suction type end effector to withstand higher temperatures. In order to achieve the aim, the application adopts the following technical scheme that the high-temperature-resistant mechanical end effector comprises an arm and a finger, wherein the tail end of the arm is connected with the finger, the arm comprises a groove, and a heat insulation chamber, a vacuum gas circuit valve and a normal pressure gas circuit valve are arranged in the groove; the finger comprises a vacuum air passage and a vacuum sucker, one end of the vacuum air passage is connected with the heat insulation chamber, and the other end of the vacuum air passage is connected with the vacuum sucker; When the wafer needs to be adsorbed, the vacuum gas circuit valve is opened, and the normal pressure gas circuit valve is closed, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form vacuum; When the wafer needs to be loosened, the vacuum gas circuit valve is closed, and the normal pressure gas circuit valve is opened, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form normal pressure. Further, the arm further comprises a cover plate covering the groove. Further, the internal volume of the insulating chamber is greater than the internal volume of the vacuum airway. Further, one end of the vacuum gas circuit valve is communicated to the heat insulation chamber, and the other end of the vacuum gas circuit valve is connected with the vacuum pump. Further, one end of the normal pressure gas circuit valve is communicated with the heat insulation chamber, and the other end of the normal pressure gas circuit valve is connected with a normal pressure gas source. Further, the vacuum chuck comprises three adsorption points, and the three adsorption points are distributed in a triangle in the vacuum chuck. Further, the vacuum airway is embedded inside the finger. Further, the heat-insulating chamber is made of a temperature-resistant heat-insulating material. A high temperature resistant wafer handling device includes a high temperature resistant robotic end effector as described above. A method of wafer handling using a high temperature resistant robotic end effector as described above, comprising: When the wafer needs to be adsorbed, the vacuum gas circuit valve is opened, and the normal pressure gas circuit valve is closed, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form vacuum; When the wafer needs to be loosened, the vacuum gas circuit valve is closed, and the normal pressure gas circuit valve is opened, so that the heat insulation chamber, the vacuum gas channel and the vacuum chuck form normal pressure. Compared with the prior art, the end effector provided by the embodiment of the application has the advantages that the end effector comprises an arm and a finger, the tail end of the arm is connected with the finger, the arm comprises a groove, a heat insulation chamber, a vacuum air passage valve and a normal pressure air passage valve are arranged in the groove, the vacuum air passage valve and