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CN-115960391-B - Silica dispersion, method for producing the same, resin composition and use thereof

CN115960391BCN 115960391 BCN115960391 BCN 115960391BCN-115960391-B

Abstract

The application relates to a silicon dioxide dispersion and a preparation method thereof, a resin composition and application thereof, wherein the silicon dioxide dispersion comprises, by mass, 50-80 parts of silicon dioxide, 0.2-1 part of a wetting agent, 0.3-1 part of a silane coupling agent, 0.5-2 parts of a dispersing agent and 16-49 parts of a solvent, the wetting agent is at least one selected from polyether modified gemini polysiloxane wetting agents and polyether modified hydroxyl-containing polydimethylsiloxane wetting agents, and the mass ratio of the wetting agent to the silicon dioxide is 1 (100-160). The silica dispersion has higher solid content, better dispersibility, stable placement for more than 280 days, smaller particle size change and better storage stability by adopting the specific type of wetting agent to act with the silica, further acting with the silane coupling agent and the dispersing agent and controlling the proportion among the components, especially the addition amount of the wetting agent.

Inventors

  • GUO YONGJUN
  • CHEN JIANXIONG
  • WEN WENYAN

Assignees

  • 广东盈骅新材料科技有限公司

Dates

Publication Date
20260512
Application Date
20221229

Claims (6)

  1. 1. A silica dispersion characterized by comprising the following components in parts by mass: 50-80 parts of silicon dioxide, 0.4-1 Part of wetting agent, 0.5-1 Part of silane coupling agent, 1-2 Parts of dispersing agent 16-49 Parts of a solvent; The wetting agent is at least one of polyether modified gemini polysiloxane wetting agent and polyether modified hydroxyl-containing polydimethylsiloxane wetting agent, specifically at least one of TEGO Twin 4000, LD-8400, rianPont2504, 8530H and BYK-377, the mass ratio of the wetting agent to the silicon dioxide is 1 (100-160), the silane coupling agent is at least one of KBE-1003 and KBE-403, the dispersing agent is at least one of TEGO Dispers 655 and BYK DISERBYK-2055, the D50 particle size of the silicon dioxide is 2-5 mu m, and the solvent is at least one of butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether acetate and N, N-dimethylformamide; the preparation method of the silicon dioxide dispersion comprises the following steps: Providing a feedstock in accordance with the composition of the silica dispersion; mixing a wetting agent, a silane coupling agent, a solvent and silicon dioxide, and then carrying out first stirring to obtain first slurry, wherein the first stirring time is 20-40 min; Mixing the first slurry with a dispersing agent, and then carrying out second stirring to obtain second slurry, wherein the sum of the time of the first stirring and the time of the second stirring is 65-125 min; And (3) sanding the second slurry to obtain a silicon dioxide dispersion, wherein the sanding time is 45-180 min, and the feeding flow is 0.8L/min-3L/min.
  2. 2. The silica dispersion according to claim 1, characterized in that it comprises the following components in parts by mass: 50-80 parts of silicon dioxide, 0.5-1 Part of wetting agent, 0.8-1 Part of silane coupling agent, 1.5-2 Parts of dispersing agent 16-49 Parts of a solvent.
  3. 3. The silica dispersion according to claim 1, characterized in that it comprises the following components in parts by mass: 50-80 parts of silicon dioxide, 0.5 To 0.8 part of wetting agent, 0.9-1 Part of silane coupling agent, 1.8-2 Parts of dispersing agent 16-49 Parts of a solvent.
  4. 4. A method for preparing a silica dispersion, comprising the steps of: A component of a silica dispersion according to any one of claims 1 to 3 providing a feedstock; mixing a wetting agent, a silane coupling agent, a solvent and silicon dioxide, and then carrying out first stirring to obtain first slurry, wherein the first stirring time is 20-40 min; Mixing the first slurry with a dispersing agent, and then carrying out second stirring to obtain second slurry, wherein the sum of the time of the first stirring and the time of the second stirring is 65-125 min; And (3) sanding the second slurry to obtain a silicon dioxide dispersion, wherein the sanding time is 45-180 min, and the feeding flow is 0.8L/min-3L/min.
  5. 5. A resin composition comprising the silica dispersion according to any one of claims 1 to 3.
  6. 6. Use of the resin composition according to claim 5 for the preparation of integrated circuit substrates.

Description

Silica dispersion, method for producing the same, resin composition and use thereof Technical Field The application relates to the technical field of materials, in particular to a silicon dioxide dispersion, a preparation method thereof, a resin composition and application thereof. Background As integrated circuits move toward miniaturization and high performance, flexible thin substrates are widely used. The thin substrate is mainly composed of a resin composition, and comprises various types of materials such as metal, dielectric materials, composite materials and the like. Since the difference in Coefficient of Thermal Expansion (CTE) values of the respective materials is liable to occur a warpage phenomenon of the sheet, a high loading amount of silica, particularly, silica having a D50<5 μm is often added to the resin composition to reduce the CTE difference. However, silica having a small particle diameter is easily agglomerated in a resin system due to a large specific surface area. The conventional method involves surface modification of silica to prepare slurry, which is then put into a resin composition, but the conventional silica slurry has problems of low solid content and poor storage stability. It is therefore of great importance to provide a silica dispersion having a higher solids content and a better storage stability. Disclosure of Invention Based on the above, the application provides a silica dispersion with higher solid content and better storage stability, a preparation method thereof, a resin composition and application thereof. The technical scheme for solving the technical problems is as follows. The silica dispersion comprises the following components in parts by mass: The wetting agent is at least one selected from polyether modified gemini polysiloxane wetting agent and polyether modified hydroxyl-containing polydimethylsiloxane wetting agent, and the mass ratio of the wetting agent to the silicon dioxide is 1 (100-160). In some of these embodiments, the wetting agent is selected from at least one of TEGO Tain 4000, LD-8400, rianPont2504, 8530H, and BYK-377. In some of these embodiments, the silica dispersion wherein the silane coupling agent is selected from at least one of an epoxy silane coupling agent, an amino silane coupling agent, a vinyl silane coupling agent, an acrylate silane coupling agent, and an isocyanate silane coupling agent. In some of these embodiments, the silane coupling agent is selected from at least one of KBE-1003 and KBE-403 in the silica dispersion. In some embodiments, the silica dispersion is at least one dispersant selected from polyether dispersants, polyester dispersants, polyurethane dispersants, polyacrylate dispersants, polyamide dispersants, and polyphosphate dispersants. In some of these embodiments, the dispersant is selected from at least one of TEGO Dispers670 and BYK DIPERBYK-2055. In some of these embodiments, the solvent is selected from at least one of butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether acetate, toluene, xylene, and N, N-dimethylformamide. In some of these embodiments, the silica has a particle size of 0.5 μm to 25 μm in the silica dispersion. The application provides a preparation method of a silicon dioxide dispersion, which comprises the following steps: Providing a feedstock in accordance with the components of the silica dispersion described above; Mixing a wetting agent, a silane coupling agent, a solvent and silicon dioxide, and then carrying out first stirring to obtain first slurry, wherein the first stirring time is 20-40 min; Mixing the first slurry and the dispersing agent, and then carrying out second stirring to obtain second slurry, wherein the sum of the time of the first stirring and the time of the second stirring is 65-125 min; And (3) sanding the second slurry to obtain a silicon dioxide dispersion, wherein the sanding time is 45-180 min, and the feeding flow is 0.8-3L/min. The present application provides a resin composition comprising the above silica dispersion. The application provides application of the resin composition in preparing an integrated circuit substrate. Compared with the prior art, the silica dispersion of the application has the following beneficial effects: the silica dispersion has high solid content up to 83.5%, good dispersivity, stable standing for more than 280 days, small particle size change and good storage stability by adopting the specific wetting agent to act with the silica, further acting with the silane coupling agent and the dispersing agent and controlling the proportion among the components, especially the addition amount of the wetting agent. Detailed Description The technical scheme of the application is further described in detail below with reference to specific embodiments. The present application may be embodied in many different forms and is not limited to the embodiments described herein. It should be understood that these