CN-115968136-B - Wiring board and method for manufacturing wiring board

Abstract

The invention provides a wiring board and a method for manufacturing the wiring board, which can precisely control the thickness of a conductor layer embedded in an insulating layer in a printed wiring board. A method for manufacturing a wiring board according to an embodiment includes the steps of forming a 1 st resin insulating layer (111) and a 2 nd resin insulating layer (112) in contact with the upper surface of the 1 st resin insulating layer (111), forming recesses (op 1, op 2) by irradiation of laser light, the recesses (op 1, op 2) penetrating the 2 nd resin insulating layer (112) and exposing the 1 st resin insulating layer (111) at the bottom, and filling the recesses (op 1, op 2) with a conductor to form a 1 st conductor layer (121) having a form embedded in the 2 nd resin insulating layer (112). The 1 st resin insulation layer (111) and the 2 nd resin insulation layer (112) have different workability with respect to laser light.

Inventors

• ADACHI TAKEMA
• IGAWA YUUJI

Assignees

• 揖斐电株式会社

Dates

Publication Date

20260505

Application Date

20221008

Priority Date

20211008

Claims (13)

1. 1. A method for manufacturing a wiring board includes the steps of: forming a1 st resin insulation layer and a2 nd resin insulation layer in contact with an upper surface of the 1 st resin insulation layer; Forming a recess penetrating the 2 nd resin insulating layer and exposing the 1 st resin insulating layer at the bottom by irradiation of laser light, and Filling the recess with a conductor to form a1 st conductor layer having a form buried in the 2 nd resin insulation layer, wherein, The 1 st resin insulation layer and the 2 nd resin insulation layer are different in workability with respect to the laser light.
2. 2. The method for manufacturing a wiring substrate according to claim 1, wherein, The depth of the recess and the thickness of the 1 st conductor layer are formed to have dimensions substantially equal to the thickness of the 2 nd resin insulation layer.
3. 3. The method for manufacturing a wiring substrate according to claim 1, wherein, The absorption coefficient of the 2 nd resin insulating layer with respect to the laser light is larger than that of the 1 st resin insulating layer with respect to the laser light.
4. 4. The method for manufacturing a wiring substrate according to claim 3, wherein, The volume content of the curing accelerator contained in the 2 nd resin insulating layer is smaller than the volume content of the curing accelerator contained in the 1 st resin insulating layer.
5. 5. The method for manufacturing a wiring substrate according to claim 3, wherein, The volume content of the curing inhibitor contained in the 2 nd resin insulating layer is larger than the volume content of the curing inhibitor contained in the 1 st resin insulating layer.
6. 6. The method for manufacturing a wiring substrate according to claim 5, wherein, The cure inhibitor is a pigment.
7. 7. The method for manufacturing a wiring substrate according to claim 1, wherein, The 2 nd resin insulating layer contains an amorphous resin, The 1 st resin insulation layer contains a crystalline resin.
8. 8. The method for manufacturing a wiring substrate according to claim 1, wherein, The volume content of the inorganic filler contained in the 1 st resin insulating layer is larger than the volume content of the inorganic filler contained in the 2 nd resin insulating layer.
9. 9. The method for manufacturing a wiring substrate according to claim 8, wherein, The inorganic filler contained in the 1 st resin insulation layer has an average particle diameter larger than that of the inorganic filler contained in the 2 nd resin insulation layer.
10. 10. The method for manufacturing a wiring substrate according to claim 1, wherein, The concave portion is formed by irradiation of an excimer laser.
11. 11. A wiring substrate is provided with: 1 st resin insulation layer, and A2 nd resin insulation layer formed in contact with an upper surface of the 1 st resin insulation layer, Wherein, the The wiring board further has a recess penetrating the 2 nd resin insulation layer and exposing the 1 st resin insulation layer at the bottom, The recess is filled with the 1 st conductor layer, All of the conductor layers formed on the upper surface of the 1 st resin insulation layer are the 1 st conductor layers filled in the recess, The 2 nd resin insulating layer and the 1 st resin insulating layer are different in workability with respect to laser light.
12. 12. The wiring substrate according to claim 11, wherein, The thickness of the 1 st conductor layer is substantially equal to the thickness of the 2 nd resin insulation layer.
13. 13. The wiring substrate according to claim 11, wherein, The volume content of the inorganic filler contained in the 2 nd resin insulating layer is smaller than the volume content of the inorganic filler contained in the 1 st resin insulating layer.

Description

Wiring board and method for manufacturing wiring board Technical Field The present invention relates to a wiring board and a method for manufacturing the wiring board. Background Patent document 1 discloses a printed wiring board including a 1 st insulating layer, a2 nd insulating layer formed on the 1 st insulating layer, a recess formed in the 2 nd insulating layer, and a2 nd conductor circuit formed by filling the recess of the 2 nd insulating layer. By performing laser processing on the 2 nd insulating layer, the recess filled with the conductor constituting the 2 nd conductor circuit is formed to a depth smaller than the thickness of the 2 nd insulating layer. Patent document 1 International publication No. 2010/004841 Disclosure of Invention In the method for manufacturing a printed wiring board disclosed in patent document 1, since it is necessary to stop laser processing at the middle in the thickness direction of the 2 nd insulating layer during formation of the recess, it is considered that it is difficult to precisely control the depth of the recess. It is considered that the thickness of the 2 nd conductor circuit formed in the concave portion is difficult to be precisely formed to a desired thickness. A method for manufacturing a wiring board according to an embodiment of the present invention includes the steps of forming a1 st resin insulating layer and a2 nd resin insulating layer in contact with an upper surface of the 1 st resin insulating layer, forming a recess through the 2 nd resin insulating layer by irradiation of laser light to expose the 1 st resin insulating layer at a bottom, and filling the recess with a conductor to form a1 st conductor layer having a form buried in the 2 nd resin insulating layer. The 1 st resin insulation layer and the 2 nd resin insulation layer are different in workability with respect to the laser light. The wiring board according to an embodiment of the present invention includes a1 st resin insulating layer and a2 nd resin insulating layer formed so as to be in contact with an upper surface of the 1 st resin insulating layer. The wiring board further has a recess penetrating the 2 nd resin insulating layer and exposing the 1 st resin insulating layer at the bottom, and the recess is filled with the 1 st conductor layer. According to the embodiment of the present invention, a wiring board in which the thickness of a conductor layer having a form embedded in an insulating layer is precisely controlled can be provided. Drawings Fig. 1 is a cross-sectional view showing an example of a wiring board according to an embodiment of the present invention. Fig. 2 is a partial enlarged view of fig. 1 showing an example of a wiring board according to an embodiment of the present invention. Fig. 3A is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3B is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3C is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3D is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3E is a partial enlarged view showing a cross-sectional view of a method for manufacturing a wiring board according to an embodiment. Fig. 3F is a partial enlarged view showing a cross-sectional view of a method for manufacturing a wiring board according to an embodiment. Fig. 3G is a partial enlarged view showing a cross-sectional view of a method for manufacturing a wiring board according to an embodiment. Fig. 3H is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3I is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Fig. 3J is a cross-sectional view showing a method for manufacturing a wiring board according to an embodiment. Description of the reference numerals 1 Wiring substrate, 101, 11, 21 insulating layer, 111 1 st resin insulating layer, 112 nd resin insulating layer, 102, 12, 22 conductor layer, 121 st conductor layer, 10 st 1 st laminated portion, 20 nd laminated portion, 110, 210 insulating layer (solder resist layer), op1, op2 concave portion, FW wiring, L pad portion, D depth, T thickness. Detailed Description A wiring board according to an embodiment of the present invention will be described with reference to the drawings. In the following, the drawings to which reference is made are not intended to illustrate the exact proportions of the components, but are drawn so as to facilitate understanding of the features of the present invention. Fig. 1 shows a cross-sectional view of a wiring board 1 as an example of a structure that a wiring board according to an embodiment can have. As shown in fig. 1, the wiring board 1 has a core substrate 100, and the core substrate 100 includes an insulating layer (core insulatin