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CN-115986552-B - Laser device

CN115986552BCN 115986552 BCN115986552 BCN 115986552BCN-115986552-B

Abstract

The application discloses a laser, and belongs to the technical field of photoelectricity. The laser comprises a substrate, a first frame, a packaging structure, a light emitting chip, a wavelength conversion component and a sealing cover, wherein the substrate is fixed with the first frame and surrounds a groove, the packaging structure, the light emitting chip and the wavelength conversion component are located in the groove, the sealing cover is fixed with one side, away from the substrate, of the first frame, the sealing cover is used for sealing the groove, the packaging structure is used for forming a sealing space, the light emitting chip is located in the sealing space, the packaging structure is provided with a target side wall which is located at the light emitting side of the light emitting chip and transmits light, laser emitted by the light emitting chip is emitted through the target side wall, the wavelength conversion component is located on a transmission path of the laser emitted from the packaging structure, the wavelength conversion component is used for emitting fluorescence under the excitation of the laser, and the color of the fluorescence is different from that of the laser. The application solves the problem of poor flexibility of the laser. The application is used for emitting light.

Inventors

  • ZHOU ZINAN
  • TIAN YOULIANG
  • LU YAO
  • Guo Zhaoshi

Assignees

  • 青岛海信激光显示股份有限公司

Dates

Publication Date
20260505
Application Date
20230110

Claims (9)

  1. 1. The laser is characterized by comprising a substrate, a first frame body, a packaging structure, a light emitting chip, a wavelength conversion component and a sealing cover; the substrate is fixed with the first frame body, a groove is formed by surrounding the substrate, and the packaging structure, the light emitting chip and the wavelength conversion component are positioned in the groove; The packaging structure is used for forming a sealing space, the light-emitting chip is positioned in the sealing space, the packaging structure is provided with a target side wall which is positioned on the light-emitting side of the light-emitting chip and transmits light, and laser emitted by the light-emitting chip passes through the target side wall to be emitted; the wavelength conversion component is positioned on a transmission path of the laser emitted from the packaging structure and is used for emitting fluorescence under the excitation of the laser, and the color of the fluorescence is different from that of the laser; the packaging structure is characterized in that other surfaces except the target side wall are coated with light absorption materials; the laser comprises a plurality of packaging structures and a plurality of light emitting chips which are in one-to-one correspondence, and each light emitting chip is positioned in a sealing space formed by the corresponding packaging structure; the arrangement positions of the plurality of packaging structures in the grooves are symmetrical about a target axis, the target axis is a straight line passing through the center of the wavelength conversion component and parallel to the board surface of the substrate, and the plurality of light emitting chips are all used for emitting laser to the wavelength conversion component; in the mounting process of the wavelength converter, the light emitting chip is lightened, and the position of the wavelength converter is set based on the irradiation position of laser emitted by the light emitting chip and the size and shape of a light spot; The airtight level in the sealed space formed by the packaging structure and the containing space enclosed by the substrate and the first frame body is lower than 10 -8 Pa cubic meters per second.
  2. 2. The laser according to claim 1, wherein the first frame body comprises a plurality of side walls connected in sequence, and the side wall of the first frame body on the light emitting side of the light emitting chip is provided with an opening and a light transmitting layer covering the opening; the laser emitted from the packaging structure is emitted to the light-transmitting layer, and the light-transmitting layer is used for transmitting the received light; The wavelength conversion component is located between the encapsulation structure and the light-transmitting layer.
  3. 3. The laser of claim 2, wherein the wavelength conversion member is affixed to the light transmissive layer and/or the area of the wavelength conversion member is smaller than the area of the light transmissive layer.
  4. 4. The laser of claim 1, further comprising a reflective prism located in the recess on a side of the target sidewall remote from the light emitting chip; The laser emitted from the packaging structure is emitted to the reflecting prism, the reflecting prism is used for reflecting received light to the sealing cover along the direction away from the substrate, and the sealing cover is also used for transmitting the received light; The wavelength conversion component is positioned between the packaging structure and the reflecting prism, or between the reflecting prism and the sealing cover.
  5. 5. The laser of any one of claims 1 to 4, wherein the package structure comprises a second frame and an upper cover, the second frame comprises the target side wall and other side walls connected with the target side wall, the second frame is fixed with the substrate, the light emitting chip is positioned on the substrate and is surrounded by the second frame, the upper cover and one side of the second frame away from the substrate are fixed, and the sealing space is surrounded by the package structure and the substrate; Or the packaging structure comprises a bottom plate, a second frame body and an upper cover, wherein the second frame body comprises the target side wall and other side walls connected with the target side wall, the bottom plate is fixed with the second frame body, the light emitting chip is positioned on the bottom plate and surrounded by the second frame body, the upper cover and the second frame body are fixed on one side far away from the bottom plate, and the sealing space is surrounded by the packaging structure.
  6. 6. The laser according to any one of claims 1 to 4, wherein the first frame body comprises an annular plate and a plurality of side walls which are positioned on the annular plate and are sequentially connected, and a conductive structure which is used for communicating the inside and the outside of an enclosed area of the first frame body is arranged in the annular plate; The light-emitting chip is positioned on the substrate, and the light-emitting chip is electrically connected with one end of the conductive structure, which is positioned in the surrounding area of the first frame body.
  7. 7. The laser according to any one of claims 1 to 4, further comprising a collimating lens, wherein the collimating lens is positioned on one side of the side wall of the target in the groove away from the light emitting chip, the laser emitted from the package structure is emitted to the collimating lens, the collimating lens is used for collimating the received laser and emitting the laser emitted to the wavelength conversion component as the laser collimated by the collimating lens; or the target side wall is provided with a convex cambered surface protruding towards the inside of the sealed space or the outside of the sealed space, and the target side wall is also used for emitting the received laser after collimation.
  8. 8. The laser of any one of claims 1 to 4, wherein the target sidewall has a convex arc surface protruding into or out of the sealed space, the target sidewall further being configured to collimate the received laser light for emission; The laser also comprises a heat sink positioned in the sealed space, the light-emitting chip is positioned on one side of the heat sink away from the substrate, one end of the heat sink, which is close to the target side wall, is provided with a limiting boss, the limiting boss is positioned outside the setting area of the light-emitting chip, and the limiting boss is propped against the target side wall.
  9. 9. The laser of any one of claims 1 to 4, wherein the material of the first frame comprises ceramic and/or the material of the substrate comprises a composite of copper and diamond.

Description

Laser device Technical Field The application relates to the technical field of photoelectricity, in particular to a laser. Background With the development of photoelectric technology, lasers are widely used, and the requirements on the lasers are also increasing. In the related art, a laser includes a base plate, a frame body, and a light emitting chip, and the base plate and the frame body enclose a groove in which the light emitting chip is located. The light-emitting chip emits laser, and the laser can emit the groove so as to realize the light emission of the laser. In the related art, the color of the laser emitted by the laser is only determined by the light emitting chip, and the flexibility of the use of the laser is low. Disclosure of Invention The application provides a laser which can solve the problem of poor use flexibility of the laser. The laser comprises a substrate, a first frame body, a packaging structure, a light emitting chip, a wavelength conversion component and a sealing cover; the substrate is fixed with the first frame body, a groove is formed by surrounding the substrate, and the packaging structure, the light emitting chip and the wavelength conversion component are positioned in the groove; The packaging structure is used for forming a sealing space, the light-emitting chip is positioned in the sealing space, the packaging structure is provided with a target side wall which is positioned on the light-emitting side of the light-emitting chip and transmits light, and laser emitted by the light-emitting chip passes through the target side wall to be emitted; the wavelength conversion component is positioned on a transmission path of the laser emitted from the packaging structure and is used for emitting fluorescence under the excitation of the laser, and the color of the fluorescence is different from that of the laser. The technical scheme provided by the application has the beneficial effects that at least: In the laser provided by the application, the wavelength conversion component can be arranged on the transmission path of the laser emitted by the light emitting chip, and the laser emitted by the light emitting chip can excite the wavelength conversion component to emit fluorescence. The laser can emit fluorescence, the light emitted by the laser is not only determined by the light emitting chip, the use flexibility of the laser is high, the laser can be applied to a scene needing fluorescence, and the application scene of the laser can be enriched. In addition, the packaging structure, the light emitting chip and the wavelength conversion component in the laser are all located in a groove formed by the substrate and the first frame body in a surrounding mode, the light emitting chip is located in a sealing space formed by the packaging structure, and the groove is sealed through a sealing cover. When the laser is assembled, the light emitting chip can be arranged in the groove and sealed by adopting a sealing structure, then the light emitting chip is lightened so as to adjust the mounting position of the wavelength conversion component based on the irradiation condition of laser emitted by the light emitting chip, and then the groove is sealed by adopting a sealing cover. Therefore, the light-emitting chip is packaged twice, the whole package can be ensured to meet the sealing requirement of the laser, the mounting position of the wavelength conversion component can be actively regulated, the fluorescent light emitted by the final wavelength conversion component is ensured to meet the requirement, and the light emitting effect of the laser is further improved. Drawings In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic structural diagram of a laser according to an embodiment of the present application; FIG. 2 is a schematic diagram of another laser according to an embodiment of the present application; Fig. 3 is a schematic view of a part of a structure of a laser according to an embodiment of the present application; FIG. 4 is a schematic diagram of another laser according to an embodiment of the present application; FIG. 5 is a schematic diagram of another laser according to an embodiment of the present application; FIG. 6 is a schematic diagram of a laser according to another embodiment of the present application; FIG. 7 is a schematic diagram of another laser according to another embodiment of the present application; FIG. 8 is a schematic diagram of a laser according to another embodiment of the present application; FIG. 9 is a schematic diagram of a laser accordi