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CN-115988846-B - Cold plate radiator

CN115988846BCN 115988846 BCN115988846 BCN 115988846BCN-115988846-B

Abstract

According to an embodiment of the present disclosure, there is provided a cold plate heat sink including an outer frame including aluminum and provided with an inner space for accommodating a cooling liquid, a first outer surface of the outer frame for contacting an electronic device to be cooled, heat exchange fins including aluminum and provided in the inner space, a sacrificial anode material layer in contact with at least one outer surface of the outer frame other than the first outer surface, the sacrificial anode material layer including a metal material having a higher metal activity than aluminum, and an oxide limiting portion surrounding the sacrificial anode material layer to prevent an oxide formed of the metal material from being detached from the cold plate heat sink.

Inventors

  • TIAN TING
  • GUO XIAOLIANG
  • JING TANGBO
  • GUI CHENGLONG
  • ZHANG QI
  • WANG JIAN

Assignees

  • 北京有竹居网络技术有限公司

Dates

Publication Date
20260512
Application Date
20230120

Claims (9)

  1. 1. A cold plate heat sink (10), comprising: an outer frame (11) comprising aluminum and provided with an inner space (110) for accommodating a cooling liquid, a first outer surface (111) of the outer frame (11) for contacting an electronic device (20) to be cooled; a heat exchange fin (12) comprising aluminum and disposed in the interior space (110); a sacrificial anode material layer (13) in contact with at least one outer surface of the outer frame (11) different from the first outer surface (111), the sacrificial anode material layer (13) comprising a metal material having a higher metal activity than aluminum, and An oxide limiting portion (14) surrounding the sacrificial anode material layer (13) to prevent an oxide formed of the metal material from being detached from the cold plate heat sink (10).
  2. 2. The cold plate heat sink (10) according to claim 1, wherein the oxide limiter (14) comprises a gas permeable coating (141), the gas permeable coating (141) covering the sacrificial anode material layer (13), the gas permeable coating (141) allowing air to permeate and preventing oxides formed from the metallic material from escaping from the gas permeable coating (141).
  3. 3. Cold plate heat sink (10) according to claim 2, wherein the air-permeable cladding layer (141) is formed on the sacrificial anode material layer (13) by a spray process.
  4. 4. Cold plate heat sink (10) according to claim 2, wherein the layer of sacrificial anode material (13) comprises a magnesium alloy.
  5. 5. The cold plate heat sink (10) according to claim 1, wherein the oxide limiter (14) comprises a cavity (142), the cavity (142) surrounding the sacrificial anode material layer (13).
  6. 6. The cold plate heat sink (10) according to claim 5, wherein the cavity (142) is closed.
  7. 7. The cold plate heat sink (10) according to claim 6, wherein the sacrificial anode material layer (13) comprises magnesium or a magnesium alloy.
  8. 8. The cold plate heat sink (10) according to claim 5, wherein at least one vent is formed in a wall of the cavity (142), the at least one vent allowing air to pass therethrough and preventing an oxide formed of the metallic material from escaping from the cavity (142).
  9. 9. The cold plate heat sink (10) according to claim 8, wherein the sacrificial anode material layer (13) comprises a magnesium alloy.

Description

Cold plate radiator Technical Field Embodiments of the present disclosure relate generally to the field of electronic device cooling technology, and more particularly, to a cold plate heat sink. Background The energy consumption of the data center is increased, and the traditional air cooling heat dissipation scheme has low heat dissipation efficiency and needs to consume a large amount of energy, so that the requirements of the data center cannot be met in terms of cooling capacity and economic feasibility. The liquid cooling heat dissipation scheme is an important technical direction for data center construction due to high heat dissipation efficiency. One more sophisticated liquid-cooled heat dissipation scheme is cold plate liquid cooling. Copper is widely adopted in the field of cold plate liquid cooling to manufacture cold plates at present. Copper has good heat conduction performance and is easier to mold, and the passivated copper has good corrosion resistance and scouring resistance and high reliability. The most mature cold plate material is copper C1100 or C1020. However, the material cost of the copper cold plate is high. In the case of large-scale deployment of cold plate liquid-cooled servers, the cost of the cold plate is an important factor to consider, and how to optimize the cost is a goal of concern. Accordingly, there is a need for an improved cold plate liquid cooling scheme. Disclosure of Invention It is an object of the present disclosure to provide a cold plate heat sink that at least partially solves the above-mentioned problems, as well as other potential problems. In one aspect of the present disclosure, a cold plate heat sink is provided, including an outer frame including aluminum and provided with an inner space for accommodating a cooling liquid, a first outer surface of the outer frame for contacting an electronic device to be cooled, heat exchange fins including aluminum and provided in the inner space, a sacrificial anode material layer in contact with at least one outer surface of the outer frame other than the first outer surface, the sacrificial anode material layer including a metal material having a higher metal activity than aluminum, and an oxide limiting portion surrounding the sacrificial anode material layer to prevent an oxide formed of the metal material from being detached from the cold plate heat sink. In some embodiments, the oxide limiter includes a gas permeable coating covering the sacrificial anode material layer, the gas permeable coating allowing air to permeate and preventing oxides formed from the metallic material from separating from the gas permeable coating. In some embodiments, the gas permeable coating is formed on the layer of sacrificial anode material by a spray process. In some embodiments, the sacrificial anode material layer comprises a magnesium alloy. In some embodiments, the oxide limiter comprises a cavity surrounding the layer of sacrificial anode material. In some embodiments, the cavity is closed. In some embodiments, the sacrificial anode material layer comprises magnesium or a magnesium alloy. In some embodiments, at least one vent is formed in a wall of the cavity, the at least one vent allowing air to permeate therethrough and preventing oxides formed from the metallic material from escaping from the cavity. In some embodiments, the sacrificial anode material layer comprises a magnesium alloy. In embodiments according to the present disclosure, by manufacturing the outer frame and the heat exchange fins of the cold plate using an aluminum-containing material, the cost of the cold plate server can be significantly reduced. In the case of using an aluminum outer frame and heat exchange fins, erosion corrosion can be slowed down by adding a sacrificial anode material layer to protect the outer frame and heat exchange fins. In addition, the oxide powder formed by the sacrificial anode material layer can be prevented from falling onto the electronic device by the oxide restricting portion, thereby avoiding contamination and preventing short circuit. It should be understood that what is described in this section of content is not intended to limit key features or essential features of the embodiments of the present disclosure nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description. Drawings The above and other features, advantages and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, wherein like or similar reference numerals denote like or similar elements, in which: FIG. 1 shows a schematic structural view of a cold plate heat sink according to one embodiment of the present disclosure, and Fig. 2 illustrates a schematic structural view of a cold plate heat sink according to another em