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CN-115988847-B - Immersion liquid cooling system

CN115988847BCN 115988847 BCN115988847 BCN 115988847BCN-115988847-B

Abstract

According to an embodiment of the present disclosure, there is provided an immersion liquid cooling system including an immersion tank for accommodating a cooling liquid and an electronic apparatus to be cooled, the electronic apparatus to be cooled being at least partially immersed in the cooling liquid and having an air chamber formed therein above a liquid surface of the cooling liquid, a heat exchange unit for cooling the cooling liquid with an external cooling source, and a bubble generation device including an air pump connected to the air pump and the air exhaust pipe to suck air through the air pump and exhaust air through the air exhaust pipe, an air suction port of the air pump being provided in the air chamber, and an air exhaust pipe connected to the air bubble exhaust passage, the air bubble exhaust passage being provided below the electronic apparatus to be cooled, and the air bubble exhaust passage including a plurality of air ejection holes for ejecting air bubbles toward the electronic apparatus to be cooled.

Inventors

  • TIAN TING
  • ZHANG QI
  • JING TANGBO
  • WANG JIAN

Assignees

  • 北京有竹居网络技术有限公司

Dates

Publication Date
20260512
Application Date
20230120

Claims (12)

  1. 1. An immersion liquid cooling system comprising: -an immersion tank (11) for containing a cooling liquid and an electronic device (10) to be cooled, the electronic device (10) to be cooled being at least partially immersed in the cooling liquid, and an air cavity (17) being formed in the immersion tank (11) above the liquid level (13) of the cooling liquid; a heat exchange unit (25) for cooling the cooling liquid by using an external cold source, and A bubble generating apparatus (3) including an air pump (30), an air suction pipe (31), an air discharge pipe (32), and a bubble discharge passage (33), the air pump (30) being connected to the air suction pipe (31) and the air discharge pipe (32) to suck air via the air suction pipe (31) and discharge air via the air discharge pipe (32), an air suction port (311) of the air suction pipe (31) being provided in the air chamber (17), the air discharge pipe (32) being connected to the bubble discharge passage (33), the bubble discharge passage (33) being provided below the electronic device (10) to be cooled, and the bubble discharge passage (33) including a plurality of air ejection holes (331) for ejecting air bubbles toward the electronic device (10) to be cooled; The bubble discharge channel (33) is located within the immersion tank (11), the heat exchange unit (25) is disposed between the electronic device (10) to be cooled and the bubble discharge channel (33), and the plurality of air ejection holes (331) are arranged to face the heat exchange unit (25).
  2. 2. The immersion liquid cooling system according to claim 1, wherein the heat exchange unit (25) is connected to the external cold source via an external cold feed pipe (23) and an external cold return pipe (24).
  3. 3. The immersion liquid cooling system of claim 1, wherein the plurality of gas injection holes (331) comprises a plurality of groups of gas injection holes (331) spaced apart from each other.
  4. 4. The immersion liquid cooling system according to claim 1, wherein the air pump (30) is provided in the immersion tank (11).
  5. 5. The immersion liquid cooling system according to claim 4, wherein the air pump (30) is immersed in the cooling liquid.
  6. 6. The immersion liquid cooling system according to claim 4, wherein the air pump (30) is arranged adjacent to a side wall of the immersion tank (11), and the air suction pipe (31) and the air discharge pipe (32) are arranged vertically adjacent to a side wall of the immersion tank (11).
  7. 7. The immersion liquid cooling system according to claim 1, wherein the air pump (30) is arranged outside the immersion tank (11).
  8. 8. The immersion liquid cooling system according to claim 7, wherein at least one of the suction pipe (31) and the exhaust pipe (32) is provided with means for adsorbing or condensing vapor of the cooling liquid.
  9. 9. The immersion liquid cooling system of claim 1, wherein the immersion liquid cooling system is a single phase immersion liquid cooling system or a dual phase immersion liquid cooling system.
  10. 10. The immersion liquid cooling system according to claim 1, further comprising one or more air guide pipes (35) arranged in the immersion tank (11), the air inlet ends (351) of the one or more air guide pipes (35) being arranged in correspondence with the respective air injection holes (331) on the air bubble discharge channel (33), and the air outlet ends (352) of the one or more air guide pipes (35) being arranged below the respective high power devices (101) in the electronic equipment (10) to be cooled.
  11. 11. The immersion liquid cooling system according to claim 10, wherein at least one air guide duct (35) of the one or more air guide ducts (35) comprises one air inlet end (351) and at least two air outlet ends (352).
  12. 12. The immersion liquid cooling system according to claim 10, wherein the gas inlet end (351) of the one or more gas guide conduits (35) at least partially encloses a respective gas injection hole (331) on the gas bubble discharge channel (33).

Description

Immersion liquid cooling system Technical Field Embodiments of the present disclosure relate generally to the field of electronics cooling technology, and more particularly, to an immersion liquid cooling system. Background The energy consumption of the data center is increased day by day, and the traditional air cooling heat dissipation scheme has low heat dissipation efficiency and needs to consume a large amount of energy, so that the requirements of the data center cannot be met in terms of cooling capacity and economic feasibility. The liquid cooling heat dissipation scheme is an important technical direction for data center construction due to high heat dissipation efficiency. The prior mature liquid cooling heat dissipation scheme comprises cold plate liquid cooling and immersed liquid cooling, wherein the immersed liquid cooling is divided into single-phase immersed liquid cooling and double-phase immersed liquid cooling. The immersion liquid cooling is used for immersing the electronic equipment in the cooling liquid, heat generated by the electronic equipment can be taken away by the cooling liquid, and the heat dissipation efficiency of the heat dissipation mode is higher, so that lower Power Use Efficiency (PUE) is easier to obtain. In addition, the fanless design of the immersion liquid can also save a lot of energy consumption. For the dual-phase immersion liquid cooling scheme, heat generated by the electronic equipment can be taken away by the phase change latent heat of the cooling liquid, so that the heat dissipation requirement of the high-power density device can be supported. However, because the coolant required for the dual phase immersion cooling scheme needs to have high volatility and the gas pressure of the dual phase immersion cooling system is high, coolant loss becomes a major cost source for dual phase immersion cooling. In order to avoid volatilization of the cooling liquid, the design of the dual-phase immersion liquid cooling system is complex, and the technical threshold is high. The single-phase immersed liquid cooling scheme only uses heat exchange between the cooling liquid and the heating device to dissipate heat, so that the design of the single-phase immersed liquid cooling system is generally simpler, and the single-phase immersed liquid cooling system is widely applied in the industry at present. However, the conventional immersed liquid cooling scheme is easy to form local hot spots and encounters a heat dissipation bottleneck, so that the heat exchange efficiency needs to be further improved. Disclosure of Invention It is an object of the present disclosure to provide an immersion liquid cooling system to at least partially address the above problems, as well as other potential problems. In one aspect of the disclosure, an immersion liquid cooling system is provided, comprising an immersion tank for accommodating a cooling liquid and an electronic device to be cooled, the electronic device to be cooled being at least partially immersed in the cooling liquid and having an air cavity formed therein above a liquid level of the cooling liquid, a heat exchange unit for cooling the cooling liquid with an external cooling source, and a bubble generating device including an air pump connected to the air pump and the air exhaust pipe to suck air through the air pump and exhaust air through the air exhaust pipe, an air suction port of the air pump being provided in the air cavity, and an air exhaust pipe connected to the air bubble exhaust passage, the air bubble exhaust passage being provided below the electronic device to be cooled, and the air bubble exhaust passage including a plurality of air ejection holes for ejecting air bubbles toward the electronic device to be cooled. In some embodiments, the heat exchange unit is disposed between the electronic device to be cooled and the bubble discharge channel, the plurality of gas injection holes are arranged to face the heat exchange unit, and the heat exchange unit is connected to the external cold source through an external cold liquid supply pipe and an external cold liquid return pipe. In some embodiments, the plurality of gas injection holes includes a plurality of groups of gas injection holes spaced apart from one another. In some embodiments, the air pump is disposed in the immersion tank. In some embodiments, the air pump is submerged in the cooling liquid. In some embodiments, the air pump is disposed adjacent a side wall of the immersion tank, and the air suction pipe and the air discharge pipe are disposed vertically adjacent a side wall of the immersion tank. In some embodiments, the air pump is disposed outside the immersion tank. In some embodiments, at least one of the suction pipe and the exhaust pipe is provided with a means for adsorbing or condensing vapor of the cooling liquid. In some embodiments, the immersion liquid cooling system is a single phase immersion liquid cooling system or a dual phase imm