CN-116013916-B - LED lamp bead packaging module and display screen control system

CN116013916BCN 116013916 BCN116013916 BCN 116013916BCN-116013916-B

Abstract

The invention discloses an LED lamp bead packaging module and a display screen control system, wherein the LED lamp bead packaging module comprises a packaging substrate, a driving chip and a plurality of LED wafer groups, wherein the driving chip and the LED wafer groups are packaged on the packaging substrate, the driving chip is integrated with a control module, a communication module, a storage module, a current configuration module and three constant current driving modules, the control module is respectively connected with the three constant current driving modules through the current configuration module, each LED wafer group is arranged on the same side of the packaging substrate in an array mode, and a red LED wafer, a green LED wafer and a blue LED wafer of each LED wafer group are respectively connected with the three constant current driving modules. The LED chip group luminous color control method and the LED chip group luminous color control device can enable luminous consistency and luminous color of each LED chip group to be good, and therefore display effect of a display screen is improved.

Inventors

ZHU ZHIQIANG
ZHU WEIPING
HONG RONGHUI

Assignees

厦门强力巨彩光电科技有限公司

Dates

Publication Date: 20260505
Application Date: 20221212

Claims (8)

1. The LED lamp bead packaging module is characterized by comprising a packaging substrate, an LED wafer group and a driving chip, wherein the LED wafer group and the driving chip are packaged on the packaging substrate; The driving chip is integrated with a control module, a communication module, a storage module, a current configuration module and three constant current driving modules, wherein the control module is respectively connected with the communication module and the storage module, and the control module is respectively connected with the three constant current driving modules through the current configuration module; The LED wafer groups are multiple in number and are arranged on the same side of the packaging substrate in an array manner, and each LED wafer group comprises a red LED wafer, a green LED wafer and a blue LED wafer; The red LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, the green LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, and the blue LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module; The driving chip is also integrated with three wafer identification modules, the three wafer identification modules are respectively corresponding to the three constant current driving modules, the input end and the grounding end of each wafer identification module are respectively connected with the power end and the grounding end of the constant current driving module corresponding to the wafer identification module, the output ends of the three wafer identification modules are connected with the control module, the anodes of the red LED wafer, the green LED wafer and the blue LED wafer of each LED wafer group are respectively connected with the output ends of the three constant current driving modules, the cathodes of the red LED wafer, the green LED wafer and the blue LED wafer of each LED wafer group are grounded, the anodes of the red LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, the anodes of the green LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, and the anodes of the blue LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module; The wafer identification module comprises a voltage sampling circuit, a subtracter circuit and a threshold signal generation circuit, wherein the input end and the grounding end of the voltage sampling circuit are respectively connected with the input end and the grounding end of the wafer identification module, the output end of the voltage sampling circuit is connected with the first input end of the subtracter circuit, the output end of the threshold signal generation circuit is connected with the second input end of the subtracter circuit, and the output end of the subtracter circuit is connected with the output end of the wafer identification module.
2. The LED lamp bead packaging module as set forth in claim 1, wherein three voltage regulating modules connected with the control module are integrated in the driving chip, and the output ends of the three voltage regulating modules are respectively connected with the power supply ends of the three constant current driving modules.
3. The LED lamp bead packaging module as set forth in claim 2, wherein the voltage regulating module comprises a PWM power driving circuit and a voltage stabilizing circuit connected with an output end of the PWM power driving circuit; the PWM power driving circuit of each voltage regulating module is connected with the control module, and the output end of the voltage stabilizing circuit of each voltage regulating module is connected with the output end of the voltage regulating module.
4. The LED lamp bead packaging module as set forth in claim 3, wherein the PWM power driving circuit of each voltage regulating module is further connected with the control module through a current limiting comparator.
5. The LED lamp bead packaging module as set forth in claim 2, wherein the driving chip is further integrated with a temperature detection module connected with the control module.
6. The LED lamp bead packaging module of claim 1, further comprising a packaging layer covering each LED wafer group, wherein the packaging substrate is one of a glass substrate, a PCB, a ceramic substrate or an FPC board.
7. A display screen control system is characterized by comprising a sending card and a plurality of spliced boxes, wherein each box is provided with a receiving card and a plurality of display modules connected with the receiving card, each display module comprises a display circuit board and a plurality of LED lamp bead packaging modules according to any one of claims 1 to 6, the LED lamp bead packaging modules are arranged on the same side of the display circuit board in an array mode, and driving chips of the LED lamp bead packaging modules of each display module of each box are connected with the receiving card of the box.
8. The display screen control system of claim 7, wherein the drive chip of the LED lamp bead packaging module is LED out of SDIOA pins for accessing serial data signals, SDIOB pins for outputting serial data signals and CLK pins for accessing clock signals; Each LED lamp bead packaging module of the display module is arranged in a cascading manner, wherein a SDIOB pin of a first LED lamp bead packaging module is connected with a SDIOA pin of a second LED lamp bead packaging module, a SDIOB pin of the second LED lamp bead packaging module is connected with a SDIOA pin of a third LED lamp bead packaging module, and the like, and a SDIOB pin of a penultimate LED lamp bead packaging module is connected with a SDIOA pin of a penultimate LED lamp bead packaging module; the receiving card of the box body is connected with the SDIOA pins of the first LED lamp bead packaging module of each display module of the box body, and the receiving card of the box body is also connected with the CLK pins of each LED lamp bead packaging module of each display module of the box body.

Description

LED lamp bead packaging module and display screen control system Technical Field The invention relates to the field of LED display screens, in particular to an LED lamp bead packaging module and a display screen control system. Background At present, a dynamic driving mode is mostly adopted as a driving mode of an LED display device, and the dynamic driving mode is relatively low in cost and easy to realize technically. Along with the technical progress, the number of LED lamp beads arranged in a unit area of the LED display screen is increased, so that the resolution of the LED display screen is increased; the high-resolution LED display screen adopts a dynamic driving mode, so that the number of required LED display screen chips is increased, the number of wiring lines of a PCB is increased, but the space of the PCB is limited, the wiring difficulty is increased when the number of the LED display screen chips is increased, the wiring lines on the PCB are difficult to meet the electrical property requirements of the lamp beads, and the high-resolution LED display screen is caused to have the phenomena of low gray unevenness, low gray color cast, high and low gray contrast coupling, and cross-board color difference on display. Therefore, it is necessary to develop an LED bead package module with good display effect and a display screen control system using the LED bead package module. Disclosure of Invention The invention aims to provide an LED lamp bead packaging module with good display effect and a display screen control system adopting the LED lamp bead packaging module. In order to achieve the above object, the solution of the present invention is: The LED lamp bead packaging module comprises a packaging substrate, LED wafer groups and driving chips, wherein the LED wafer groups and the driving chips are packaged on the packaging substrate, the driving chips are integrated with a control module, a communication module, a storage module, a current configuration module and three constant current driving modules, the control module is respectively connected with the communication module and the storage module, the control module is respectively connected with the three constant current driving modules through the current configuration module, the LED wafer groups are multiple and are arranged on the same side of the packaging substrate in an array mode, each LED wafer group comprises a red LED wafer, a green LED wafer and a blue LED wafer, the red LED wafer, the green LED wafer and the blue LED wafer of each LED wafer group are respectively connected with the output ends of the three constant current driving modules of the driving chips, the red LED wafer of each LED wafer group is respectively connected with different output ends of the same constant current driving module, the green LED wafer of each LED wafer group is respectively connected with different output ends of the same constant current driving module, and the blue LED wafer of each LED wafer group is respectively connected with different output ends of the same constant current driving module. The driving chip is also integrated with three wafer identification modules, the three wafer identification modules are respectively corresponding to the three constant current driving modules, the input end and the grounding end of each wafer identification module are respectively connected with the power end and the grounding end of the constant current driving module corresponding to the wafer identification module, the output ends of the three wafer identification modules are connected with the control module, the anodes of the red LED wafers, the green LED wafers and the blue LED wafers of each LED wafer group are respectively connected with the output ends of the three constant current driving modules, the cathodes of the red LED wafers, the green LED wafers and the blue LED wafers of each LED wafer group are grounded, the anodes of the red LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, the anodes of the green LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module, and the anodes of the blue LED wafers of each LED wafer group are respectively connected with different output ends of the same constant current driving module. The wafer identification module comprises a voltage sampling circuit, a subtracter circuit and a threshold signal generation circuit, wherein the input end and the grounding end of the voltage sampling circuit are respectively connected with the input end and the grounding end of the wafer identification module, the output end of the voltage sampling circuit is connected with the first input end of the subtracter circuit, the output end of the threshold signal generation circuit is connected with the second input end of the subtracter circuit, and the output end of t