CN-116031177-B - Apparatus for treating substrate

CN116031177BCN 116031177 BCN116031177 BCN 116031177BCN-116031177-B

Abstract

The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a housing to provide a processing space for processing a substrate therein, a support unit to support the substrate in the processing space, a bottom supply port to supply a process fluid to the processing space, and a filling member positioned below the substrate supported on the support unit in the processing space, wherein the filling member forms a buffer space facing the bottom supply port, and a passage is formed between the filling member and an inner wall of the housing, the passage allowing the process fluid introduced into the buffer space to flow in a direction of the substrate.

Inventors

ZHENG ZHENYOU
Zhu Zhenmo
LI XIANGMIN
LI YINGXUN
Cui Longxian
REN RONGJUN
WU CHENGXUN

Assignees

细美事有限公司

Dates

Publication Date: 20260508
Application Date: 20221025
Priority Date: 20211025

Claims (17)

1. A substrate processing apparatus comprising: a housing for providing a processing space for processing a substrate therein; A support unit for supporting the substrate in the processing space; a bottom supply port for supplying a process fluid to the process space, and A filling member positioned below the substrate supported on the supporting unit in the processing space, Wherein the filling member forms a buffer space facing the bottom supply port, and Forming a passage between the filling member and an inner wall of the housing, the passage causing the process fluid introduced into the buffer space to flow in a direction of the substrate, Wherein the filling member comprises: A base, and A protrusion extending in a downward direction from a bottom surface of the base and forming a plurality of support protrusions spaced apart from each other at a bottom end of the protrusion, an Wherein a slit having a spiral shape is formed along an inner surface of the protrusion defining the buffer space.
2. The substrate processing apparatus of claim 1, wherein the bottom supply port is positioned to overlap the buffer space when viewed from above.
3. The substrate processing apparatus of claim 1, wherein the housing comprises a top housing and a bottom housing, The bottom housing forming a recess with an open top, and At least a portion of the filler member is inserted into the recess.
4. The substrate processing apparatus of claim 2, wherein the base is disposed spaced apart from the inner wall of the housing.
5. The substrate processing apparatus of claim 1, wherein at least one support pin is formed at a top surface of the base to space the substrate a predetermined distance from the support unit by contacting a bottom surface of the substrate placed on the support unit.
6. The substrate processing apparatus according to claim 3, Wherein at least a portion of the projection is inserted into the recess, and The base is located above the recess and is arranged to be larger than the area of the recess in plan view.
7. The substrate processing apparatus of claim 6, wherein the support protrusion spaces the bottom end of the protrusion from a bottom surface defining the recess, and a top end of the support protrusion is positioned higher than a top end of the recess, and The space between the support protrusions is provided as the channel.
8. The substrate processing apparatus of any of claims 1-7, wherein the process fluid is a supercritical fluid.
9. A substrate processing apparatus comprising: a housing for providing a processing space for processing a substrate therein; A support unit for supporting the substrate in the processing space; a supply port for supplying a process fluid to the process space; A buffer plate forming a buffer space by being coupled with a groove formed at the housing and having an opening for communicating the process space with the buffer space, and And a filling member positioned below the substrate supported on the supporting unit in the processing space, the filling member being positioned above the buffer plate.
10. The substrate processing apparatus according to claim 9, wherein the housing includes a first housing and a second housing, and the second housing has the groove concavely formed in a direction away from the substrate supported on the support unit.
11. The substrate processing apparatus of claim 10, wherein the buffer plate is located at the recess, and a region of the buffer plate facing the process fluid supplied from the supply port is a blocking region.
12. The substrate processing apparatus according to claim 11, wherein the filling member is provided to have an area larger than the recess when viewed from above.
13. The substrate processing apparatus of claim 12, wherein a bottom surface of the filling member is disposed higher than a top surface of the buffer plate.
14. The substrate processing apparatus of any of claims 9-13, wherein the process fluid is a supercritical fluid.
15. A substrate processing apparatus comprising: A housing providing a processing space for processing a substrate therein, and including a top housing and a bottom housing having a recess with an open top; a support unit for supporting the substrate in the processing space; a top supply port for supplying a process fluid from above the process space; A bottom supply port for supplying the process fluid from below or from the side of the process space, and A filling member located under the substrate supported on the supporting unit in the processing space, and Wherein the filling member has a buffer space formed to face the bottom supply port, and a passage is formed between the filling member and an inner wall of the housing, the passage flowing the process fluid introduced into the buffer space through the bottom supply port in a direction of the substrate, Wherein the filling member comprises: A base, and A protrusion extending in a downward direction from a bottom surface of the base and forming a plurality of support protrusions spaced apart from each other at a bottom end of the protrusion, an Wherein a slit having a spiral shape is formed along an inner surface of the protrusion defining the buffer space.
16. The substrate processing apparatus according to claim 15, Wherein the base is located above the recess and is larger than the area of the recess in plan view, and Wherein the protrusion is located within the groove and spaced from a side surface of the groove toward a center of the groove.
17. The substrate processing apparatus of claim 16, wherein the bottom end of the protrusion is spaced apart from a bottom surface of the recess in an upward direction, and The tip of the protrusion is positioned higher than the tip of the groove.

Description

Apparatus for treating substrate Technical Field Embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs a drying process on a substrate. Background In general, in order to manufacture a semiconductor element, various processes such as a photolithography process, an etching process, an ion implantation process, and a deposition process are performed. In addition, various impurities, such as particles, organic contaminants, and metal impurities, are generated when performing these processes. These impurities cause defects in the substrate and thus become factors directly affecting the performance and yield of the semiconductor element. In the manufacturing process of semiconductor elements, a cleaning process for removing such impurities must be included. Recently, supercritical fluids have been used in processes for cleaning or developing substrates. According to one embodiment, the top surface of the substrate may be wetted with an anti-tilt liquid such as isopropyl alcohol (IPA), and then carbon dioxide (CO 2) may be supplied to the top surface of the substrate in a supercritical state to remove the remaining anti-tilt liquid. Within the processing space in which the process is performed using supercritical fluids, an environment above the critical temperature and critical pressure should be maintained. In addition, the supercritical fluid should be uniformly distributed within the processing space. However, the supercritical fluid cannot flow uniformly in the process space due to structural problems in the process space. In one embodiment, if the supply port for supplying the supercritical fluid in the processing space is disposed eccentrically to the center of the processing space, the supercritical fluid is relatively concentrated in the region where the supply port is disposed. That is, the supercritical fluid flows asymmetrically within the process space. The asymmetry of the supercritical fluid within the process space is further exacerbated if the supercritical fluid is supplied to the process space at a high rate. For this reason, uniform processing cannot be performed on the substrate disposed in the processing space. In addition, due to the asymmetry of the supercritical fluid, a large number of particles may occur in a specific region of the substrate to which the supercritical fluid is relatively more supplied. Disclosure of Invention Embodiments of the inventive concept provide a substrate processing apparatus to uniformly supply a process fluid to a processing space. Embodiments of the inventive concept provide a substrate processing apparatus to uniformly flow a process fluid in a process space when the process fluid is supplied to the process space at a high speed. Embodiments of the inventive concept provide a substrate processing apparatus to suppress particle concentration at a specific region when a substrate is processed using a process fluid. Technical objects of the inventive concept are not limited to the above, and other technical objects not mentioned will be apparent to those skilled in the art from the following description. The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a housing to provide a processing space for processing a substrate therein, a support unit to support the substrate in the processing space, a bottom supply port to supply a process fluid to the processing space, and a filling member positioned below the substrate supported on the support unit in the processing space, wherein the filling member forms a buffer space facing the bottom supply port, and a passage is formed between the filling member and an inner wall of the housing, the passage flowing the process fluid introduced into the buffer space in a direction of the substrate. In one embodiment, the bottom supply port is positioned to overlap the buffer space when viewed from above. In one embodiment, the housing includes a top housing and a bottom housing, the top housing forming a recess with an open top, and at least a portion of the filler member being inserted into the recess. In one embodiment, the filler member includes a base portion and a protrusion extending in a downward direction from a bottom surface of the base portion. In one embodiment, the base is disposed spaced apart from the inner wall of the housing. In one embodiment, at least one support pin is formed at a top surface of the base to space the substrate from the support unit by contacting a bottom surface of the substrate placed on the support unit by a predetermined distance. In one embodiment, a slit having a spiral shape is formed along an inner surface of the protrusion defining the buffer space. In one embodiment, the filler member includes a base portion, and a protrusion extending in a downward direction from a bottom surface of the base portion,