CN-116075069-B - Antenna flexible circuit board manufacturing method and antenna flexible circuit board

Abstract

The application relates to the technical field of antenna flexible circuit board manufacturing, and discloses an antenna flexible circuit board manufacturing method and an antenna flexible circuit board, wherein the antenna flexible circuit board manufacturing method comprises the steps of providing a substrate, wherein the substrate comprises a base material, a first copper layer and a second copper layer, a via hole is formed in the substrate, and a device bonding PAD and an antenna PAD are arranged on the first copper layer; the method comprises the steps of attaching a first covering film on one surface of a first copper layer, which is away from a base material, attaching a second covering film on one surface of a second copper layer, which is away from the base material, wherein the first covering film is provided with a first open window and a second open window, the second covering film is provided with a third open window, attaching reinforcement in an attaching area, and attaching a shielding film on one surface of the second covering film, which is away from the second copper layer. The manufacturing method of the antenna flexible circuit board can solve the problems that the traditional manufacturing method of the antenna flexible circuit board is complex in process flow, high in difficulty and has quality risks.

Inventors

• LI ZHI
• WEN LIMEI
• CHEN YAXUE
• DENG CHENGWEN

Assignees

• 珠海景旺柔性电路有限公司

Dates

Publication Date

20260508

Application Date

20230105

Claims (10)

1. 1. The manufacturing method of the antenna flexible circuit board is characterized by comprising the following steps: Providing a substrate, wherein the substrate comprises a base material and a first copper layer and a second copper layer which are respectively arranged on two opposite sides of the base material, a through hole penetrating through the base material, the first copper layer and the second copper layer is formed in the substrate, a conductive layer for electrically conducting the first copper layer and the second copper layer is arranged on the hole wall of the through hole, a first outer layer circuit is arranged on the first copper layer, the first outer layer circuit comprises a device bonding PAD and an antenna PAD, a second outer layer circuit is arranged on the second copper layer, and a bonding area opposite to the antenna PAD is formed on one side, away from the first copper layer, of the base material; Attaching a first cover film on one surface of the first copper layer, which is away from the base material, and attaching a second cover film on one surface of the second copper layer, which is away from the base material, wherein the first cover film is provided with a first open window exposing the device bonding PAD and a second open window exposing the antenna PAD, and the second cover film is provided with a third open window exposing the bonding area; the bonding area is stuck with a reinforcement, the reinforcement is bonded in the bonding area through a reinforcement adhesive, the reinforcement is high-frequency reinforcement, and the reinforcement adhesive is high-frequency pure adhesive; And attaching a shielding film on one surface of the second covering film, which is away from the second copper layer, and covering the reinforcement by the shielding film.
2. 2. The method for manufacturing the antenna flexible circuit board according to claim 1, wherein after attaching the first cover film to the surface of the first copper layer, which is away from the base material, and attaching the second cover film to the surface of the second copper layer, which is away from the base material, and before attaching the reinforcement to the attaching region, the method further comprises performing a solder mask treatment on the base plate, so that a solder mask layer is formed on the surface of the first copper layer, which is away from the base material, and the solder mask layer is located in the first open window, and the solder mask layer is provided with a fourth open window exposing the device bonding pad.
3. 3. The method of manufacturing an antenna flexible wiring board according to claim 1, wherein an oxidation preventing layer is formed on both the device PAD and the antenna PAD before the bonding region is bonded with the reinforcement.
4. 4. The method for manufacturing the antenna flexible circuit board according to claim 3, wherein the anti-oxidation layers are manufactured on the device bonding PAD and the antenna PAD, specifically comprising the step of performing electroless nickel-gold treatment on the substrate, so that a nickel layer and a gold layer are sequentially deposited on the device bonding PAD and the antenna PAD.
5. 5. The method of manufacturing an antenna flexible circuit board according to claim 4, wherein the thickness of the nickel layer is 3um-6um, and the thickness of the gold layer is 0.05um-0.10um.
6. 6. The method of manufacturing an antenna flexible wiring board according to claim 1, wherein a thickness of the second cover film is larger than a thickness of the first cover film.
7. 7. The method of manufacturing an antenna flexible circuit board according to claim 6, wherein the thickness of the second cover film is greater than 50um, and the thickness of the first cover film is 25um-30um.
8. 8. The method according to any one of claims 1 to 7, wherein the first copper layer includes a first copper-based layer and a first copper-plated layer which are stacked, the first copper-based layer being located between the first copper-plated layer and the base material, and the second copper layer includes a second copper-based layer and a second copper-plated layer which are stacked, the second copper-based layer being located between the second copper-plated layer and the base material.
9. 9. The method of manufacturing an antenna flexible circuit board according to any one of claims 1 to 7, wherein reinforcement is attached to the attaching region by rapid lamination, wherein the lamination temperature is 170 ℃ to 180 ℃, the lamination pressure is 20kg to 30kg, the lamination time is 120s to 200s, and the vacuum time in the lamination process is 5s to 10s.
10. 10. An antenna flexible circuit board, characterized in that the antenna flexible circuit board is manufactured by the manufacturing method of the antenna flexible circuit board according to any one of claims 1 to 9.

Description

Antenna flexible circuit board manufacturing method and antenna flexible circuit board Technical Field The application relates to the technical field of manufacturing of antenna flexible circuit boards, in particular to a manufacturing method of an antenna flexible circuit board and the antenna flexible circuit board. Background The high-frequency antenna flexible circuit board is generally manufactured by adopting the traditional multi-layer antenna flexible circuit board technology, namely, a high-frequency substrate is manufactured into the high-frequency antenna flexible circuit board through the procedures of inner layer graphics, lamination pressure transmission, laser blind holes, mechanical drilling, plasma photoresist removal, shadow removal, copper electroplating, outer layer circuit and the like. In the traditional manufacturing method of the high-frequency antenna flexible circuit board, the inner layer pattern and the laminated board pressure transmission process are needed, so that the process flow is complex and difficult, the requirement on the heat resistance of a base material is high, and the risk of delamination of the explosion board exists. Disclosure of Invention The application provides a manufacturing method of an antenna flexible circuit board and the antenna flexible circuit board, which can solve the problems of complex process flow, high difficulty and quality risk of the traditional manufacturing method of the antenna flexible circuit board. In a first aspect, an embodiment of the present application provides a method for manufacturing an antenna flexible circuit board, including: Providing a substrate, wherein the substrate comprises a base material and a first copper layer and a second copper layer which are respectively arranged on two opposite sides of the base material, a through hole penetrating through the base material, the first copper layer and the second copper layer is formed in the substrate, a conductive layer for electrically conducting the first copper layer and the second copper layer is arranged on the hole wall of the through hole, a first outer layer circuit is arranged on the first copper layer, the first outer layer circuit comprises a device bonding PAD and an antenna PAD, a second outer layer circuit is arranged on the second copper layer, and a bonding area opposite to the antenna PAD is formed on one side, away from the first copper layer, of the base material; Attaching a first cover film on one surface of the first copper layer, which is away from the base material, and attaching a second cover film on one surface of the second copper layer, which is away from the base material, wherein the first cover film is provided with a first open window exposing the device bonding PAD and a second open window exposing the antenna PAD, and the second cover film is provided with a third open window exposing the bonding area; attaching reinforcement to the attaching area; And attaching a shielding film on one surface of the second covering film, which is away from the second copper layer, and covering the reinforcement by the shielding film. In some embodiments, a first cover film is attached to the surface, away from the base material, of the first copper layer, and after a second cover film is attached to the surface, away from the base material, of the second copper layer, and before the attaching region is attached to the reinforcement, the antenna flexible circuit board manufacturing method further comprises the step of performing anti-welding treatment on the base plate, so that a welding prevention layer is formed on the surface, away from the base material, of the first copper layer, the welding prevention layer is located in a first open window, and a fourth open window for exposing the device bonding pad is formed in the welding prevention layer. In some embodiments, an oxidation preventing layer is formed on the device PAD and the antenna PAD before the bonding region is reinforced. In some embodiments, the anti-oxidation layer is formed on the device PAD and the antenna PAD, and specifically comprises performing electroless nickel-gold treatment on the substrate, so that a nickel layer and a gold layer are sequentially deposited on the device PAD and the antenna PAD. In some of these embodiments, the nickel layer has a thickness of 3um to 6um and the gold layer has a thickness of 0.05um to 0.10um. In some of these embodiments, the thickness of the second cover film is greater than the thickness of the first cover film. In some of these embodiments, the second cover film has a thickness greater than 50um and the first cover film has a thickness of 25um to 30um. In some embodiments, the first copper layer comprises a first copper-based layer and a first copper-plated layer in a stacked arrangement, the first copper-based layer being located between the first copper-plated layer and the substrate, and the second copper layer comprises a second copper-bas