CN-116116742-B - Integrated device and method for detecting, sorting and managing surface defects of chip

CN116116742BCN 116116742 BCN116116742 BCN 116116742BCN-116116742-B

Abstract

The invention discloses an integrated device and a method for chip surface defect detection, sorting and pipe assembly, wherein the integrated device comprises a chip flow pipe, a flow pipe blocking device, a flow pipe separating device and a chip flow pipe obliquely arranged, the flow pipe blocking device and the flow pipe separating device are sequentially arranged at one side of the chip flow pipe at intervals along the direction from high to low of the chip flow pipe, the end of the highest position of the chip flow pipe is connected with the extreme end of a chip production line, the end of the lowest position of the chip flow pipe is connected with a plastic packing pipe, a movable rotating side door is arranged at the position of the chip flow pipe corresponding to the flow pipe separating device, a disqualified chip collecting box is arranged below the side door, and a machine vision detection module is arranged at the other side of the chip flow pipe. The integrated device can detect, sort and tube the chip, thereby realizing high integration.

Inventors

YAO XIN
LI SHUOMING
SUN JING
Huang Xuanji

Assignees

中山职业技术学院

Dates

Publication Date: 20260512
Application Date: 20221227

Claims (6)

1. The integrated device is characterized by comprising a chip flow tube, a flow tube blocking device and a flow tube separating device, wherein the chip flow tube is obliquely arranged, the flow tube blocking device and the flow tube separating device are sequentially arranged at one side of the chip flow tube at intervals along the direction from high to low of the chip flow tube, one end of the highest position of the chip flow tube is connected with the extreme end of a chip production line or a tested object, one end of the lowest position of the chip flow tube is connected with a plastic packing tube which is convenient for carrying out tube mounting on the chip, one end of the chip flow tube is connected with a movable side door which is arranged at a position corresponding to the flow tube separating device, one end of the flow tube separating device is connected with the side door, a disqualified chip collecting box is arranged below the side door, the other side of the chip flow corresponding to the middle position of the flow tube blocking device and the flow tube blocking device is provided with a machine vision detection module, the machine vision detection module is arranged at the other side of the chip flow tube corresponding to the middle position of the flow tube blocking device, the machine vision detection module is connected with a microcontroller which is connected with the machine vision detection module, and the microcontroller which is connected with the machine vision detection module when the machine is connected with the chip flow tube to the flow tube to be detected, the microcontroller which is connected with the machine vision detection module, and the microcontroller which is connected with the machine detection module, and the microcontroller which is connected with the machine detection module and the flow tube, the machine vision detection module sends the detection result to the microcontroller module after detection, the microcontroller module controls the electromagnetic push rod driver module to drive the ejection and retraction of the flow tube chip clamping device, the flow tube blocking device and the flow tube separating device according to the detection result, thereby realizing the sequential detection, sorting and tubing of chips, The mounting parts of the flow tube chip blocking device, the flow tube blocking device and the chip flow tube are respectively provided with a first micro notch and a second micro notch; The flow chip clamping device comprises a clamping push rod and a clamping electromagnetic push valve, one end of the clamping push rod is connected with the clamping electromagnetic push valve, the other end of the clamping push rod is arranged at a first micro notch of the chip flow tube, the clamping electromagnetic push valve is electrically connected with an electromagnetic push rod driver module, and the electromagnetic push rod driver module controls the clamping electromagnetic push valve to push the clamping push rod to pop and retract; The inside of the dead push rod is provided with a first damping spring, and the top of the other end of the dead push rod is fixed with first rubber.
2. The integrated chip surface defect detection, sorting and tubing set device of claim 1, wherein the flow tube plugging device comprises a plugged pushrod and a plugged electromagnetic push valve, one end of the plugged pushrod is connected with the plugged electromagnetic push valve, the other end of the plugged pushrod is arranged at the second micro-gap of the chip flow tube, the plugged electromagnetic push valve is electrically connected with an electromagnetic push rod driver module, and the electromagnetic push rod driver module controls the plugged electromagnetic push valve to push the plugged pushrod to pop and retract.
3. The integrated chip surface defect detecting, sorting and packing device according to claim 1, wherein the flow tube separating device comprises a separating push rod and a separating electromagnetic push valve, one end of the separating push rod is connected with the separating electromagnetic push valve, the other end of the separating push rod is connected with a section of coupler, and the other end of the separating push rod is connected to a side door of the chip flow tube through the section of coupler.
4. The integrated chip surface defect detection, sorting and packaging device according to claim 1, wherein the chip flow tube and the machine vision detection module are fixed with transparent materials, and the machine vision detection module detects the surface of the chip through the transparent materials.
5. The integrated chip surface defect detection, sorting and packaging device according to claim 1, wherein the microcontroller module is further electrically connected with a display module, the microcontroller module sends the chip detection result detected by the machine vision detection module to the display module, and the display module displays the detection result.
6. A chip surface defect detection, sorting and pipe assembly method is characterized in that the integrated device as set forth in any one of claims 1-5 is adopted to detect, sort and pipe the chip surface defects, and the method specifically comprises the following steps: The method comprises the steps that S1, chips to be detected sequentially slide into a chip flow tube from the highest end of the chip flow tube, the chips flow downwards freely through self gravity, wherein the N-th chip, the N+1th chip and the N+2th chip are assumed to flow into the chip flow tube sequentially, N is more than or equal to 1, N is a positive integer, the N-th chip flows into the chip flow tube firstly, then the N+1th chip flows into the chip flow tube, then the N+2th chip flows into the N+Nth chip, in an initial state, a flow tube blocking device is started, one end of a blocking push rod of the flow tube blocking device pops up and stretches into the chip flow tube, the chips to be detected sliding in the chip flow tube are blocked in a to-be-detected area, the flow tube blocking device is started, one end of a blocking push rod of the flow tube blocking device pops up and stretches into the chip flow tube, the N+1th chip is blocked, a machine vision detection module detects the N-th chip blocked in the to-be-detected area, and S2 or S3 is carried out; step S2, if the Nth chip detected by the machine vision module is a qualified chip, executing step S3, and if the Nth chip detected by the machine vision module is a disqualified chip, executing step S4; Step S3, if the machine vision module sends the result of detecting the Nth chip as the qualified chip to the microcontroller module, the microcontroller module controls the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to pop up, and then the step S5 is carried out; S4, sending the result of the machine vision module detecting that the Nth chip is the unqualified chip to the microcontroller module, controlling the electromagnetic push rod driver module to drive the separation push rod of the flow tube separation device to retract by the microcontroller module, opening a side door of the chip flow tube, and then entering the step S6; Step S5, the microcontroller module controls the electromagnetic push rod driver module to drive one end of a blocking push rod of the flow tube blocking device to retract, an N chip in the chip flow tube is not blocked any more, so that the N chip with the qualified detection result slides downwards along the chip flow tube and slides into the plastic packaging tube, and the step S7 is performed; Step S6, the microcontroller module controls the electromagnetic push rod driver module to drive one end of a blocking push rod of the flow tube blocking device to retract, an N chip in the chip flow tube is not blocked any more, so that the N chip with the detection result of the unqualified chip slides downwards along the chip flow tube and slides out of a side door to the chip flow tube to fall into an unqualified chip collection box, and the step S7 is entered; step S7, the machine vision module detects that the Nth chip completely slides out of the detection area and enters step S8; step S8, the machine vision module detects that the Nth chip slides out of the detection area and sends the result to the microcontroller module, and the microcontroller module controls the electromagnetic push rod driver module to drive the blocking push rod of the flow tube blocking device to pop up, so that step S9 is performed; Step S9, the microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the mobile chip locking device to retract, and the step S10 is entered; Step S10, all chips to be detected in the chip flow tube continue to slide down, and enter step S11; step S11, the machine vision module detects that the (n+1) th chip completely slides down to a region to be detected, and the step S12 is entered; Step S12, the microcontroller module controls the electromagnetic push rod driver module to drive the locking push rod of the mobile chip locking device to pop up, lock the (n+2) th chip, and enter step S13; And S13, after the machine vision detection module detects the (N+1) th chip of the area to be detected, returning to the step S2 or the step S3 for cyclic execution according to the detection result of the machine vision detection module after the (N+1) th chip is detected.

Description

Integrated device and method for detecting, sorting and managing surface defects of chip Technical Field The invention relates to the technical field of chips, in particular to an integrated device and method for detecting, sorting and managing chip defects. Background The packaging and storing method of the chip comprises three modes of tube packaging, braiding and tray, wherein the tube packaging mode is simple and reliable, has high-strength external impact resistance, and is one of the most common packaging and storing modes of the chip. The chip manufactured from the production line needs to be detected for surface defects before entering the tube package, which shows that detection items comprise stain, pin distortion or incomplete, screen printing uncertainty and the like, and the existing chip detection equipment has the following problems: (1) The existing chip detection equipment has high equipment cost for detecting and sorting the surface defects of the chips, and the conventional sorting needs to use a robot arm for chip sorting, so that the equipment cost of the high-precision robot arm is very high; (2) The detection and sorting speed of the chip can be influenced by the moving speed of the robot arm, so that the detection and sorting speed of the chip is easy to be limited, and the follow-up procedure of the chip is influenced; (3) The three working procedures of chip detection, sorting and pipe assembly are respectively and independently operated, after the chip detection is finished, the chip is required to be mounted on other equipment for sorting, the chip after sorting is subjected to pipe assembly, and the chip detection, sorting and pipe assembly are respectively and independently operated by a plurality of equipment, so that the working efficiency is lower. Disclosure of Invention The invention aims to solve the technical problems in the prior art, and provides an integrated device and an integrated method which are mainly applied to detection of chip surface defects of pipe assembly and detection links at the tail end of a chip production line, can realize the integration of chip surface defect detection, sorting and pipe assembly and can improve the chip detection, sorting and pipe assembly efficiency. In order to solve the technical problems, on the one hand, the invention provides an integrated device integrating chip surface defect detection, sorting and pipe installation, which comprises a chip flow pipe, a flow chip clamping device, a flow pipe blocking device and a flow pipe separating device, wherein the chip flow pipe is obliquely arranged, the flow chip clamping device, the flow pipe blocking device and the flow pipe separating device are sequentially arranged on one side of the chip flow pipe at intervals along the direction from high to low of the chip flow pipe, the end of the highest position of the chip flow pipe is connected with the extreme end of a chip production line or an object to be tested, the end of the lowest position of the chip flow pipe is connected with a plastic packing pipe which is convenient for pipe installation of the chip, a movable rotating side door is arranged at the position of the chip flow pipe corresponding to the flow pipe separating device, one end of the flow pipe separating device is connected with a side door, a disqualified chip collecting box is arranged below the side door, a machine vision detection module is arranged on the other side of the chip flow pipe corresponding to the middle of the flow pipe blocking device and the middle of the flow pipe blocking device, the area corresponding to the position of the machine vision detection module and the position of the chip flow pipe is an area to be detected, the machine vision detection module is electrically connected with a microcontroller module, the microcontroller module is connected with an electromagnetic push rod driver module, the electromagnetic push rod driver module is electrically connected with the flow pipe blocking device, the flow pipe blocking device and the flow pipe separating device so as to control the flow pipe chip blocking device, the flow pipe blocking device and the flow pipe separating device, a chip to be detected at the highest position of the chip flow pipe slides into the chip flow pipe, when the chip to be detected flows through the area to be detected of the chip flow tube, the machine vision detection module detects surface defects of the chip to be detected at the area to be detected, the machine vision detection module sends detection results to the microcontroller module after detecting, and the microcontroller module controls the electromagnetic push rod driver module to drive the flow chip blocking device, the flow tube blocking device and the flow tube separating device to pop up and retract according to the detection results, so that sequential detection, sorting and tubing of the chip are realized. According to the technical scheme, the mou