Search

CN-116130470-B - Wide-spectrum light source and preparation method thereof

CN116130470BCN 116130470 BCN116130470 BCN 116130470BCN-116130470-B

Abstract

The embodiment of the application belongs to the technical field of LED semiconductor illumination, and relates to a wide spectrum light source and a preparation method thereof, wherein the wide spectrum light source comprises an alloy seat, an LED chip and fluorescent powder glue, the alloy seat is used for fixing the LED chip, and the LED chip comprises a purple light chip, a blue light chip, an infrared light chip and a near infrared light chip, and fluorescent powder glue is coated on the LED chip. The technical scheme provided by the application has the advantages of wide spectrum range, complete spectrum of the light source, improved use comfort of the light source, capability of meeting the requirement of a wide spectrum light source, simple and practical process structure, reduced cost and mass production.

Inventors

  • LI FENG
  • JI AIHUA
  • Qiu Guangfu
  • TANG ZEYU

Assignees

  • 深圳市光脉电子有限公司

Dates

Publication Date
20260505
Application Date
20220907

Claims (7)

  1. 1. A broad spectrum light source comprising: alloy seat, LED chip and fluorescent powder glue; the alloy seat is used for fixing the LED chip; The LED chip comprises a purple light chip, a blue light chip, an infrared chip and a near infrared chip; the fluorescent powder glue is coated on the LED chip; The fluorescent powder glue consists of silica gel and fluorescent powder, and the excitation wavelength of the fluorescent powder is adapted to the luminous wavelength of the LED chip; The fluorescent powder comprises yellow fluorescent powder, red fluorescent powder, 730nm wave band fluorescent powder, 800nm wave band fluorescent powder, 840nm wave band fluorescent powder and 900nm wave band fluorescent powder, wherein the mass ratio of the silica gel to the yellow fluorescent powder, the red fluorescent powder, the 730nm wave band fluorescent powder, the 800nm wave band fluorescent powder, the 840nm wave band fluorescent powder and the 900nm wave band fluorescent powder is (95-105): 1.9-2.1): 0.95-1.05: (0.95-1.05); The band range of the purple light chip is 400-455nm, the band range of the blue light chip is 470-472.5nm, the band range of the infrared light chip is 780-1100nm, and the band range of the near infrared light chip is 1100-2526nm.
  2. 2. The broad spectrum light source of claim 1 wherein the alloy base comprises aluminum, copper, silicon and carbon in a corresponding mass ratio of (80 ± 5%) (10 ± 5%) (5 ± 5%).
  3. 3. The broad spectrum light source of claim 1, wherein the alloy mount is an LED mount with a circuit, and the LED chip is connected to the circuit by die bonding or eutectic bonding.
  4. 4. The preparation method of the broad spectrum light source is characterized by comprising the following steps: step S10, mixing the aluminum component, the copper component, the silicon component and the carbon component according to a preset mass ratio, and putting the mixture into a high-temperature furnace to process an alloy seat; S20, opening an automatic die bonder, preheating, placing a purple light chip, a blue light chip, an infrared light chip and a near infrared light chip on the alloy seat by using the automatic die bonder, and sending the alloy seat into an oven for baking until the alloy seat is cured completely to obtain a chip curing semi-finished product, wherein the band range of the purple light chip is 400-455nm, the band range of the blue light chip is 470-472.5nm, the band range of the infrared light chip is 780-1100nm, and the band range of the near infrared light chip is 1100-2526nm; Step S30, uniformly stirring silica gel and fluorescent powder in an automatic stirrer according to the formula mass ratio, and vacuumizing to obtain the fluorescent powder adhesive, wherein the formula mass ratio is that the silica gel comprises yellow fluorescent powder, red fluorescent powder, 730 nm-band fluorescent powder, 800 nm-band fluorescent powder, 840 nm-band fluorescent powder, 900 nm-band fluorescent powder= (95-105): (1.9-2.1): (1.9-2.1): (0.95-1.05): (0.95-1.05): (0.95-1.05): (0.95-1.05); Step S40, starting an automatic dispensing machine for preheating, feeding the chip curing semi-finished product into the automatic dispensing machine, and uniformly coating the fluorescent powder glue on the ultraviolet chip, the blue light chip, the infrared chip and the near infrared chip; And S50, conveying the sample processed in the step S40 into an oven for curing and baking to obtain the broad spectrum light source.
  5. 5. The method according to claim 4, wherein the baking temperature is 140 to 160 ℃.
  6. 6. The preparation method of claim 4, wherein the curing temperature of the curing baking is 115-125 ℃ and the curing time is 2-3h.
  7. 7. The method of claim 4, further comprising, after the step of obtaining a broad spectrum light source: and placing the broad spectrum light source into a broad spectrum tester or a spectrum analyzer for performance test.

Description

Wide-spectrum light source and preparation method thereof Technical Field The application relates to the technical field of LED semiconductor illumination, in particular to a wide-spectrum light source and a preparation method thereof. Background An LED (Light-Emitting Diode) Light source is a relatively new technology and illumination Light source, and has great advantages compared with the traditional illumination Light source. The LED light source has the characteristics of environmental protection, no heavy metals such as mercury and lead, energy saving, small volume, strong shock resistance, durability, convenient transportation and the like. The current LED light source has the defects of incomplete light-emitting spectrum, human visual defect, uncomfortable human eyes and narrow light-emitting spectrum range, and cannot meet the requirements of wide spectrum in the fields of industrial production, communication, medical treatment and the like, such as spectrum test of optical fiber components, spectrum analysis of chemical and biological samples and the like. Therefore, a broad spectrum light source is needed to repair the defects of the spectrum scaling disorder of the visible light band and to expand the spectrum range to meet the broad spectrum demand. Disclosure of Invention The technical problems to be solved by the embodiment of the application are incomplete light-emitting spectrum and narrow light-emitting spectrum range caused by the imbalance of spectrum proportion in a visible light wave band in the related technology, and the wide spectrum requirement can not be met. In order to solve the above technical problems, the embodiments of the present application provide a broad spectrum light source, which adopts the following technical schemes: alloy seat, LED chip and fluorescent powder glue; the alloy seat is used for fixing the LED chip; The LED chip comprises a purple light chip, a blue light chip, an infrared chip and a near infrared chip; The fluorescent powder glue is coated on the LED chip. Further, the band range of the purple light chip is 400-455, the band range of the blue light chip is 470-472.5nm, the band range of the infrared light chip is 780-1100nm, and the band range of the near infrared light chip is 1100-2526nm. Further, the fluorescent powder glue consists of silica gel and fluorescent powder, and the excitation wavelength of the fluorescent powder is matched with the luminous wavelength of the LED chip. Further, the fluorescent powder comprises yellow fluorescent powder, red fluorescent powder, 730 nm-band fluorescent powder, 800 nm-band fluorescent powder, 840 nm-band fluorescent powder and 900 nm-band fluorescent powder, and the mass ratio of the silica gel to the yellow fluorescent powder, the red fluorescent powder, the 730 nm-band fluorescent powder, the 800 nm-band fluorescent powder, the 840 nm-band fluorescent powder and the 900 nm-band fluorescent powder is (95-105): 1.9-2.1): 0.95-1.05. Further, the alloy seat comprises the components of aluminum, copper, silicon and carbon, and the corresponding mass ratio is (80+/-5 percent) (10+/-5 percent) (5+/-5 percent). Further, the alloy seat is an LED bracket with a circuit, and the LED chip is connected to the circuit through die bonding or eutectic bonding. In order to solve the above technical problems, the embodiment of the present application provides a preparation method of a broad spectrum light source, which adopts the following technical scheme: step S10, mixing the aluminum component, the copper component, the silicon component and the carbon component according to a preset mass ratio, and putting the mixture into a high-temperature furnace to process an alloy seat; Step S20, an automatic die bonder is started, after preheating, a purple light chip, a blue light chip, an infrared chip and a near infrared chip are placed on the alloy seat by using the automatic die bonder, and the alloy seat is sent into an oven for baking until solidification is complete, so that a chip solidification semi-finished product is obtained; Step S30, uniformly stirring silica gel and fluorescent powder in an automatic stirrer according to the formula mass ratio, and vacuumizing to obtain the fluorescent powder adhesive, wherein the formula mass ratio is that the silica gel comprises yellow fluorescent powder, red fluorescent powder, 730 nm-band fluorescent powder, 800 nm-band fluorescent powder, 840 nm-band fluorescent powder, 900 nm-band fluorescent powder= (95-105): (1.9-2.1): (1.9-2.1): (0.95-1.05): (0.95-1.05): (0.95-1.05): (0.95-1.05); Step S40, starting an automatic dispensing machine for preheating, feeding the chip curing semi-finished product into the automatic dispensing machine, and uniformly coating the fluorescent powder glue on the ultraviolet chip, the blue light chip, the infrared chip and the near infrared chip; And S50, conveying the sample processed in the step S40 into an oven for curing and baking to obtain th