CN-116148634-B - Empty board testing system and method for Mini Led substrate

CN116148634BCN 116148634 BCN116148634 BCN 116148634BCN-116148634-B

Abstract

The invention relates to a blank testing system and method for a Mini LED substrate, which are used for conducting a conductivity test on a Mini LED substrate circuit before packaging chips, wherein the blank testing system comprises the Mini LED substrate, a blank testing module and a result display unit. The method for testing the conductivity of the substrate circuit by using the control unit for controlling the test route and the Mini Led substrate circuit to be tested to any angle welding disc in the matrix welding disc through the substrate connector can be used for testing the conductivity of the substrate circuit, one substrate can be tested by one key through one simple operation, the test time is short, the efficiency is high, and meanwhile, the connection control mode can be suitable for all products which are fully connected by adopting the matrix welding disc, and the personnel training cost and the jig development cost are saved. In addition, the invention adopts the storage analysis unit to record the conductivity test results of a plurality of Mini Led base lines for integral analysis and visual display, thereby being beneficial to timely finding and improving the manufacturing process defects and saving unnecessary cost.

Inventors

JIANG YAPING
HUANG DONG
Wei Cunhui
WU QIONG
HUANG QING

Assignees

深圳市鑫达辉软性电路科技有限公司

Dates

Publication Date: 20260505
Application Date: 20230213

Claims (6)

1. The empty board test system of the Mini LED substrate is used for conducting conductivity test on a Mini LED substrate circuit before packaging chips and is characterized by comprising the Mini LED substrate, an empty board test module and a result display unit; The Mini Led substrate comprises a substrate circuit including matrix type bonding pads, wherein each bonding pad can be independently connected to the positive electrode and the negative electrode of the substrate circuit; the empty board test module comprises a substrate connector and a control unit, wherein the substrate connector is used for being electrically connected to a substrate circuit, and the control unit is used for controlling the conduction test to be performed when the substrate connector is electrically connected to the substrate circuit; The mode of electrically connecting the substrate connector to the substrate circuit comprises that the substrate connector is connected to any corner pad of the matrix type pad in a contact mode to electrify the substrate circuit and transmit connection signals between the control unit and the substrate circuit; the circuit conductivity test comprises a circuit conductivity test, wherein the circuit conductivity test is performed by controlling a control unit to test a diagonal bonding pad which takes any one corner bonding pad of a matrix bonding pad as a starting point, sequentially connects clockwise snakelike traversing circuits to the starting point, sequentially connects reverse time Zhong Shexing traversing circuits from the starting point corner bonding pad to the diagonal bonding pad of the starting point corner bonding pad; The control unit controls the set circuit and the bonding pad to be tested, marks the conducted circuit and bonding pad on the display screen, and marks the circuit and bonding pad which are conducted but not conducted; After the substrate connector is connected to the substrate circuit, the control unit detects the structural condition of the substrate circuit and simulates the whole circuit diagram of the substrate on the display screen, and after the test is completed, the control unit identifies the circuit connection condition fed back by the test to the whole circuit diagram so as to identify the connected circuit condition and/or the circuit condition which is not connected.
2. The blank testing system of claim 1, wherein the continuity test further comprises a pad continuity test.
3. The blank testing system of claim 2, wherein the pad conductivity test is performed by controlling the testing of the conductivity of each pad by the control unit.
4. The empty board test system according to claim 1, wherein the empty board test module further comprises a storage analysis unit for recording a conductivity test result of each Mini Led substrate and performing overall analysis.
5. The blank testing system according to claim 1, wherein each bonding pad is coated with a die bond adhesive containing fluorescent powder, and the result display unit displays the conductivity test result on the bonding pad in such a manner that the control unit controls the fluorescent powder on the bonding pad to emit light when the set circuit and the bonding pad are tested.
6. A blank testing method for a Mini Led substrate, wherein the method adopts the blank testing system as claimed in any one of claims 1 to 5 to conduct conductivity test on a Mini Led substrate circuit, and the method comprises the following steps: The method for connecting the substrate connector to the substrate circuit comprises the steps of connecting the substrate connector to any corner pad of the matrix type pad in a contact manner, electrifying the substrate circuit and transmitting a connecting signal between a control unit and the substrate circuit; the circuit conductivity test comprises a circuit conductivity test, wherein the circuit conductivity test is performed by controlling a control unit to test a diagonal bonding pad which takes any one corner bonding pad of a matrix bonding pad as a starting point, sequentially connects clockwise snakelike traversing circuits to the starting point, sequentially connects reverse time Zhong Shexing traversing circuits from the starting point corner bonding pad to the diagonal bonding pad of the starting point corner bonding pad; S2, the control unit starts a pad conductivity test, a result display unit displays a pad conductivity test result, and a storage analysis unit contained by the empty board test module records the pad conductivity test result of each Mini Led substrate circuit fed back by the control unit; S3, the control unit starts a circuit conductivity test, a result display unit displays a circuit conductivity test result, and a storage analysis unit records the circuit conductivity test result of each Mini Led substrate circuit fed back by the control unit; the control unit controls the set circuit and the bonding pad to be tested, marks the conducted circuit and bonding pad on the display screen, and marks the circuit and bonding pad which are conducted but not conducted; After the substrate connector is connected to the substrate circuit, the control unit detects the structural condition of the substrate circuit and simulates the whole circuit diagram of the substrate on the display screen, and after the test is finished, the control unit identifies the circuit connection condition fed back by the test to the whole circuit diagram so as to identify the connected circuit condition and/or the circuit condition which is not connected; s4, extracting the line conductivity test results recorded by the storage analysis unit, selecting the conductivity test records of a plurality of Mini Led substrate lines to carry out overall analysis and carrying out visual result display.

Description

Empty board testing system and method for Mini Led substrate Technical Field The invention relates to the technical field of Mini Led substrate electrical property test, in particular to a blank testing system and method of Mini Led substrate. Background The empty board electrical property test of the Mini Led substrate is carried out, so that the functional defects of the circuit can be found early, the improvement of the production process, the improvement of the product yield and the reduction of the cost expenditure are facilitated. The method is used for testing a movable flying needle and an on-off jig, wherein the movable flying needle is used for testing a bonding pad which is moved to be tested by using four to eight probes which are independently controlled, the movable flying needle is tested flexibly, a set of equipment can be used in products with different structures, but based on the characteristics of small line bonding pad spacing and more line connection of the Mini Led substrate, the method is used for testing the movable flying needle, has low time efficiency, is complex in operation and is easy to make mistakes, and is easy to produce false detection due to the fact that the bonding pad spacing is too small, the on-off jig is used for developing a jig for products with each structure, the test speed is faster than that of the flying needle, the operation of the staff is simple, but one jig cannot be used for products with various structures, the development cost of the jig is high, and on the other hand, the method does not have the function of storing test data of a plurality of Mini Led substrates for visual analysis. The empty board test method of the Mini Led substrate needs to be researched, and the problems that the current test time is long, the efficiency is low, the development cost of a test tool is high, the operation of a worker is tedious and error-prone, and no visual data is used as a basis for improving the process are solved. Disclosure of Invention In order to solve the problems of long time, low efficiency, high development cost of a testing tool, complicated operation of a worker and easy error and visual data serving as a basis for process improvement existing in the electrical test of the empty board of the Mini LED substrate at present, the invention provides a solution which adopts a contact type connector to be connected to any one corner pad of a matrix type bonding pad of the Mini LED substrate, controls a test line through a control unit, records a plurality of Mini LED substrates for integral analysis, visually displays the line test result of each Mini LED substrate, screens good products and displays the integral analysis result serving as a reference for diagnosing the defects of the process. The technical scheme adopted for solving the technical problems is as follows: the invention provides a blank board test system of a Mini LED substrate, which is used for conducting conductivity test on a Mini LED substrate circuit before packaging chips, and comprises the Mini LED substrate, a blank board test module and a result display unit, wherein the Mini LED substrate comprises a substrate circuit with matrix type bonding pads, each bonding pad can be independently connected to the positive electrode and the negative electrode of the substrate circuit, the matrix type bonding pads are adopted for fully connecting the circuits, and the driving chips are flexibly arranged in different partitions to conduct circuit function connection, the blank board test module comprises a substrate connector and a control unit, the substrate connector is electrically connected to the substrate circuit, the control unit is used for controlling conducting conductivity test when the substrate connector is electrically connected to the substrate circuit, the control unit can conduct full-route test through one key, the test efficiency is high, the result display unit is used for displaying the conducting test result, and the displayed result can be directly used for sorting and screening of good products and defective products. Preferably, the mode of electrically connecting the substrate connector to the substrate circuit comprises the steps of electrifying the substrate circuit by connecting the substrate connector to any corner pad of the matrix type pad in a contact mode and transmitting connection signals between the control unit and the substrate circuit, wherein the connection and disconnection are convenient by adopting a contact connection mode, the test time can be reduced, the efficiency can be improved, and the connection degree is relatively improved by connecting the connector to the corner pad due to the characteristic of small space between Mini Led pads, so that the misdetection is reduced. Preferably, the continuity test includes a pad continuity test and a line continuity test. The pad conductivity test mode is that the control unit is used for controlling and t