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CN-116157676-B - C scan data merging

CN116157676BCN 116157676 BCN116157676 BCN 116157676BCN-116157676-B

Abstract

Examples of the present subject matter provide techniques for collecting inspection data (e.g., c-scan) from multiple probes, such as ECA probes. Each probe may generate inspection data on the surface obtained from different in-plane probe orientations, for example to provide an indication of interference or defects from different in-plane directions relative to the probe sensitivity axis. The inspection data may then be combined while the indications at the different orientations may be retained, and then combined to produce the composition. Pattern recognition may then be performed to determine the type of indication, such as a nuisance defect or a nuisance anomaly, using templates defining defects or anomalies.

Inventors

  • Remy Lecler

Assignees

  • 加拿大埃维登特有限公司

Dates

Publication Date
20260505
Application Date
20210830
Priority Date
20200831

Claims (15)

  1. 1. A method, comprising: Receiving a first set of eddy current inspection data, the first set of eddy current inspection data providing tamper indication data obtained at a first orientation relative to a first sensitivity axis; Receiving a second set of eddy current inspection data, the second set of eddy current inspection data providing tamper indication data in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; Combining the first set of inspection data and the second set of inspection data to generate a combined dataset retaining interference indication data in the first orientation and the second orientation; generating an abnormal composition based on the combined dataset; Comparing the composition with stored pattern information, and Generating a notification of a match based on comparing the compositions, Wherein the notification includes information of the type of anomaly that matches the composition.
  2. 2. The method of claim 1, wherein the first set of eddy current inspection data is obtained using a first directional probe and the second set of eddy current inspection data is obtained using a second directional probe, and wherein the first set of eddy current inspection data and the second set of eddy current inspection data comprise c-scan data.
  3. 3. The method of claim 2, further comprising: Position information of the sensors in the first and second directional probes is encoded.
  4. 4. The method of claim 1 or 2, wherein the first set of eddy current inspection data further provides tamper-indicating data obtained in a third orientation and the second set of eddy current inspection data provides tamper-indicating data obtained in a fourth orientation, Wherein the first orientation and the third orientation are orthogonal to each other and the second orientation and the fourth orientation are orthogonal to each other.
  5. 5. The method of claim 1 or 2, wherein the first set of eddy current inspection data and the second set of eddy current inspection data are obtained using an eddy current array ECA probe.
  6. 6. An inspection system, comprising: a first probe configured to obtain a first set of eddy current inspection data from a subject, thereby providing indication information in a first orientation relative to a first sensitivity axis; A second probe configured to obtain a second set of eddy current inspection data from the object, thereby providing indication information in a second orientation relative to a second sensitivity axis, and A processor configured to combine the first set of eddy current inspection data and the second set of eddy current inspection data to generate a combined dataset retaining indication information in the first orientation and the second orientation, and to combine the indication information in the combined dataset to generate an anomalous composition; Wherein the processor is further configured to: Comparing the composition with stored pattern information, and Generating a notification of a match based on comparing the compositions, Wherein the notification includes information of the type of anomaly that matches the composition.
  7. 7. The inspection system of claim 6, wherein the first probe and the second probe comprise an eddy current array.
  8. 8. An inspection system according to claim 6 or 7, wherein the first and second probes are directional probes.
  9. 9. The inspection system of claim 6 or 7, wherein the processor is further configured to encode positional information of the sensors in the first and second probes.
  10. 10. The inspection system of claim 6 or 7, wherein the first set of eddy current inspection data further provides indication information in a third orientation and the second set of eddy current inspection data provides indication information in a fourth orientation, Wherein the first orientation and the third orientation are orthogonal to each other and the second orientation and the fourth orientation are orthogonal to each other.
  11. 11. A machine-readable medium containing instructions that, when executed by a machine, cause the machine to perform operations comprising: Receiving a first set of eddy current inspection data, the first set of eddy current inspection data providing tamper indication data obtained at a first orientation relative to a first sensitivity axis; Receiving a second set of eddy current inspection data, the second set of eddy current inspection data providing tamper indication data in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; Combining the first set of inspection data and the second set of inspection data to generate a combined dataset retaining interference indication data in the first orientation and the second orientation; generating an abnormal composition based on the combined dataset; Comparing the composition with stored pattern information, and Generating a notification of a match based on comparing the compositions, Wherein the notification includes information of the type of anomaly that matches the composition.
  12. 12. The machine readable medium of claim 11, wherein the first set of eddy current inspection data is obtained using a first directional probe and the second set of eddy current inspection data is obtained using a second directional probe, and wherein the first set of eddy current inspection data and the second set of eddy current inspection data comprise c-scan data.
  13. 13. The machine-readable medium of claim 12, the operations further comprising: Position information of the sensors in the first and second directional probes is encoded.
  14. 14. The machine-readable medium of claim 11 or 12, wherein the first set of eddy current inspection data further provides tamper-indicating data obtained in a third orientation and the second set of eddy current inspection data provides tamper-indicating data obtained in a fourth orientation, Wherein the first orientation and the third orientation are orthogonal to each other and the second orientation and the fourth orientation are orthogonal to each other.
  15. 15. The machine readable medium of claim 11 or 12, wherein the first set of eddy current inspection data and the second set of eddy current inspection data are obtained using an eddy current array ECA probe.

Description

C scan data merging Cross Reference to Related Applications The present application claims the benefit of priority from U.S. provisional patent application No. 63/072,437, filed on 8/31/2020, the contents of which are hereby incorporated by reference in their entirety. Technical Field The present invention relates generally to non-destructive surface inspection. Background Non-destructive inspection techniques may be used to inspect components such as, but not limited to, pressure vessels, aircraft wings, aircraft bodies, railroad rails, railcar wheels, or other types of components. For some conductive materials, eddy Current Array (ECA) probes may be used for inspection. In an ECA probe, alternating current is injected into one or more coils within the ECA probe, thereby generating a magnetic field. When the ECA probe is placed on a subject, an opposite alternating current (called eddy current) is generated. Anomalies in the object under test may interfere with the path of the eddy currents, and the interference may then be detected and measured by the probe. A technician may use the ECA probe to scan the object under test and receive an indication that the ECA probe is experiencing interference. However, not all disturbances correspond to detrimental defects. Some disturbances may be caused by innocuous anomalies. For example, bumps (scab) that are the result of piling up too much material on a surface during a rolling process that leaves a circular mark on the surface often cause disturbances. But the bump may not be considered an unacceptable defect. Thus, in response to receiving the defect indication, the technician may return and verify the reason for the notification by rescanning the area at a different angle and then further considering whether the reason for the defect indication is an unacceptable defect. This may lead to prolonged inspection procedures and is sometimes prone to error. Drawings Each of the figures merely illustrates an example implementation of the disclosure and should not be taken as limiting the scope of the disclosure. Figure 1 shows an ECA probe. FIG. 2 illustrates an example inspection system in accordance with the present subject matter. Fig. 3 illustrates an example inspection arrangement in accordance with the present subject matter. FIG. 4 is a flow chart of an inspection process according to an example of the present subject matter. FIG. 5 illustrates a graphical representation of an inspection process according to an example of the present subject matter. Fig. 6 illustrates a block diagram of an example of a machine that includes any one or more of the techniques (e.g., methods) discussed herein may be performed thereon. Detailed Description The present inventors have recognized, among other things, that there is a need in the art for an inspection system that overcomes the above-described challenges. Examples of the present subject matter provide techniques for collecting inspection data (e.g., c-scan) from multiple probes, such as ECA probes. Each probe may generate inspection data on the surface obtained from different in-plane probe orientations, for example to provide an indication of interference or defects from different in-plane directions relative to the probe sensitivity axis. The inspection data may then be combined while the indications at the different orientations may be retained, and then combined to produce the composition. Pattern recognition may then be performed to determine the type of indication, such as a nuisance defect or a nuisance anomaly, using templates defining defects or anomalies. Accordingly, the systems and methods described herein provide a fast inspection technique while reducing errors. A method is described herein that includes receiving a first set of eddy current inspection data that provides tamper-indicating data obtained in a first orientation relative to a first sensitivity axis, receiving a second set of eddy current inspection data that provides tamper-indicating information in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation, combining the first set of inspection data and the second set of inspection data to generate a combined dataset that retains the tamper-indicating data in the first orientation and the second orientation, and generating an anomalous composition based on the combined dataset. An inspection system is also described herein. The inspection system may include a first probe configured to obtain a first set of eddy current inspection data from the subject, thereby providing indication information in a first orientation relative to a first sensitivity axis. The inspection system may further include a second probe configured to obtain a second set of eddy current inspection data from the subject, thereby providing indication information in a second orientation relative to the second sensitivity axis. The inspection system may also in