CN-116207051-B - Flexible electronic device, preparation method thereof and light-emitting device

CN116207051BCN 116207051 BCN116207051 BCN 116207051BCN-116207051-B

Abstract

The disclosure provides a flexible electronic device, a preparation method thereof and a light-emitting device. The flexible electronic device comprises a first non-woven fabric substrate, a first carbon powder layer, a first metal paste layer, at least one electronic component and a first flexible packaging layer, wherein the first carbon powder layer is arranged on the first non-woven fabric substrate, the first carbon powder layer is formed into a first circuit pattern, the first metal paste layer is formed on the first carbon powder layer and comprises a plurality of first wires, the first metal paste layer is adhered to the first non-woven fabric substrate based on the first carbon powder layer, the at least one electronic component is adhered to the first metal paste layer and is electrically connected with the at least two first wires, and the first flexible packaging layer is arranged on one side, opposite to the first metal paste layer, of the electronic component and is adhered to the first non-woven fabric substrate.

Inventors

GUO RUI
LI TIANYU
HUANG XIAN

Assignees

天津大学

Dates

Publication Date: 20260505
Application Date: 20230315

Claims (9)

1. A method of making a flexible electronic device, comprising: Step S1, hot-pressing carbon powder on thermal transfer paper onto a first non-woven fabric substrate to manufacture a first carbon powder layer on the first non-woven fabric substrate, wherein the first carbon powder layer forms a first circuit pattern on the first non-woven fabric substrate, and the roughness of the thermal transfer paper is larger than that of the first non-woven fabric substrate; s2, coating semi-liquid metal slurry on the first carbon powder layer to manufacture a first metal slurry layer on the first carbon powder layer, wherein a plurality of first wires are formed on the first metal slurry layer, and the adhesion force of the semi-liquid metal slurry to the thermal transfer paper under the action of pressure is smaller than that of the first non-woven fabric substrate; step S3 of adhering at least one electronic component between the first wires to be electrically connected with the first wires, and And S4, preparing a first flexible packaging layer on the first metal slurry layer.
2. The method of claim 1, wherein the hot pressing temperature for hot pressing the carbon powder on the thermal transfer paper onto the first nonwoven fabric substrate is 60 ℃ to 80 ℃.
3. The method of manufacturing according to claim 1, wherein the semi-liquid metal paste is a gallium indium alloy comprising copper particles; the mass fraction of gallium in the gallium-indium alloy is 75.5%.
4. A flexible electronic device prepared by the preparation method of any one of claims 1 to 3, comprising: A first nonwoven substrate; The first carbon powder layer is arranged on the first non-woven fabric substrate and is formed into a first circuit pattern; The first metal slurry layer is formed on the first carbon powder layer and comprises a plurality of first wires, and the first metal slurry layer is adhered on the first non-woven fabric substrate based on the first carbon powder layer; at least one electronic component adhered to the first metal paste layer and electrically connected to at least two of the first wires, the first metal paste layer being made of semi-liquid metal paste, and The first flexible packaging layer is arranged on one side of the electronic element opposite to the first metal slurry layer and is adhered to the first non-woven fabric substrate.
5. The flexible electronic device of claim 4, further comprising: a first adhesive layer disposed between the first flexible encapsulation layer and the electronic component, the first flexible encapsulation layer being adhered to the first non-woven substrate based on the first adhesive layer; the first adhesive layer has a lower heat-melting temperature than the first flexible encapsulation layer and the first nonwoven substrate; The first flexible packaging layer is polypropylene melt-blown cloth.
6. The flexible electronic device of claim 4, further comprising: The second metal slurry layer is formed on one side of the first non-woven fabric substrate opposite to the first carbon powder layer; At least one connection part electrically connecting the second metal paste layer and the first metal paste layer through a through hole formed on the first non-woven substrate; A second non-woven fabric substrate disposed on the opposite side of the second metal paste layer from the first non-woven fabric substrate, and The second carbon powder layer is arranged between the second non-woven fabric substrate and the second metal slurry layer, and the second metal slurry layer is adhered to the second non-woven fabric substrate based on the second carbon powder layer.
7. The flexible electronic device of claim 6, wherein the second carbon powder layer is formed as a second circuit pattern; The second metal slurry layer forms a plurality of second wires on the second carbon powder layer, and the at least one connecting part electrically connects the second wires and the first wires so as to electrically connect at least one electronic component with the second wires.
8. The flexible electronic device of claim 6, further comprising a second adhesive layer, the first nonwoven substrate being adhered to the second metal paste layer and the second nonwoven substrate, respectively, based on the second adhesive layer; the second adhesive layer has a lower heat-fusing temperature than the first nonwoven substrate and the second nonwoven substrate.
9. A light-emitting device produced based on the production method according to any one of claims 1 to 3, comprising: A first nonwoven substrate; The first carbon powder layer is arranged on the first non-woven fabric substrate and is formed into a first circuit pattern; The first metal slurry layer is formed on the first carbon powder layer and comprises a plurality of first wires, and the first metal slurry layer is adhered on the first non-woven fabric substrate based on the first carbon powder layer; A plurality of LED light-emitting elements arranged in a matrix manner are adhered to the first metal slurry layer, and each LED light-emitting element is electrically connected with two first wires; The first flexible packaging layer is arranged on one side of the LED light-emitting element opposite to the first metal slurry layer and is adhered to the first non-woven fabric substrate, a plurality of windowing areas are arranged at positions of the first flexible packaging layer opposite to the LED light-emitting element respectively, and light beams emitted by the LED light-emitting element are emitted to the outside through the windowing areas; the second metal slurry layer is formed on one side of the first non-woven fabric substrate opposite to the first carbon powder layer so as to form a plurality of second wires; A plurality of connection parts electrically connecting the second metal paste layer and the first metal paste layer through holes formed on the first non-woven fabric substrate, respectively, such that one of two first wires electrically connected with the LED light emitting element is electrically connected with one of the second wires through one of the connection parts; A second non-woven fabric substrate disposed on the opposite side of the second metal paste layer from the first non-woven fabric substrate, and The second carbon powder layer is arranged between the second non-woven fabric substrate and the second metal slurry layer, and the second metal slurry layer is adhered to the second non-woven fabric substrate based on the second carbon powder layer, wherein the first metal slurry layer is made of semi-liquid metal slurry.

Description

Flexible electronic device, preparation method thereof and light-emitting device Technical Field The disclosure relates to the field of flexible circuits, in particular to a flexible electronic device based on non-woven fabric printing, a preparation method thereof and a light-emitting device. Background The conventional printed circuit is an electronic circuit in which conductor patterns are etched or sensitized on an insulating substrate by a printing means to interconnect electronic components, and is a base of various electronic devices, which are widely used in various industries. In the early stage, most of the printed circuit substrates are hard substrates, and various flexible electronic circuit preparation processes are continuously proposed for enhancing the applicability of the circuit. However, in the process of preparing a flexible electronic device by using the conventional flexible electronic circuit, the defects of complex process, long processing period, toxic reagents required in the process flow and the like exist, and the personalized, localized and light-weight preparation of the flexible electronic device is difficult to realize. Disclosure of Invention To at least partially overcome at least one of the above-mentioned or other inventive technical drawbacks, at least one embodiment of the present invention provides a flexible electronic device. The first metal slurry layer is adhered to the first non-woven fabric substrate by arranging the first carbon powder layer on the first non-woven fabric substrate. According to one aspect of the present disclosure, there is provided a flexible electronic device including a first non-woven substrate, a first carbon powder layer disposed on the first non-woven substrate, the first carbon powder layer being formed into a first circuit pattern, a first metal paste layer formed on the first carbon powder layer, including a plurality of first conductive lines, the first metal paste layer being adhered to the first non-woven substrate based on the first carbon powder layer, at least one electronic component adhered to the first metal paste layer and electrically connected to at least two of the first conductive lines, and a first flexible encapsulation layer disposed on a side of the electronic component opposite to the first metal paste layer and adhered to the first non-woven substrate. According to the embodiment of the disclosure, the electronic component comprises a first flexible packaging layer, wherein the first flexible packaging layer is arranged between the first flexible packaging layer and the electronic component, the first flexible packaging layer is bonded with the first non-woven fabric substrate based on the bonding layer, the thermal melting temperature of the bonding layer is preferably lower than that of the first flexible packaging layer and the first non-woven fabric substrate, and the first flexible packaging layer is preferably polypropylene melt-blown cloth. According to the embodiment of the disclosure, the non-woven fabric comprises a first non-woven fabric substrate, a first metal slurry layer, at least one connecting part, a second non-woven fabric substrate and a second carbon powder layer, wherein the first metal slurry layer is formed on one side of the non-woven fabric substrate opposite to the first carbon powder layer, the connecting part is electrically connected with the first metal slurry layer and the second metal slurry layer through a through hole formed on the first non-woven fabric substrate, the second non-woven fabric substrate is arranged on one side of the second metal slurry layer opposite to the first non-woven fabric substrate, the second carbon powder layer is arranged between the second non-woven fabric substrate and the second metal slurry layer, and the second metal slurry layer is adhered on the second non-woven fabric substrate based on the second carbon powder layer. Preferably, the second metal paste layer forms a plurality of second wires on the second carbon powder layer, and the at least one connection part electrically connects the second wires and the first wires so as to electrically connect at least one of the electronic components and the second wires. According to the embodiment of the disclosure, the first non-woven fabric substrate further comprises a second bonding layer, the first non-woven fabric substrate is bonded with the second metal slurry layer and the second non-woven fabric substrate based on the second bonding layer, and preferably, the hot melting temperature of the second bonding layer is lower than that of the first non-woven fabric substrate and the second non-woven fabric substrate. According to another aspect of the present disclosure, there is provided a method of manufacturing the flexible electronic device as described above, including the steps of S1 thermally pressing carbon powder on a thermal transfer paper onto a first non-woven substrate to make a first car