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CN-116209147-B - Laminate, method for producing same, and copper wiring

CN116209147BCN 116209147 BCN116209147 BCN 116209147BCN-116209147-B

Abstract

The invention relates to a laminate, a method for manufacturing the laminate, and a copper wiring. A laminate is characterized by comprising a support, a coating layer comprising copper oxide and phosphorus disposed on a surface constituted by the support, and a resin layer disposed so as to cover the coating layer.

Inventors

  • Zhengren Saito
  • Tang Benche
  • TSURUTA MASANORI

Assignees

  • 旭化成株式会社

Dates

Publication Date
20260505
Application Date
20180718
Priority Date
20170718

Claims (20)

  1. 1. A laminate for producing a structure having a conductive pattern region, the laminate comprising a support, a coating layer disposed on a surface constituted by the support and containing copper oxide and a phosphorus-containing organic substance having at least one skeleton selected from the group consisting of a polyethylene glycol structure, a polypropylene glycol structure, a polyacetal structure, a polybutene structure and a polysulfide structure, and a resin layer disposed so as to cover the coating layer, The copper oxide is fine particles containing the copper oxide, and the content of the phosphorus-containing organic substance is 5 to 900 parts by volume based on 100 parts by volume of the total volume of the fine particles, and the content of the fine particles of copper oxide is 10 to 90% by volume based on the coating layer.
  2. 2. The laminate of claim 1, wherein the coating layer is disposed on the support having a three-dimensional surface.
  3. 3. The laminate of claim 1 or 2, wherein the copper oxide is cuprous oxide.
  4. 4. The laminate of claim 1 or 2, wherein the phosphorus-containing organic compound is a phosphate salt.
  5. 5. A laminate for producing a structure having a conductive pattern region, characterized in that the laminate comprises a support, a coating layer which is disposed on the surface constituted by the support and contains copper oxide, a phosphorus-containing organic material having at least one skeleton selected from the group consisting of a polyethylene glycol structure, a polypropylene glycol structure, a polyacetal structure, a polybutene structure and a polysulfide structure, and which contains hydrazine or hydrazine hydrate, and a resin layer disposed so as to cover the coating layer, The copper oxide is fine particles containing the copper oxide, and the content of the phosphorus-containing organic substance is 5 to 900 parts by volume based on 100 parts by volume of the total volume of the fine particles, and the content of the fine particles of copper oxide is 10 to 90% by volume based on the coating layer.
  6. 6. The laminate according to claim 5, wherein the coating layer is disposed on the support having a three-dimensional surface.
  7. 7. The laminate of claim 5 or 6, wherein the copper oxide is cuprous oxide.
  8. 8. The laminate of claim 5 or 6, wherein the phosphorus-containing organic compound is a phosphate salt.
  9. 9. A laminate for a circuit board, characterized in that the laminate comprises a support, a layer in which an insulating region comprising copper oxide and a phosphorus-containing organic substance having at least one skeleton selected from the group consisting of a polyethylene glycol structure, a polypropylene glycol structure, a polyacetal structure, a polybutene structure and a polysulfide structure and a conductive pattern region comprising copper are disposed adjacent to each other on a surface constituted by the support, and a resin layer formed so as to cover the layer, The copper oxide is fine particles containing the copper oxide, and the content of the phosphorus-containing organic substance is 5 to 900 parts by volume based on 100 parts by volume of the total volume of the fine particles, and the content of the fine particles of copper oxide is 10 to 90% by volume based on the insulating region.
  10. 10. The laminate according to claim 9, wherein the insulating region and the conductive pattern region are disposed adjacent to each other on the support having a solid surface.
  11. 11. The laminate of claim 9 or 10, wherein the copper oxide is cuprous oxide.
  12. 12. The laminate of claim 9 or 10, wherein the phosphorus-containing organic compound is a phosphate salt.
  13. 13. A laminate for a circuit board, characterized in that the laminate comprises a support, a layer in which an insulating region containing hydrazine or hydrazine hydrate and a conductive pattern region containing copper are disposed adjacent to each other on a surface constituted by the support, and a resin layer formed so as to cover the layer, wherein the phosphorus-containing organic substance has at least one skeleton selected from the group consisting of a polyethylene glycol structure, a polypropylene glycol structure, a polyacetal structure, a polybutene structure and a polysulfide structure, The copper oxide is fine particles containing the copper oxide, and the content of the phosphorus-containing organic substance is 5 to 900 parts by volume based on 100 parts by volume of the total volume of the fine particles, and the content of the fine particles of copper oxide is 10 to 90% by volume based on the insulating region.
  14. 14. The laminate according to claim 13, wherein the insulating region and the conductive pattern region are disposed adjacent to each other on the support having a solid surface.
  15. 15. The laminate of claim 13 or 14, wherein the copper oxide is cuprous oxide.
  16. 16. The laminate of claim 13 or 14, wherein the phosphorus-containing organic compound is a phosphate salt.
  17. 17. A copper wiring comprising reduced copper obtained by reducing copper oxide, phosphorus and carbon, wherein the copper wiring is a conductive pattern region formed by selectively irradiating the coating layer in the laminate according to any one of claims 1 to 8, the phosphorus/copper element concentration ratio is 0.02 to 0.30, and the carbon/copper element concentration ratio is 1.0 to 6.0.
  18. 18. The copper wiring according to claim 17, wherein an arithmetic average roughness Ra of the copper wiring surface is 20nm to 500nm.
  19. 19. The copper wiring according to claim 17 or 18, wherein the copper wiring further comprises nitrogen, and an element concentration ratio of nitrogen/copper is 0.04 or more and 0.6 or less.
  20. 20. The method for manufacturing a laminate for manufacturing a structure having a conductive pattern region according to claim 1, comprising the steps of: A step of disposing the coating layer containing the copper oxide and the phosphorus-containing organic material on a surface constituted by a support, and And a step of disposing a resin layer so as to cover the coating layer.

Description

Laminate, method for producing same, and copper wiring The present application is a divisional application, the international application number of which is PCT/JP2018/026835, the international application date is 2018, 7, 18, the chinese national application number 201880046322.6, the date of entry into china is 2020, 1, 10, and the title of the present application is "structure having conductive pattern region and method for manufacturing the same, laminate and method for manufacturing the same, and copper wiring". Technical Field The present invention relates to a structure having a conductive pattern region, a method for manufacturing the structure, a laminate, a method for manufacturing the laminate, and a copper wiring. Background The circuit board has a structure in which conductive wiring is provided on the board. The method for manufacturing the circuit board is generally as follows. First, a photoresist is coated on a substrate to which a metal foil is attached. Next, the photoresist is exposed and developed to obtain a desired floor-like shape of the circuit pattern. Next, the metal foil at the portion not covered with the photoresist is removed by chemical etching to form a pattern. Thus, a high-performance conductive substrate can be manufactured. However, the conventional method has the disadvantages of a large number of steps, complexity, and the need for a photoresist material. In contrast, a direct wiring printing technique of directly printing a desired wiring pattern on a substrate using a dispersion (hereinafter also referred to as a "paste material") in which particles selected from the group consisting of metal particles and metal oxide particles are dispersed has been attracting attention. The number of steps in this technique is small, and a photoresist material or the like is not required, so that productivity is extremely high. As an example of the direct printing wiring technique, a technique is known in which a paste material is printed on a support by screen printing or inkjet printing, and then the paste material is thermally fired to obtain a wiring pattern having a low resistance (for example, see patent document 1). There is also known a method of applying a paste material to the entire surface of a substrate, and applying laser light to the paste material in a pattern shape to selectively heat-fire the paste material, thereby obtaining a desired wiring pattern (see, for example, patent documents 1 and 2). There is also known a method of manufacturing copper wiring by applying a dispersion liquid containing cuprous oxide aggregate particles to a polyethylene terephthalate (PET) support at a thickness of 10 to 20 μm and firing the dispersion liquid with a laser (see, for example, patent document 3). With this method, since the laser irradiation portion is not heated, a low heat-resistant resin material such as a PET support can be used. In addition, a technique of using colloidal silica, which is silica particles, as a base layer in order to improve adhesion between a support and a metallic copper-containing film obtained by firing a copper paste is known (for example, see patent document 4). There is also known a method for manufacturing a multilayer wiring board in which a1 st coating layer is formed on a board, a1 st conductive portion is formed by irradiating a part of the 1 st coating layer with light, a2 nd coating layer is formed on the 1 st coating layer, and a2 nd conductive portion is formed by irradiating the 1 st conductive portion with light from the 2 nd coating layer (see, for example, patent document 5). In addition, a method of forming a patterned coating film using copper or copper oxide dispersion on a substrate and performing firing treatment to obtain a conductive film is known (for example, see patent document 6). Prior art literature Patent literature Patent document 1 International publication No. 2010/024385 pamphlet Patent document 2 Japanese patent laid-open No. 5-37126 Patent document 3 Japanese patent No. 5449154 Patent document 4 International publication No. 2016/031860 pamphlet Patent document 5 Japanese patent application laid-open No. 2015-26681 Patent document 6 International publication No. 2015/012664 pamphlet Disclosure of Invention Problems to be solved by the invention In the direct wiring printing technique for forming a wiring pattern by irradiating a paste material with laser light described in patent documents 1 to 3, unfired paste material remains in an area not irradiated with laser light. The unfired paste material has conductivity, and in this state, electrical insulation between wiring patterns cannot be ensured. Therefore, an operation of removing the unfired paste material and filling an insulating material such as a solder resist between the wiring patterns is performed. Therefore, in the conventional direct wiring printing technology, a process for removing the unfired paste material and filling the insulating material is r