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CN-116215958-B - Packaging tray and packaging method for micro-mucosa-attached flexible circuit board

CN116215958BCN 116215958 BCN116215958 BCN 116215958BCN-116215958-B

Abstract

The invention provides a packaging tray for a micro-mucosa attached flexible circuit board and a packaging method thereof, comprising a tray body, wherein the tray body comprises a front surface and a back surface, a plurality of circuit board placement areas are arranged in the front surface, a non-concave area corresponding to the placement areas is a non-placement area, and a flange boss is arranged at the edge of the non-placement area; the flange boss is provided with a plurality of hand through grooves, the placement area is provided with a plurality of placement grooves, the connection part of the placement grooves is provided with interval protrusions which divide the placement area into a plurality of placement grooves, and the hand through grooves are connected with the placement grooves. The release film is pressed by the hand through groove to be attached to the micro-mucosa, the circuit board is aligned and placed, the circuit board is packaged rapidly, the tray placement area is provided with interval protrusions for preventing the micro-mucosa from adhering and overlapping, the number and the positions of the release film can be set according to the specification of the shipment package, products with uniform specification can be produced rapidly at the same time, the packaging efficiency is improved, the hand through groove is attached to the finger size of a person, the human engineering is met, and the operation is convenient.

Inventors

  • HUANG XINHONG
  • WU QIONG
  • LIU XUYUAN

Assignees

  • 深圳市鑫达辉软性电路科技有限公司

Dates

Publication Date
20260505
Application Date
20221230

Claims (7)

  1. 1. The utility model provides a little attached flexible circuit board packaging tray of mucosa, includes tray (1) body, tray (1) body include openly and with the back that openly is relative, openly inside be provided with a plurality of sunken flexible circuit board (2) place the district, with place other non-sunken regions that the district corresponds and be non-place the district, its characterized in that includes: A flange boss (11) is arranged at the edge of the non-placing area; The flange boss (11) is provided with a plurality of hand through grooves (12); The positioning device comprises a positioning area, a flange boss (11), a positioning groove (13), a pair of positioning grooves (12) and a pair of positioning grooves (12), wherein the positioning area is provided with a plurality of positioning grooves (13), the flange boss (11) is provided with four positioning grooves (12), the positioning grooves (12) are in corresponding relation with each other, the two positioning grooves (12) are in a group, and the two groups of positioning grooves (12) are respectively arranged on two sides of the two positioning grooves (13); the hand through groove (12) is connected with the placement groove (13); The depth of the hand through groove (12) is not higher than that of the placement groove (13), the length of the hand through groove (12) is not greater than that of the placement groove (13), and the width of the hand through groove (12) is consistent with that of the flange boss (11); the connection part of the placement grooves (13) is provided with spacing protrusions (14) which divide the placement area into a plurality of placement grooves (13); The interval bulge (14) is connected with the two flange bosses (11); The flange boss (11) is provided with a plurality of support grooves (111), the support grooves (111) face the back to form support columns (112) protruding out of the back, and when the trays (1) are stacked, the support columns (112) on the back of the upper tray (1) are buckled with the support grooves (111) of the lower tray (1); The upper surface of the placement groove (13) is provided with a micro-adhesive film (15), the micro-adhesive film (15) is provided with an adhesive layer upwards, and the flexible circuit board (2) is placed on the adhesive layer of the micro-adhesive film (15).
  2. 2. The micro-adhesive film attached flexible circuit board packaging tray according to claim 1, wherein the micro-adhesive film (15) has a size not larger than the size of the placement groove (13).
  3. 3. The micro-mucosa attached flexible circuit board packaging tray according to claim 1, wherein the length of the hand through groove (12) is 5 mm-12 mm, and the depth of the hand through groove (12) is 10-11 mm.
  4. 4. The micro-adhesive film attached flexible circuit board packaging tray according to claim 1, wherein a corner of the tray (1) is provided with a chamfer notch (3).
  5. 5. The flexible circuit board packaging tray for micro-adhesive attachment as claimed in claim 1, wherein the upper surface of the flange boss (11) is provided with an arrow mark.
  6. 6. The flexible circuit board packaging tray for micro-adhesive attachment as claimed in claim 1, wherein the tray (1) material comprises an antistatic material.
  7. 7. A method of packaging a micro-adhesive flexible circuit board, comprising a flexible circuit board (2) and the micro-adhesive flexible circuit board packaging tray according to any one of claims 1 to 6, the method comprising: S01, cutting a micro-mucosa (15) according to the size of a placement groove (13) of the tray (1), separating a release film on the surface of the micro-mucosa (15), and placing the release film on one side for later use; S02, placing a micro-adhesive film (15) on the upper surface of a placement groove (13) on the front surface of the tray (1) through the hand through groove (12), wherein the micro-adhesive film (15) is provided with an adhesive layer upwards; s03, grabbing the flexible circuit board (2) by an equipment manipulator to perform an ICT process, and sequentially arranging the flexible circuit board (2) passing through the ICT process on the micro-mucosa (15) of the placement groove (13); S04, aligning the release film with the placement groove (13) through the hand through groove (12), and placing the release film on the placement groove (13) attached with the continuous flexible circuit board (2); S05, pressing the release film towards the placing groove (13) through the hand through groove (12) to enable the release film to be attached to the micro-mucosa (15), and obtaining the packaged continuous flexible circuit board (2).

Description

Packaging tray and packaging method for micro-mucosa-attached flexible circuit board Technical Field The invention relates to the field of printed circuit board production, in particular to a packaging tray for a micro-adhesive-film-attached flexible circuit board and a packaging method. Background The flexible circuit board, namely the flexible board or the FPC for short, can provide excellent electrical performance, can also meet the design requirement of smaller and higher-density installation, is beneficial to reducing assembly procedures and enhancing reliability, and is the best solution for meeting the miniaturization and movement requirements of electronic products. The flexible circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the wires, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved, the volume and weight of an electronic product can be greatly reduced, and the flexible circuit board is suitable for the requirement of the development of the electronic product in the high-density, miniaturized and high-reliability directions. Nowadays, with the rapid development of flexible circuit boards, flexible circuit boards are increasingly developed toward the trend of light weight, thinness and miniaturization, and at the same time, requirements for quality, appearance, performance and the like of flexible circuit boards are also increasingly high. The production process of the flexible circuit board is to directly process the whole part of the continuous printing plate product, and the continuous printing plate product of the flexible circuit board contains a plurality of single flexible circuit board products which are uniformly distributed at intervals. The flexible circuit boards passing ICT test are usually placed in a general tray in disorder, overlapping and crush of the flexible circuit boards are easy to occur, a packer manually sticks the single flexible circuit board to a micro-mucosa according to typesetting sequence, covers a release film, has complicated flow, needs manual alignment, causes low film sticking efficiency and easy scrapping and damage of the circuit boards, and meanwhile, when the order quantity is large and the time is urgent, the flexible circuit boards are packed by manual single pcs, so that the overall packing efficiency is low, the working and production efficiency is influenced, and the manpower and time cost is increased. Disclosure of Invention In view of the above, the present invention provides a flexible circuit board packaging tray and a packaging method for attaching a micro-adhesive film to a flexible circuit board in order to improve packaging efficiency of the flexible circuit board. The invention provides the following technical scheme: The utility model provides a attached flexible circuit board encapsulation tray of little mucosa, includes the tray body, the tray body include the front with the back that the front is relative, the front is inside to be provided with a plurality of sunken circuit board and places the district, with place other non-sunken areas that the district corresponds and be non-and place the district, include: the edge of the non-placing area is provided with a flange boss; The flange boss is provided with a plurality of hand through grooves; The placement area is provided with a plurality of placement grooves; The connecting part of the placing grooves is provided with spacing protrusions which divide the placing area into a plurality of placing grooves; The hand through groove is connected with the placing groove. Preferably, the upper surface of the placement groove is provided with a micro-adhesive film, the micro-adhesive film is arranged in the opposite direction of the placement groove, and the circuit board is placed on the micro-adhesive film. Preferably, the micro-mucosa size is not larger than the placement groove size. Preferably, the hand through groove is arranged at one end and/or two ends of the placing groove, and the height of the hand through groove is not higher than that of the placing groove. The support columns on the back surface of the upper tray are buckled with the support grooves of the lower tray when the trays are stacked and placed. Preferably, the length of the hand through groove is 5 mm-12 mm, the width of the hand through groove is 0 mm-5 mm, the depth of the hand through groove is 10-11 mm, the length of the hand through groove is not greater than the length of the placing groove, and the width of the hand through groove is consistent with the width of the flange boss. Preferably, one corner of the tray is provided with a fool-proof chamfering notch. Preferably, the upper surface of the flange boss is provided with a fool-proof arrow mark. Preferably, the tray material comprises an