CN-116243022-B - Test module communication structure based on conduction tester

CN116243022BCN 116243022 BCN116243022 BCN 116243022BCN-116243022-B

Abstract

The invention discloses a test module communication structure based on a conduction tester, which comprises a conduction test host, a conduction test board and a plurality of communication node modules, wherein the conduction test host is provided with a host MCU, a host data signal output end and a host data signal input end which are respectively connected with the host MCU, the conduction test board is provided with a plurality of communication interfaces, each communication interface is connected with a test bus through a corresponding first switch and grounded through a corresponding second switch, the communication node modules are provided with module indicator lamps, node MCU, a node data signal input end and a node data signal output end which are connected with the node MCU, the module indicator lamps, the node data signal input end and the node data signal output end are connected with the corresponding communication interfaces through module indicator lamp control lines, and the module indicator lamps are also connected with the host MCU through indicator lamp enabling signal lines. The structure forms a communication network with all the test modules, so that the test host can read and store the test results and parameters of the test modules, and the traceability of the test products is realized.

Inventors

LI SHAOMIN

Assignees

上海钛阳线束测试系统有限公司

Dates

Publication Date: 20260505
Application Date: 20221206

Claims (7)

1. The test module communication structure based on the conduction tester is characterized by comprising a conduction test host, a conduction test board and a plurality of communication node modules, wherein each communication node module is a test node; The on test host is provided with a host MCU, a host data signal output end and a host data signal input end which are respectively connected with the host MCU; The on test point board is provided with a plurality of communication interfaces, each communication interface is connected with the test bus through a corresponding first switch and is grounded through a corresponding second switch, the first switch is in a communication state when opened, the on test host sends and receives data signals to a corresponding test node, and the second switch is in a closed state in the communication state; the communication node module is provided with a module indicator lamp, a node MCU, a node data signal input end, a node data signal output end and a sensor, wherein the node data signal input end, the node data signal output end and the sensor are connected with corresponding communication interfaces through module indicator lamp control lines, and the module indicator lamp is also connected with the host MCU through an indicator lamp enabling signal line; The node data signal output end comprises a node inverter and a node signal output switch which are sequentially connected with the node MCU, wherein the drain electrode of the node signal output switch is connected with a corresponding communication interface through an indicator lamp control line, and the source electrode of the node signal output switch is grounded; The node data signal input end comprises a node comparator, one input end of the node comparator is connected with a corresponding communication interface through a control line connected with the indicator lamp, the other input end of the node comparator is a reference voltage input, and the output end of the node comparator is connected with the node MCU; The node data signal input end comprises a first node input MOS tube switch, a second node input MOS tube switch and a third node input MOS tube switch, wherein the grid electrode of the first node input MOS tube switch is connected with an indicator lamp enabling signal line, the source electrode of the first node input MOS tube switch is connected with the grid electrode of the second node input MOS tube switch, the drain electrode of the first node input MOS tube switch is connected with an indicator lamp control line through a voltage stabilizing diode, the drain electrode of the second node input MOS tube switch is connected with the grid electrode of the third node input MOS tube switch, the drain electrode of the third node input MOS tube switch is connected with a node MCU, the source electrodes of the second node input MOS tube switch and the third node input MOS tube switch are grounded, the drain electrode of the second node input MOS tube switch and the drain electrode of the third node input MOS tube switch are respectively connected with a pull-up resistor and then are connected with a power supply positive electrode, the node data signal output end comprises a first node output MOS tube switch and a second node output MOS tube switch, the drain electrode of the first node output MOS tube switch is connected with a power supply positive electrode through a pull-up resistor, the drain electrode of the second node output MOS tube switch is connected with the drain electrode of the second node output MOS tube switch through a pull-up resistor, and the drain electrode of the second node output MOS tube switch is connected with the drain electrode of the second node output MOS tube switch through the drain electrode of the second node input MOS tube switch.
2. The communication structure of the test module based on the conduction tester as set forth in claim 1, wherein the first switch and the second switch are MOS transistor switch circuits, and the first switch and the second switch are controlled by serial data of two columns generated by a conduction test host through a serial-to-parallel integrated circuit on a conduction test board respectively so as to control the first switch and the second switch to be turned on/off.
3. The communication structure of the test module based on the conduction tester as set forth in claim 1, wherein the host data signal output terminal comprises a host inverter and a host signal output switch sequentially connected with the host MCU, the drain electrode of the host signal output switch is connected with the test bus and connected with the positive electrode of the power supply through a current limiting resistor, and the source electrode of the host signal output switch is grounded, so that the level of the test bus changes along with the level of the host data signal output terminal.
4. The communication structure of the test module based on the conduction tester as set forth in claim 1, wherein the host data signal input terminal comprises a host comparator, the test bus is connected with one input terminal of the host comparator, the other input terminal of the host comparator is a reference voltage input, and the output terminal of the host comparator is connected with the host MCU.
5. The communication structure of the test module based on the conduction tester as set forth in claim 1, wherein the control line of the indicator lamp connected with the communication interface on the conduction test point board is used as a feedback line of the test result of the module and also as a communication line for sending and receiving data to the communication node module, and each communication interface on the conduction test point board is used for testing the conduction, the resistance and the capacitance of the line and also used as a communication interface for sending and receiving data to the communication node module.
6. The test module communication structure based on the conduction tester is characterized by comprising a conduction test host and a plurality of communication node modules, wherein each communication node module is a test node; The on test host is provided with a host MCU, a host data signal output end and a host data signal input end which are respectively connected with the host MCU, wherein the host data signal output end and the host data signal input end are both connected with a communication bus; The communication node module is provided with a node MCU, a node data signal input end, a node data signal output end and a sensor, wherein the node data signal input end, the node data signal output end and the sensor are connected with the communication bus, and the node MCU is also connected with the host MCU through a communication enabling signal line; The node data signal output end comprises a node inverter and a node signal output switch which are sequentially connected with the node MCU, wherein the drain electrode of the node signal output switch is connected with a corresponding communication interface through an indicator lamp control line, and the source electrode of the node signal output switch is grounded; The node data signal input end comprises a node comparator, one input end of the node comparator is connected with a corresponding communication interface through a control line connected with the indicator lamp, the other input end of the node comparator is a reference voltage input, and the output end of the node comparator is connected with the node MCU; The node data signal input end comprises a first node input MOS tube switch, a second node input MOS tube switch and a third node input MOS tube switch, wherein the grid electrode of the first node input MOS tube switch is connected with an indicator lamp enabling signal line, the source electrode of the first node input MOS tube switch is connected with the grid electrode of the second node input MOS tube switch, the drain electrode of the first node input MOS tube switch is connected with an indicator lamp control line through a voltage stabilizing diode, the drain electrode of the second node input MOS tube switch is connected with the grid electrode of the third node input MOS tube switch, the drain electrode of the third node input MOS tube switch is connected with a node MCU, the source electrodes of the second node input MOS tube switch and the third node input MOS tube switch are grounded, the drain electrode of the second node input MOS tube switch and the drain electrode of the third node input MOS tube switch are respectively connected with a pull-up resistor and then are connected with a power supply positive electrode, the node data signal output end comprises a first node output MOS tube switch and a second node output MOS tube switch, the drain electrode of the first node output MOS tube switch is connected with a power supply positive electrode through a pull-up resistor, the drain electrode of the second node output MOS tube switch is connected with the drain electrode of the second node output MOS tube switch through a pull-up resistor, and the drain electrode of the second node output MOS tube switch is connected with the drain electrode of the second node output MOS tube switch through the drain electrode of the second node input MOS tube switch.
7. The conduction tester-based test module communication structure of claim 6, wherein: The host data signal output end comprises a host inverter and a host signal output switch which are sequentially connected with the host MCU, wherein the drain electrode of the host signal output switch is connected with the communication bus and is connected with the positive electrode of the power supply through a current limiting resistor, and the source electrode of the host signal output switch is grounded, so that the level of the communication bus changes according to the level of the host data signal output end; the host data signal input end comprises a host comparator, the communication bus is connected with one input end of the host comparator, the other input end of the host comparator is a reference voltage input, and the output end of the host comparator is connected with the host MCU.

Description

Test module communication structure based on conduction tester Technical Field The invention relates to the technical field of wire harness testing systems, in particular to a testing module communication structure based on a conduction tester. Background The wire harness test is to test wiring components, insulation wrapping materials and the like for connecting various electrical equipment in a circuit so as to find out possible problems, and parameters generally required to be tested include conduction, insulation, voltage resistance, resistance and the like of the wire harness. The wire harness test system mainly comprises an upper computer, a test host, a test point board and a test module, wherein data of a sensor in the existing test module cannot be uploaded to the computer for storage, meanwhile, sensor parameters of the test module cannot be set, a setting result of the sensor cannot be obtained by the computer, and bad products pass the test due to incorrect sensor setting, so that the test module does not realize networking in practice, and whether the test module is qualified or not can be judged only according to qualified switching signals output by the test module. In view of this, the present inventors have added a communication structure based on the existing harness test system, and have developed a test module communication structure based on a conduction tester. Disclosure of Invention The invention aims to provide a communication structure of a test module based on a conduction tester, which is characterized in that a communication interface is added on the basis of the test module, an error indication circuit of an original module is used as a communication circuit, each test module is formed into a communication network under the condition of not adding wiring, so that a test host can read test results and parameter settings of the test module, and the data are stored, thereby realizing the tracing of test products. In order to achieve the technical purpose, the invention adopts the following technical scheme: the test module communication structure based on the conduction tester comprises a conduction test host, a conduction test point board and a plurality of communication node modules, wherein each communication node module is a test node; The on test host is provided with a host MCU, a host data signal output end and a host data signal input end which are respectively connected with the host MCU; the on test point board is provided with a plurality of communication interfaces, each communication interface is connected with the test bus through a corresponding first switch and is grounded through a corresponding second switch, the first switch is in a communication state when being opened, the on test host can send and receive data signals to a corresponding test node, and the second switch is in a closing state in the communication state; The communication node module is provided with a module indicator lamp, a node MCU, a node data signal input end, a node data signal output end and a sensor, wherein the node data signal input end, the node data signal output end and the sensor are connected with the corresponding communication interfaces through module indicator lamp control lines, and the module indicator lamp is connected with the host MCU through indicator lamp enabling signal lines. Furthermore, the first switch and the second switch are both MOS tube switch circuits, and the first switch and the second switch are respectively controlled by two rows of serial data generated by the conduction test host through the serial-to-parallel integrated circuit on the conduction test point board so as to control the first switch and the second switch to be turned on/off. Further, the host data signal output end comprises a host inverter and a host signal output switch which are sequentially connected with the host MCU, wherein a drain electrode of the host signal output switch is connected with the test bus and is connected with the positive electrode of the power supply through a current limiting resistor, and a source electrode of the host signal output switch is grounded, so that the level of the test bus is changed along with the level of the host data signal output end. Further, the host data signal input end comprises a host comparator, the test bus is connected with one input end of the host comparator, the other input end of the host comparator is a reference voltage input, and the output end of the host comparator is connected with the host MCU. Further, the node data signal output end comprises a node inverter and a node signal output switch which are sequentially connected with the node MCU, a drain electrode of the node signal output switch is connected with a corresponding communication interface through an indicator lamp control line, and a source electrode of the node signal output switch is grounded. Further, the node data signal input end comprises a node comparator,