CN-116260025-B - Method for manufacturing electronic component and electronic component

CN116260025BCN 116260025 BCN116260025 BCN 116260025BCN-116260025-B

Abstract

In a method for manufacturing an electronic component having a case in which terminals are insert-molded, the terminals include a tapered portion having a narrower width and an extension portion extending from a front end of a narrower width side of the tapered portion, a mold constituting a cavity includes an upper mold and a slide mold, after positioning the extension portion in a groove formed in one face of the slide mold, the slide mold is slid relatively with respect to the extension portion, and end edges of both side faces of the groove facing the cavity are abutted against both side faces of the tapered portion, and by bringing the upper mold and one face into close contact, and a part of the tapered portion and the extension portion located in the groove are sandwiched by a bottom face of the groove and the upper mold, the remainder of the tapered portion is molded in a state of being located in the cavity, and a connection portion protruding from the case is formed by the part of the tapered portion and the extension portion.

Inventors

KIMITA YOHEI
AKIMOTO HIROSHI
NISHIMURA YOSHIYUKI
ISAO NEMOTO
Nakaya Toru

Assignees

日本航空电子工业株式会社

Dates

Publication Date: 20260505
Application Date: 20221108
Priority Date: 20211209

Claims (4)

1. A method for manufacturing an electronic component having a housing in which terminals are insert molded, characterized in that, The terminal comprises a taper part with a width as a tip is thinner, and an extension part extending from the front end of the taper part on the narrower side of the width, The mold constituting the cavity for molding the housing includes a first mold and a second mold, After the extension portion is positioned in the groove formed in one surface of the second die, the second die is slid relatively to the extension portion, and the end edges of both side surfaces of the groove facing the cavity are abutted against both side surfaces of the tapered surface constituting the tapered portion, The first die and the one surface are brought into close contact with each other, and a part of the tapered portion and the extension portion located in the groove are sandwiched by the bottom surface of the groove and the first die, whereby the remaining part of the tapered portion is molded in a state of being located in the cavity, and a connection portion protruding from the housing is formed by the part of the tapered portion and the extension portion.
2. The method for manufacturing an electronic component according to claim 1, wherein, The connection portion is a soldering portion to be soldered to a pad of the substrate or a contact portion to be in contact with a terminal of the opponent side electronic component.
3. An electronic component having a housing in which terminals are insert molded, The terminal comprises a taper part with a width as a tip is thinner, and an extension part extending from the front end of the taper part on the narrower side of the width, A portion of the taper and the extension protrude from the housing to form a connection, The remainder of the taper is embedded in the housing.
4. The electronic component of claim 3, wherein, The connection portion is a soldering portion to be soldered to a pad of the substrate or a contact portion to be in contact with a terminal of the opponent side electronic component.

Description

Method for manufacturing electronic component and electronic component Technical Field The present invention relates to an electronic component having a housing in which terminals are insert molded, and a method of manufacturing the same. Background Fig. 1 (a) shows a connector 10 disclosed in patent document 1 (japanese unexamined patent publication No. 10-264163) as a conventional example of such an electronic component, and fig. 1 (b) shows an enlarged cross section thereof. The connector 10 is configured such that contacts 11 are insert molded in a housing (referred to as an insulator in patent document 1) 12. In fig. 1, 11a shows a lead portion of the contact 11, and 11b shows a fitting portion of the contact 11. Fig. 2 shows the contact member 15 inserted into the mold, and a plurality of contacts 11 are provided in a comb-like shape between the lead-out side cross plate 16 and the fitting side cross plate 17 via slits. Fig. 3 shows a state when the insert mold structure is clamped, in which 21 denotes a center plate, 22 denotes a base integrally protruding from the center plate 21, and 23 denotes a pair of slide plates that are movable on the base 22 while being in contact with and separated from both side surfaces of the center plate 21. In addition, 24 denotes a movable die plate, and 25 denotes a cavity. As shown in fig. 4, the slide die plate 23 is provided with a first projection group 26 which is easy to enter the slit of the fitting portion 11b of the contact member 15, and a second projection group 27 which is easy to enter the slit of the lead portion 11a of the contact member 15. The contact member 15 is positioned by the first projection group 26 and the second projection group 27, and the extraction side cross plate 16 is pressed and fixed by the movable platen 24 at the time of mold clamping, and the fitting side cross plate 17 is pressed and fixed by the slide platen 23. In fig. 3, the contact member 15 is shown with a thick line. After the molding by injecting the resin into the cavity 25, the connector 10 shown in fig. 1 is obtained by opening the mold, taking out the connector, and cutting and folding the lead portion 11a and the fitting portion 11b to a predetermined length. Disclosure of Invention In the connector 10 described above, in an electronic component in which terminals are insert-molded in a housing, in order to position the terminals at predetermined positions, it is necessary to position the terminals at the time of molding. In patent document 1, a first projection group 26 and a second projection group 27 are provided on a slide die plate 23, and a contact 11 is positioned by being inserted into a groove between these projection groups. However, in the case where the groove is provided in the die and the terminal is inserted and positioned in this manner, if the gap (clearance) between the terminal and the groove is set too narrow in the groove width direction, the insertion property of the terminal into the groove is deteriorated, for example, the die interferes with the terminal, and the terminal is damaged. Therefore, it is necessary to expand the gap between the terminal and the groove to some extent, in which case, a situation may occur in which the resin leaks from the gap between the terminal and the groove at the time of molding. The leaked resin becomes resin burrs and covers the portion of the terminal protruding from the housing, and therefore, in the case where the portion of the terminal protruding from the housing is, for example, a welded portion welded to a land (land) of the substrate, the welding quality, strength may be insufficient due to the presence of the resin burrs. In addition, in the case where the portion of the terminal protruding from the housing is, for example, a contact portion that contacts a terminal of a counter-side electronic component, there is a possibility that contact quality may be impaired due to the presence of resin burrs, or the resin burrs are scraped off at the time of contact to generate dust. In view of such circumstances, an object of the present invention is to provide a method for manufacturing an electronic component capable of suppressing occurrence of resin burrs that adversely affect quality, and also to provide an electronic component to which such a method for manufacturing is applicable. According to an embodiment of the present invention, in a method for manufacturing an electronic component having a case in which a terminal is insert-molded, the terminal includes a tapered portion having a narrower width and an extension portion extending from a front end of a narrower width side of the tapered portion, a mold forming a cavity for molding the case includes a first mold and a second mold, after the extension portion is positioned in a groove formed in one surface of the second mold, the second mold is slid relatively with respect to the extension portion, and end edges of both side surfaces of the groove fac