CN-116314082-B - Chip heat dissipation structure and heat dissipation method

CN116314082BCN 116314082 BCN116314082 BCN 116314082BCN-116314082-B

Abstract

The invention discloses a chip heat dissipation structure and a heat dissipation method, relates to the technical field of chip heat management, and is used for solving the problem of limited heat dissipation capacity in the prior art. The cooling medium cooling device comprises a structure layer, a first flexible manifold layer and a second flexible manifold layer, wherein a cooling medium inlet and a cooling medium outlet are formed in the first flexible manifold layer and the second flexible manifold layer, the cooling medium inlet and the cooling medium outlet on the first flexible manifold layer are correspondingly communicated with the cooling medium inlet and the cooling medium outlet on the second flexible manifold layer, a liquid separation channel is further formed in the first flexible manifold layer, the structure layer is arranged above the first flexible manifold layer and is provided with a micro-channel structure, and the cooling medium is uniformly dispersed into the micro-channel structure through the liquid separation channel. The flexible manifold and micro-flow heat dissipation are introduced into the heat management of a high-power chip in a flexible electronic system, and the cooling liquid is directly pumped to a hot spot of the chip, so that the heat is quickly taken away, and the heat dissipation efficiency can be effectively improved.

Inventors

JIAO BINBIN
DU XIANGBIN
KONG YANMEI
YE YUXIN
LIU RUIWEN
YUN SHICHANG
YU LIHANG

Assignees

中国科学院微电子研究所

Dates

Publication Date: 20260505
Application Date: 20230223

Claims (9)

1. A chip heat dissipation structure, comprising: a structural layer, a first flexible manifold layer, and a second flexible manifold layer; The first flexible manifold layer is arranged above the second flexible manifold layer, and the cooling working medium inlet and the cooling working medium outlet on the first flexible manifold layer are correspondingly communicated with the cooling working medium inlet and the cooling working medium outlet on the second flexible manifold layer; The first flexible manifold layer is also provided with a liquid separation channel which is communicated with a cooling working medium inlet and a cooling working medium outlet which are arranged on the first flexible manifold layer; The cooling medium cooling structure comprises a plurality of layers of flexible manifolds with gradient hardness, wherein the first flexible manifold layer and the second flexible manifold layer respectively comprise a plurality of layers of flexible manifolds, the flexible manifolds are arranged in a ladder shape, and the hardness of the flexible manifolds arranged close to a chip is larger than that of the flexible manifolds arranged far away from the chip.
2. The structure of claim 1, wherein the microchannel structure comprises a plurality of microchannels, and each of the microchannels is disposed side-by-side in parallel along a length of the structural layer.
3. The structure of claim 1, wherein at least one first cooling medium inlet and at least one first cooling medium outlet are provided on any one of the peripheral side walls of the second flexible manifold layer; a second cooling working medium inlet which is used for being correspondingly communicated with the first cooling working medium inlet and a second cooling working medium outlet which is used for being correspondingly communicated with the first cooling working medium outlet are arranged on the top side wall of the second flexible manifold layer; And a third cooling working medium inlet which is used for being correspondingly communicated with the second cooling working medium inlet and a third cooling working medium outlet which is used for being correspondingly communicated with the second cooling working medium outlet are arranged on the first flexible manifold layer.
4. A structure according to claim 3, wherein the liquid separation channel comprises a first liquid separation channel and a second liquid separation channel; A plurality of first liquid separation channels and a plurality of second liquid separation channels are arranged between the third cooling working medium inlet and the third cooling working medium outlet, each first liquid separation channel is communicated with the third cooling working medium inlet, and each second liquid separation channel is communicated with the third cooling working medium outlet; Each first liquid separation channel and each second liquid separation channel are arranged in a crossing mode.
5. The structure of claim 1, wherein the micro-fluidic channel structure is an embedded micro-fluidic channel structure or a micro-fluidic cooling plate structure; The micro-channel structure at least comprises a micro-channel and a micro-column.
6. The structure of claim 1, wherein the flexible manifold is made of flexible material, and the flexible manifold with different hardness is obtained by adding curing agents with different proportions; And all layers of flexible manifolds and micro-channel structures are connected in a bonding mode.
7. The structure of claim 1, wherein the chip heat dissipation structure is applied to a flexible electronic device comprising at least a flexible wearable device, a foldable electronic device, or a bionic soft robot.
8. A heat dissipation method for a chip is characterized in that, heat dissipation using the chip heat dissipation structure of any one of claims 1-7, the method comprising: injecting a cooling working medium into a first cooling working medium inlet on the peripheral side wall of the second flexible manifold layer; the cooling working medium enters a third cooling working medium inlet of the first flexible manifold layer from a second cooling working medium inlet on the top side wall of the second flexible manifold layer through a flexible manifold of the second flexible manifold layer, and then enters a liquid separation channel on the first flexible manifold layer through a flexible manifold of the first flexible manifold layer; And dispersing the cooling working medium into a micro-channel structure of a structural layer below the chip substrate through the liquid separation channel, and discharging the heat of the chip through cooling working medium outlets of the first flexible manifold layer and the second flexible manifold layer by the cooling working medium.
9. The method of claim 8, further comprising, after dispersing the cooling medium into the micro flow channel structure of the structural layer below the chip substrate through the liquid separation channel: the cooling working medium passing through the micro-channel structure is recovered by the liquid separation channel; The liquid separation channel passes through a third cooling working medium outlet of the first flexible manifold layer through the cooling working medium passing through the micro-channel structure; And through the flexible manifold of the first flexible manifold layer, a second cooling working medium outlet on the top side wall of the second flexible manifold layer enters the flexible manifold of the second flexible manifold layer, and the cooling working medium recovered by the liquid separation channel is discharged through a first cooling working medium outlet on the peripheral side wall of the second flexible manifold layer.

Description

Chip heat dissipation structure and heat dissipation method Technical Field The present invention relates to the field of chip thermal management technologies, and in particular, to a chip heat dissipation structure and a heat dissipation method. Background In the application of flexible wearable equipment, foldable electronic devices, bionic soft robots and other flexible electronics, in order to improve the comprehensive performance of the system, the equipment can face more complex working conditions, and the development of flexible electronic chips to the directions of miniaturization, integration and intellectualization is promoted. For example, the design of the bionic robot is not satisfied with simple daily activities, but is developed to a comprehensive and intelligent direction, so that the requirement for the system computing capability is greatly improved due to the high-simulation of human behaviors, and therefore, more and more high-power chips, such as high-performance computing chips, are integrated into a flexible electronic system, however, the use of high-performance integrated circuits can cause local heat accumulation although the information processing capability is improved, and serious thermal management problems are caused. In addition, the flexible material has low heat conductivity coefficient, which brings great difficulty to heat dissipation of high-power chips in flexible electronic devices, and secondly, the flexible electronic devices need repeated mechanical impact, and the packaging reliability faces great challenges. The traditional high-power chip heat dissipation scheme is difficult to meet the requirements of flexible electronic, light weight and deformability due to the fact that a rigid structure is adopted mostly. The flexible substrate heat dissipation scheme of the flexible electronic device, such as a flexible heat pipe, a flexible heat dissipation film and the like, is modified by a flexible material to enhance the heat conductivity of a flexible structure, so that the flexible electronic device has better heat transfer and temperature uniformity effects on the basis of adapting to a flexible working environment, but has limited heat dissipation capability, and is difficult to meet the heat dissipation requirement of a high-power chip. Thus, a more reliable chip heat dissipation scheme is provided. Disclosure of Invention The invention aims to provide a chip heat dissipation structure and a heat dissipation method, which are used for solving the problems that the heat dissipation capacity is limited and the heat dissipation requirement of a high-power chip is difficult to meet in the prior art. In order to achieve the above object, the present invention provides the following technical solutions: in a first aspect, the present invention provides a chip heat dissipation structure, including: a structural layer, a first flexible manifold layer, and a second flexible manifold layer; The first flexible manifold layer is arranged above the second flexible manifold layer, and the cooling working medium inlet and the cooling working medium outlet on the first flexible manifold layer are correspondingly communicated with the cooling working medium inlet and the cooling working medium outlet on the second flexible manifold layer; The first flexible manifold layer is also provided with a liquid separation channel which is communicated with a cooling working medium inlet and a cooling working medium outlet which are arranged on the first flexible manifold layer; The structure layer is arranged above the first flexible manifold layer, a micro-channel structure is arranged on one side of the structure layer, which is close to the first flexible manifold layer, and cooling working medium is uniformly dispersed into the micro-channel structure through the liquid separation channel. The chip heat dissipation structure comprises a plurality of layers of flexible manifolds with gradient hardness, wherein the first flexible manifold layer and the second flexible manifold layer respectively comprise a plurality of layers of flexible manifolds, the flexible manifolds are arranged in a ladder shape, and the hardness of the flexible manifolds close to the chip is higher than that of the flexible manifolds far away from the chip. Optionally, the micro-channel structure includes a plurality of micro-channels, and each micro-channel is disposed parallel and side by side along a length direction of the structural layer. Optionally, at least one first cooling working medium inlet and at least one first cooling working medium outlet are arranged on any one peripheral side wall of the second flexible manifold layer; a second cooling working medium inlet which is used for being correspondingly communicated with the first cooling working medium inlet and a second cooling working medium outlet which is used for being correspondingly communicated with the first cooling working medium outlet are a