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CN-116316040-B - Substrate, TO-CAN assembly and packaging method

CN116316040BCN 116316040 BCN116316040 BCN 116316040BCN-116316040-B

Abstract

The invention relates TO the technical field of photoelectric communication, and provides a substrate, a TO-CAN assembly and a packaging method. The high-frequency signal circuit comprises a substrate, a signal board and a signal board, wherein the substrate is provided with a first conductive layer, the first conductive layer extends along the front surface of the substrate to the side surface of the substrate until the first conductive layer extends to the back surface of the substrate, the signal board connected with the substrate is provided with a fourth conductive layer, and the fourth conductive layer is connected with the first conductive layer through a connecting agent so as to realize high-frequency signal circuit connection between the substrate and the signal board. In the invention, the high-frequency signal line connection is realized in the form of the medium transmission line, compared with the high-frequency signal line connection in the prior art by adopting a row of parallel gold wires, the method reduces the process difficulty of the high-frequency signal line connection, has low dependence on gold wire bonding equipment, realizes the high-frequency signal line connection by adopting the medium transmission line, and reduces parasitic parameters in the high-frequency signal line.

Inventors

  • ZHU WENXIN
  • ZHENG QINGLI
  • WANG QIN

Assignees

  • 武汉光迅科技股份有限公司

Dates

Publication Date
20260508
Application Date
20230330

Claims (8)

  1. 1. The TO-CAN assembly is characterized by comprising a substrate (1), two signal boards (2) and a connecting block (3), wherein: A first conductive layer (11) is arranged on the substrate (1), the first conductive layer (11) extends along the front surface of the substrate (1) towards the side surface of the substrate (1) until the first conductive layer (11) extends to the back surface of the substrate (1), and the first conductive layer (11) is used for realizing connection between high-frequency signal lines; The length of the base plate (1) is larger than that of the connecting block (3), the base plate (1) is arranged on the connecting block (3), two parts of the two sides of the base plate (1) extending out of the connecting block (3) respectively correspond to different signal plates (2), and two ends of the base plate (1) are in butt joint with the signal plates (2); The signal board (2) is provided with a fourth conductive layer (21), a connecting agent is arranged at a corresponding position on the fourth conductive layer (21), the fourth conductive layer (21) is connected with the first conductive layer (11) through the connecting agent, and the connection process is eutectic welding so as to realize high-frequency signal line connection between the substrate (1) and the signal board (2).
  2. 2. The TO-CAN assembly of claim 1, wherein a fifth conductive layer (22) and a sixth conductive layer (23) are provided on the signal board (2), the fifth conductive layer (22) and the second conductive layer (12) on the substrate (1) are connected by a gold wire bond, and the sixth conductive layer (23) and the third conductive layer (13) on the substrate (1) are connected by a gold wire bond TO achieve a common line connection between the substrate (1) and the signal board (2).
  3. 3. The TO-CAN assembly of claim 1 further comprising a TO base (4), the TO base (4) having a plurality of TO pins (41) disposed thereon, wherein: The TO base (4) is provided with a connecting block (3), the signal boards (2) are arranged on the TO base (4), the signal boards (2) are connected with the corresponding TO pins (41), and the connecting block (3) is located between the two signal boards (2).
  4. 4. The TO-CAN assembly of claim 3 further comprising a bracket (5), said bracket (5) being vertically disposed on said TO base (4), said signal board (2) being disposed on a side of said bracket (5) in a conforming manner, said signal board (2) being disposed between said bracket (5) and said corresponding TO pin (41), and said fourth conductive layer (21) and said TO pin (41) being connected by a connecting agent.
  5. 5. The TO-CAN assembly of claim 3, further comprising a laser chip (6), wherein: The laser chip (6) is arranged on the substrate (1), and the laser chip (6) and the first conductive layer (11) are connected through gold wire bonding; the connecting block (3) is provided with a first surface (31), the first surface (31) and the fourth conductive layer (21) are located on the same plane, and the substrate (1) is arranged on the first surface (31).
  6. 6. The TO-CAN assembly of claim 5 further comprising a refrigerator (7), a thermistor (8), an MPD transition block (91), and an MPD chip (92), wherein: the refrigerator (7) is arranged on the TO base (4), the connecting block (3) is arranged on the refrigerator (7), the refrigerator (7) is connected with two TO pins (41) through gold wire bonding, and the refrigerator (7) is used for radiating heat for the TO-CAN assembly; the connecting block (3) is further provided with a second surface (32), the second surface (32) being inclined to the first surface (31); The thermistor (8) is arranged on the second surface (32), the thermistor (8) is connected with the refrigerator (7) through gold wire bonding, and the thermistor (8) is used for monitoring the temperature of the TO-CAN assembly; The MPD transition block (91) is arranged on the second surface (32), the MPD chip (92) is arranged on the MPD transition block (91), the MPD chip (92) is connected with the TO pin (41) through gold wire bonding, and the MPD chip (92) is used for monitoring the working state of the laser chip (6).
  7. 7. A method for packaging a TO-CAN assembly according TO any one of claims 1 TO 6, characterized in that the method comprises: arranging a connecting agent at preset positions on the signal board (2) and the connecting block (3); The substrate (1) is arranged on the connecting block (3), and the first conductive layer (11) and the fourth conductive layer (21) are connected through a connecting agent, so that high-frequency signal line connection between the substrate (1) and the signal board (2) is realized.
  8. 8. The method of packaging TO-CAN assemblies of claim 7, further comprising: A refrigerator (7) is arranged on the TO base (4), and the connecting block (3) is arranged on the refrigerator (7); Setting an MPD transition block (91) and a thermistor (8) on the connecting block (3), and attaching an MPD chip (92) to the MPD transition block (91); And performing gold wire bonding connection between a TO pin (41) and the refrigerator (7), between the MPD chip (92) and between the connecting block (3), and performing gold wire bonding connection between the signal board (2) and the substrate (1) and between the refrigerator (7) and the thermistor (8).

Description

Substrate, TO-CAN assembly and packaging method Technical Field The invention relates TO the technical field of photoelectric communication, and provides a substrate, a TO-CAN assembly and a packaging method. Background In the field of photoelectric communication at present, for a vertical coaxial laser TO-CAN (TO-CAN, laser two-stage module) assembly with a refrigerator, TO-CAN packaging is generally adopted, and the TO-CAN packaging belongs TO fully-closed packaging, and is widely applied TO optoelectronic device packaging due TO the advantages of simple manufacturing process, low production cost, flexible use and the like. At present, a TO-CAN vertical packaging scheme (single column/double column) with a refrigerator and a laser is TO connect a ceramic substrate of the laser and a TO (Transistor Outline ) base signal board by a row of parallel gold wires, the length, the line shape and the process consistency of bond alloy wires in a high-frequency signal line are difficult TO reach ideal states, the process difficulty is high, the dependence on gold wire bonding equipment is high, and the situation that individual gold wires are sprung up is possible when the gold wires are closely arranged side by side under the existing bonding process, so that parasitic inductance values on the high-frequency signal line are large, parasitic parameters in the high-frequency signal line are large, and the signal transmission quality is not very ideal. In view of this, overcoming the drawbacks of the prior art is a problem to be solved in the art. Disclosure of Invention The invention aims TO solve the technical problems of high process difficulty, high dependence on gold wire bonding equipment and high parasitic parameters in a high-frequency signal line when an alloy wire is bonded in the high-frequency signal line in the prior art. The invention adopts the following technical scheme: In a first aspect, an embodiment of the present invention provides a substrate, where a first conductive layer 11 is disposed on the substrate 1, where the first conductive layer 11 extends along a front surface of the substrate 1 toward a side surface of the substrate 1 until the first conductive layer 11 extends to a back surface of the substrate 1, and the first conductive layer 11 is used to implement connection between high-frequency signal lines. Further, a second conductive layer 12 and a third conductive layer 13 are further disposed on the substrate 1, and the second conductive layer 12 and the third conductive layer 13 are used for realizing connection between common lines. In a second aspect, an embodiment of the present invention provides a TO-CAN assembly, which includes a signal board 2, a connection block 3, and a substrate 1 according TO the first aspect, wherein: The length of the substrate 1 is greater than that of the connecting block 3, the substrate 1 is arranged on the connecting block 3, and two ends of the substrate 1 are abutted with the signal board 2; the signal board 2 is provided with a fourth conductive layer 21, and the fourth conductive layer 21 and the first conductive layer 11 are connected by a connecting agent, so as to realize high-frequency signal line connection between the substrate 1 and the signal board 2. Further, a fifth conductive layer 22 and a sixth conductive layer 23 are disposed on the signal board 2, the fifth conductive layer 22 and the second conductive layer 12 are connected by gold wire bonding, and the sixth conductive layer 23 and the third conductive layer 13 are connected by gold wire bonding, so as to realize a common line connection between the substrate 1 and the signal board 2. Further, the TO-CAN assembly further includes a TO base 4, and a plurality of TO pins 41 are disposed on the TO base 4, where: The connecting block 3 is arranged on the TO base 4, the signal board 2 is connected with the corresponding TO pins 41, and the connecting block 3 is arranged between the two signal boards 2. Further, the TO-CAN assembly further includes a support 5, the support 5 is vertically disposed on the TO base 4, the signal board 2 is attached TO the side surface of the support 5, the signal board 2 is located between the support 5 and the corresponding TO pin 41, and the fourth conductive layer 21 is connected with the TO pin 41 through a connecting agent. Further, the TO-CAN assembly further comprises a laser chip 6, wherein: the laser chip 6 is arranged on the substrate 1, and the laser chip 6 and the substrate 1 are connected through gold wire bonding; The connection block 3 is provided with a first surface 31, the first surface 31 and the fourth conductive layer 21 are located on the same plane, and the substrate 1 is disposed on the first surface 31. Further, the TO-CAN assembly further comprises a refrigerator 7, a thermistor 8, an MPD transition block 91 and an MPD chip 92, wherein: The refrigerator 7 is arranged on the TO base 4, the connecting block 3 is arranged on the refr