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CN-116321717-B - FCBGA pattern exposure process

CN116321717BCN 116321717 BCN116321717 BCN 116321717BCN-116321717-B

Abstract

The application discloses an FCBGA pattern exposure process which comprises the steps of A, drilling a through hole on a circuit board, B, utilizing a resin hole plugging machine to plug the through hole with resin to form a resin hole, wherein the resin hole contains resin materials for protecting the through hole, C, determining a cutting area on a jig with the same shape as the circuit board, cutting the cutting area which is an area corresponding to the resin hole, D, placing the jig on the surface of a thickening layer, cutting the thickening layer along the edge of the jig to enable the shape of the thickening layer to be the same as that of the jig, E, covering the thickening layer on the surface of the circuit board, forming an exposed area uncovered by the thickening layer on the surface of the circuit board, and F, taking the resin hole as a positioning hole for LDI exposure, and LDI exposure is carried out on the circuit board attached to the thickening layer.

Inventors

  • ZHANG YUCHUAN
  • ZOU QIYU
  • MAI JINCHAO
  • ZHU WAN
  • TAN YEFENG

Assignees

  • 广东则成科技有限公司

Dates

Publication Date
20260508
Application Date
20221202

Claims (10)

  1. 1. An FCBGA pattern exposure process, comprising: step A, drilling a through hole on a circuit board; Step B, resin hole plugging is carried out on the through holes by using a resin hole plugging machine to form resin holes, wherein resin materials for protecting the through holes are contained in the resin holes; c, determining a cutting area on a jig with the same shape as the circuit board, and cutting the cutting area, wherein the cutting area is an area corresponding to the jig and the resin hole; Step D, placing the jig on the surface of a thickening layer, and cutting the thickening layer along the edge of the jig so that the shape of the thickening layer is the same as that of the jig; E, covering the thickening layer on the surface of the circuit board, so that an exposed area uncovered by the thickening layer is formed on the surface of the circuit board, and the resin holes are positioned in the exposed area; And F, taking the resin hole as a positioning hole for LDI exposure, and performing LDI exposure on the circuit board bonded with the thickening layer.
  2. 2. The FCBGA pattern exposure process of claim 1, wherein the distance between the edge of the through hole and the edge of the circuit board in step a is between 2 mm and 5 mm.
  3. 3. The FCBGA pattern exposure process of claim 1, further comprising a dust removal operation during the drilling of the through holes on the circuit board in the step a, so as to keep the circuit board clean.
  4. 4. The FCBGA pattern exposure process of claim 1, wherein step B further includes polishing and removing resin on the circuit board except for the through-holes using a resin grinder.
  5. 5. The FCBGA pattern exposure process of claim 1, wherein in step C, after the jig is cut, a distance between a cutting edge of the jig and the through hole is 2mm to 5 mm.
  6. 6. The FCBGA graphic exposure process of claim 1, further comprising, after step E, laminating the circuit board and the thickening layer to closely adhere the circuit board and the thickening layer.
  7. 7. The FCBGA pattern exposure process of claim 1, wherein the aperture of the through-hole is between 0.01 mm and 1 mm.
  8. 8. The FCBGA pattern exposure process of claim 1, wherein the jig is an FR4 part.
  9. 9. The FCBGA pattern exposure process of claim 1, wherein the thickening layer is a resin-coated copper foil.
  10. 10. The FCBGA graphic exposure process of claim 9, wherein step C further comprises making a mark on the jig for distinguishing front and back sides, such that the thickening layer can distinguish front and back sides after dicing.

Description

FCBGA pattern exposure process Technical Field The invention relates to the field of FCBGA (Flip Chip Ball grid array) pattern exposure, in particular to an FCBGA pattern exposure process. Background In the prior LDI (LASER DIRECT IMAGING, laser direct imaging technology) exposure, a laser targeting mode or a mode of drilling a through hole on a circuit board is mainly adopted to position the circuit board, in the mode of drilling the through hole, a through hole with a large diameter is mainly used as a positioning hole, for example, the through hole with the diameter of 2 millimeters is used as a positioning hole for line LDI exposure, but the through hole deformation is caused by the problems of hole breaking, burrs and the like easily occurring when the large-diameter through hole is used for processing, the alignment accuracy is influenced to cause exposure offset, and the production yield is reduced. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the FCBGA pattern exposure process provided by the invention can improve the LDI alignment precision and the production efficiency. An FCBGA pattern exposure process according to an embodiment of the first aspect of the present invention includes: step A, drilling a through hole on a circuit board; Step B, resin hole plugging is carried out on the through holes by using a resin hole plugging machine to form resin holes, wherein resin materials for protecting the through holes are contained in the resin holes; c, determining a cutting area on a jig with the same shape as the circuit board, and cutting the cutting area, wherein the cutting area is an area corresponding to the jig and the resin hole; Step D, placing the jig on the surface of a thickening layer, and cutting the thickening layer along the edge of the jig so that the shape of the thickening layer is the same as that of the jig; E, covering the thickening layer on the surface of the circuit board, wherein a bare area which is not covered by the thickening layer is formed on the surface of the circuit board, and the resin hole is positioned in the bare area; And F, taking the resin hole as a positioning hole for LDI exposure, and performing LDI exposure on the circuit board bonded with the thickening layer. The FCBGA pattern exposure process has the advantages that resin holes are formed by plugging the through holes on the circuit board with resin, the through holes are protected by the resin, the through holes are prevented from deforming in subsequent processing, the thickening layer is cut by the manufacturing jig, and the through holes plugged with the resin are uncovered after the thickening layer is attached to the circuit board, namely, the resin holes are directly exposed on the surface of the circuit board, so that in LDI exposure, the through holes exposed on the circuit board can be directly used as positioning holes, the LDI alignment precision is improved, the production efficiency is improved, and meanwhile, the yield of products is improved. According to some embodiments of the invention, the distance between the edge of the through hole and the edge of the circuit board in the step a is between 2 and 5 mm. According to some embodiments of the invention, in the step a, dust removal is further included in the process of drilling the through hole on the circuit board, so as to keep the circuit board clean. According to some embodiments of the invention, step B further comprises grinding resin on the circuit board except for the through holes using a resin grinder. According to some embodiments of the invention, in the step C, after the jig is cut, a distance between a cutting edge of the jig and the through hole is 2mm to 5 mm. According to some embodiments of the invention, after the step E, the method further includes laminating the circuit board and the thickening layer, so that the circuit board is closely attached to the thickening layer. According to some embodiments of the invention, the aperture of the through hole is between 0.01 mm and 1 mm. According to some embodiments of the invention, the jig is an FR4 part. According to some embodiments of the invention, the thickening layer is a resin-coated copper foil. According to some embodiments of the invention, the step C further comprises making a mark for distinguishing the front and the back on the jig, so that the thickening layer can distinguish the front and the back after cutting. Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Drawings The invention is further described with reference to the accompanying drawings and examples, in which: FIG. 1 is a flow chart of one embodiment of the FCBGA pattern exposure process of the present invention. Detailed Description Embodiments of t