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CN-116322224-B - Micro OLED display packaging structure and preparation method thereof

CN116322224BCN 116322224 BCN116322224 BCN 116322224BCN-116322224-B

Abstract

The invention belongs to a Micro OLED display packaging structure in the technical field of Micro OLED displays, and also relates to a preparation method of the Micro OLED display packaging structure. The CMOS driving circuit is arranged on the silicon wafer substrate to form a CMOS substrate, a plurality of groups of Anode 2 are arranged on the CMOS substrate, pixel definition layers (definition layers and PDL) are arranged between adjacent Anode, the definition layers (PDL) and Anode are packaged on the CMOS substrate by the OLED layers, the TFE layers (packaging layers) are arranged on the outer layers of the OLED layers, micropores are arranged on the surfaces of the TFE layers, the micropore depth is 400-500nm, high-viscosity material layers are arranged in the micropores, and the viscosity of the high-viscosity material layers is 2.8-3.2. According to the Micro OLED display packaging structure and the preparation method thereof, the adhesiveness between TFE and OC is improved on the premise of ensuring the existing advantages without influencing the light emission of the OLED, the problem of product failure caused by separation of TFE and OC is reduced, and the product competitiveness is improved.

Inventors

  • HE JING
  • CAO JUN

Assignees

  • 安徽熙泰智能科技有限公司

Dates

Publication Date
20260508
Application Date
20230321

Claims (10)

  1. 1. A preparation method of a Micro OLED display packaging structure is characterized by comprising the following preparation steps of: S1, preparing a CMOS driving circuit on a silicon wafer substrate to form a CMOS substrate (1); s2, preparing Anode (2) on a CMOS substrate; S3, preparing a pixel PDL (3) on the Anode (2) through a yellow light process; S4, preparing an OLED layer (4) outside the definition layer (3) through an evaporation process, wherein the OLED layer (4) comprises a hole injection/transmission layer, an organic light-emitting layer, an electron injection/transmission layer and a cathode; s5, preparing a TFE layer (5) on the OLED layer (4); S6, engraving a plurality of micropores (6) on the TFE layer (5), wherein the TFE layer (5) comprises a plurality of groups of micropores, the groups of micropores are arranged in parallel, the groups of micropores extend from the position close to the upper part of the TFE layer (5) to the position close to the lower part of the TFE layer (5), each group of micropores comprises a plurality of micropores (6) arranged according to gaps, and the micropores (6) of each group of micropores extend from the position close to the left side of the TFE layer (5) to the position close to the right side of the TFE layer (5); s7, injecting a high-viscosity material layer (7) into the micropores (6) of the TFE layer (5); s8, completing the following yellow light and module manufacturing processes of the first OC layer (8), the CF layer (9), the second OC layer (10) and the cover plate (11).
  2. 2. The method for manufacturing a Micro OLED display packaging structure according to claim 1, wherein when a plurality of micropores (6) are engraved in the TFE layer (5), the depth of the TFE layer (5) is 400-500nm, and when the high-viscosity material layer (7) is injected into the micropores (6) of the TFE layer (5), the viscosity of the high-viscosity material layer (7) is 2.8-3.2.
  3. 3. The method for manufacturing a Micro OLED display packaging structure according to claim 1 or 2, wherein the film layer of the TFE layer (5) is one or a combination of more of Al2O3, tiO2, ATO, siN, siON, siO, acrylic organic matters and epoxy resin organic matters.
  4. 4. The method for manufacturing a Micro OLED display package according to claim 1 or 2, wherein the method for manufacturing the TFE layer (5) comprises, but is not limited to, ALD, PECVD, IJP, and the method comprises, but is not limited to, laser etching, dry etching, and the like, when the Micro-holes (6) are etched in the TFE layer (5).
  5. 5. The method for manufacturing a Micro OLED display package according to claim 1 or 2, wherein when the high viscosity material layer (7) is disposed in the Micro-holes (6) of the TFE layer (5), the method for disposing the high viscosity material layer (7) includes, but is not limited to, spin coating method and ink jet printing method.
  6. 6. The method for manufacturing the Micro OLED display packaging structure according to claim 1 or 2, wherein the first OC layer (8), the CF layer (9), the second OC layer (10) and the cover plate (11) are sequentially manufactured and adhered when the subsequent yellow light and module manufacturing process is completed, and then the Micro OLED display packaging structure is cut.
  7. 7. A Micro OLED display packaging structure is characterized in that a CMOS driving circuit is arranged on a silicon wafer substrate to form a CMOS substrate (1), a plurality of groups of Anode (2) are arranged on the CMOS substrate (1), pixel definition layers (3) are arranged between adjacent Anode (2), an OLED layer (4) packages the definition layers (3) and the Anode (2) on the CMOS substrate (1), a TFE layer (5) is arranged on the outer layer of the OLED layer (4), micropores (6) are formed in the surface of the TFE layer (5), and a high-viscosity material layer (7) is arranged in the micropores (6).
  8. 8. The Micro OLED display packaging structure according to claim 7, wherein the depth of the micropores (6) on the surface of the TFE layer (5) is 400-500nm, and the viscosity of the high-viscosity material layer (7) in the micropores (6) is 2.8-3.2.
  9. 9. The Micro OLED display packaging structure according to claim 7, wherein the surface of the TFE layer (5) is sequentially provided with a first OC layer (8), a CF layer (9), a second OC layer (10) and a cover plate layer (11).
  10. 10. The Micro OLED display packaging structure according to claim 7 or 8, wherein the TFE layer (5) comprises a plurality of groups of micropores arranged in parallel, each group of micropores comprises a plurality of micropores (6) arranged in a gap, and each group of micropores (6) extends from a position near the left side of the TFE layer (5) to a position near the right side of the TFE layer (5).

Description

Micro OLED display packaging structure and preparation method thereof Technical Field The invention belongs to the technical field of Micro OLED displays, and particularly relates to a Micro OLED display packaging structure and a preparation method of the Micro OLED display packaging structure. Background In the manufacture of a product color screen body of a micro OLED display, a color film process needs to use multiple coating, exposure and development functions, and a plating layer is generally arranged on the surface of a thin film package (TFE) for protection. However, such display structures are placed in severe environments (environments with excessive temperature and humidity), and are prone to separation of OC and TFE, causing product color spots, and affecting product performance and service life. Disclosure of Invention Aiming at the defects of the prior art, the invention provides the preparation method of the Micro OLED display packaging structure, which has the advantages of simple steps, improving the adhesiveness between TFE and OC (OC refers to over coat) on the premise of ensuring the existing advantages without influencing the light emission of the OLED, reducing the problem of product failure caused by separation of TFE and OC, and improving the competitiveness of the product. The technical scheme adopted by the invention is as follows: The invention relates to a preparation method of a Micro OLED display packaging structure, which comprises the following preparation steps: S1, preparing a CMOS driving circuit on a silicon wafer substrate to form a CMOS substrate; s2, preparing an Anode on a CMOS substrate; S3, preparing a Pixel Definition Layer (PDL) on an Anode through a yellow light process; s4, preparing an OLED layer outside a definition layer (PDL) through an evaporation process, wherein the OLED layer comprises a hole injection/transport layer, an organic light-emitting layer, an electron injection/transport layer and a cathode; S5, preparing a TFE layer (packaging layer) on the OLED layer; S6, etching a plurality of micropores in a TFE layer (packaging layer), wherein the depth of the TFE layer (packaging layer) is 400-500nm; s7, preparing a high-viscosity material layer in micropores of the TFE layer (packaging layer), wherein the viscosity of the high-viscosity material layer 7 is between 2.8 and 3.2; S8, completing the following yellow light and module processes, namely a first OC layer, a CF layer (CF refers to color filter), a second OC layer and a cover plate (CG) 11. In preparing the TFE layer (encapsulation layer), the TFE layer can be prepared by methods including, but not limited to ALD, PECVD, IJP and the like. The film material of the TFE layer 5 is one or a combination of more of Al2O3, tiO2, ATO, siN, siON, siO, acrylic organic matters and epoxy resin organic matters; Methods include, but are not limited to, laser etching and dry etching when the TFE layer is etched with micro holes. When the high-viscosity material layer is disposed in the micropores of the TFE layer, methods of disposing the high-viscosity material layer include, but are not limited to, spin coating methods and inkjet printing methods. And when the subsequent yellow light and module manufacturing process is completed, sequentially preparing and pasting a first OC layer, a CF layer, a second OC layer and a cover plate (CG), and then cutting the packaging structure of the Micro OLED display. The invention also relates to a Micro OLED display packaging structure which has a simple structure, improves the adhesiveness between TFE and OC on the premise of not influencing the light emission of OLED, reduces the problem of product failure caused by separation of TFE and OC, and improves the competitiveness of the product. The CMOS driving circuit is arranged on a silicon wafer substrate of the Micro OLED display packaging structure to form a CMOS substrate, a plurality of groups of Anode 2 are arranged on the CMOS substrate, pixel definition layers (definition layers and PDL) are arranged between adjacent Anode, the OLED layers package the definition layers (PDL) and the Anode on the CMOS substrate, a TFE layer (packaging layer) is arranged on the outer layer of the OLED layers, micropores are formed in the surface of the TFE layer, the micropore depth is 400-500nm, a high-viscosity material layer is arranged in the micropores, and the viscosity of the high-viscosity material layer is 2.8-3.2. The surface of the TFE layer (packaging layer) is sequentially provided with a first OC layer, a CF layer, a second OC layer and a cover plate layer (CG). The TFE layer (packaging layer) comprises a plurality of groups of micropores, the groups of micropores are arranged in parallel, the groups of micropores extend from the position close to the upper part of the TFE layer (packaging layer) to the position close to the lower part of the TFE layer (packaging layer), and each group of micropores comprises a plurality