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CN-116341486-B - Via inspection method, device, tool, electronic device, and readable storage medium

CN116341486BCN 116341486 BCN116341486 BCN 116341486BCN-116341486-B

Abstract

The invention provides a via inspection method, a via inspection device, a via inspection tool, an electronic device and a readable storage medium. The via inspection method comprises the steps of obtaining a design file corresponding to a printed circuit board, determining the corresponding relation between an aperture value interval and an aperture tolerance of a via in the printed circuit board and via design parameters of the via based on the design file, creating a via tolerance database according to the corresponding relation between the aperture value interval and the aperture tolerance, creating a to-be-inspected area database corresponding to a target inspection area according to the via design parameters, determining an inspection rule value corresponding to the target inspection area based on the target inspection area, and determining a via inspection result according to the via tolerance database and/or the to-be-inspected area database and the inspection rule value. The inspection efficiency and the accuracy of the inspection result in the inspection process of the through holes are improved, the signal distortion problem and the short circuit board burning problem caused by the use errors of the through holes are avoided, and the design quality of printed circuit board products is further improved.

Inventors

  • MENG YAO

Assignees

  • 苏州浪潮智能科技有限公司

Dates

Publication Date
20260505
Application Date
20230329

Claims (12)

  1. 1. A method of via inspection, comprising: Obtaining a design file corresponding to a printed circuit board, and determining the corresponding relation between an aperture value interval and an aperture tolerance of a via hole in the printed circuit board and a via hole design parameter of the via hole based on the design file, wherein the printed circuit board is designed to be a printed circuit board to be subjected to via hole inspection, and the via hole design parameter at least comprises a coordinate of the via hole, a drilling radius of the via hole, a copper ring radius of the via hole, an isolation region radius of the via hole and a target inspection region corresponding to the via hole; Creating a via tolerance database according to the corresponding relation between the aperture value interval and the aperture tolerance; Creating a to-be-inspected area database corresponding to a target inspection area according to the via design parameters, wherein the target inspection area comprises a power supply area and a high-density area; Determining an inspection rule value corresponding to the target inspection area based on the target inspection area, wherein when the target inspection area is a power supply area, a range of the radius of the isolation area, which is larger than the sum of the drilling radius and the aperture tolerance, is used as the inspection rule value corresponding to the power supply area, and when the target inspection area is a high-density area, a range of the radius of the isolation area, which is smaller than the radius of the copper ring, is used as the inspection rule value corresponding to the high-density area; Executing inspection calculation logic corresponding to the via hole according to the via hole tolerance database and/or the to-be-inspected area database and the inspection rule value to determine a via hole inspection result, wherein when the target inspection area is a power supply area, the inspection calculation logic is an inspection rule value corresponding to the power supply area, wherein when the target inspection area is a high-density area, the difference value between the radius of the isolation area and the radius of the copper ring is smaller than or equal to the inspection rule value corresponding to the high-density area; The creating a database of the to-be-inspected area corresponding to the target inspection area according to the via design parameters includes: Extracting a target via design parameter corresponding to a target inspection area from the via design parameters according to the via design parameters, wherein the target via design parameter comprises part or all of the via design parameters; And creating a region database to be inspected corresponding to the target inspection region according to the target via design parameters.
  2. 2. The method of claim 1, wherein creating a via tolerance database from the correspondence between the aperture value intervals and aperture tolerances comprises: Determining a positive aperture tolerance of the aperture tolerance according to the aperture tolerance; According to the corresponding relation between the aperture value interval and the aperture tolerance, determining the aperture value interval corresponding to the aperture positive tolerance under the condition that the aperture positive tolerance is the same; combining the aperture value intervals; And creating a via tolerance database according to the corresponding relation between the combined aperture value interval and the positive aperture tolerance.
  3. 3. The method of claim 1, wherein the target inspection area comprises a power supply area and a high density area; The extracting, according to the via design parameters, a target via design parameter corresponding to a target inspection area from the via design parameters includes: When the target inspection area is a power supply area, extracting a first coordinate, a drilling radius and a first isolation area radius of a first via corresponding to the power supply area from the via design parameter according to the via design parameter, and determining the first coordinate, the drilling radius and the first isolation area radius as a first target via design parameter; extracting a second coordinate of a second via hole corresponding to the high-density region, a copper ring radius and a second isolation region radius from the via hole design parameter according to the via hole design parameter when the target inspection region is the high-density region, and determining the second coordinate, the copper ring radius and the second isolation region radius as second target via hole design parameters; the creating a to-be-inspected area database corresponding to the target inspection area according to the target via design parameters includes: creating a first to-be-detected area database corresponding to the power supply area according to the first target via design parameters; And creating a second to-be-inspected area database corresponding to the high-density area according to the second target via design parameters.
  4. 4. The method of claim 1, wherein the region to be inspected database comprises a first region to be inspected database and a second region to be inspected database, and wherein the inspection rule value comprises a power region inspection rule value corresponding to the power region and a high-density region inspection rule value corresponding to the high-density region; The determining a via inspection result according to the via tolerance database and/or the to-be-inspected area database and the inspection rule value comprises the following steps: Determining a via inspection result according to the via tolerance database, the first to-be-inspected area database and the power supply area inspection rule value under the condition that the target inspection area is a power supply area; And under the condition that the target inspection area is a high-density area, determining a via inspection result according to the second area database to be inspected and the high-density area inspection rule value.
  5. 5. The method of claim 4, wherein said determining via inspection results from said via tolerance database and said first region to be inspected database, and said power region inspection rule values comprises: inquiring the aperture value interval corresponding to the drilling radius in the via tolerance database according to the drilling radius in the first to-be-detected area database under the condition that the target detection area is the power supply area; Determining the aperture tolerance corresponding to the aperture value interval according to the aperture value interval; Determining a sum of the aperture tolerance and the borehole radius according to the aperture tolerance and the borehole radius; determining a first difference value between the radius of the first isolation region and the summation value according to the radius of the first isolation region of the first via hole in the first region database to be detected and the summation value; Determining that the via inspection result is passing inspection under the condition that the first difference value is larger than or equal to the power supply area inspection rule value; And under the condition that the first difference value is smaller than the power supply area inspection rule value, determining that the inspection result of the via holes is that the inspection is not passed.
  6. 6. The method of claim 4, wherein determining via inspection results based on the second database of areas to be inspected and the high density area inspection rule values comprises: Determining a second difference value between the second isolation region radius and the copper ring radius according to the second isolation region radius and the copper ring radius in the second region to be detected database under the condition that the target detection region is the high-density region; determining that the via inspection result is passing inspection under the condition that the second difference value is smaller than or equal to the high-density area inspection rule value; and determining that the inspection result of the via hole is that the inspection is not passed under the condition that the second difference value is larger than the inspection rule value of the high density region.
  7. 7. Method according to claim 1, characterized in that after determining a via inspection result from the via tolerance database and/or the region to be inspected database and the inspection rule value, it further comprises: Acquiring coordinates corresponding to the via hole in the to-be-detected area database under the condition that the via hole detection result is that the detection is not passed; outputting the coordinates to enable a user to modify the design parameters of the via corresponding to the coordinates.
  8. 8. A via inspection apparatus, comprising: The device comprises a design file acquisition module, a design file acquisition module and a display module, wherein the design file acquisition module is used for acquiring a design file corresponding to a printed circuit board, and determining the corresponding relation between an aperture value interval and an aperture tolerance of a via hole in the printed circuit board and a via hole design parameter of the via hole based on the design file; the via tolerance database creation module is used for creating a via tolerance database according to the corresponding relation between the aperture value interval and the aperture tolerance; The to-be-inspected area database creation module is used for creating a to-be-inspected area database corresponding to a target inspection area according to the via design parameters, wherein the target inspection area comprises a power supply area and a high-density area; The device comprises an inspection rule value determining module, a detection rule value determining module and a detection rule value determining module, wherein the inspection rule value determining module is used for determining an inspection rule value corresponding to a target inspection area based on the target inspection area, wherein when the target inspection area is a power supply area, a range of which the radius of the isolation area is larger than the sum of the drilling radius and the aperture tolerance is taken as the inspection rule value corresponding to the power supply area, and when the target inspection area is a high-density area, a range of which the difference value between the radius of the isolation area and the radius of the copper ring is smaller than the range of which the radius of the isolation area is smaller than the radius of the copper ring is taken as the inspection rule value corresponding to the high-density area; the inspection result determining module is used for determining an inspection result of the via hole according to the inspection calculation logic corresponding to the via hole, wherein when the target inspection area is a power supply area, the inspection calculation logic is an inspection rule value corresponding to the power supply area, the sum of the radius of the isolation area, the radius of the drilling hole and the aperture tolerance is greater than or equal to the sum of the radius of the isolation area and the aperture tolerance, and when the target inspection area is a high-density area, the inspection calculation logic is an inspection rule value corresponding to the high-density area, and the difference value between the radius of the isolation area and the radius of the copper ring is smaller than or equal to the sum of the radius of the isolation area and the radius of the copper ring; the to-be-inspected area database creation module comprises: the device comprises a target via design parameter extraction submodule, a target via design parameter detection submodule and a target test submodule, wherein the target via design parameter extraction submodule is used for extracting target via design parameters corresponding to a target inspection area from the via design parameters according to the via design parameters; And the to-be-inspected area database creation sub-module is used for creating the to-be-inspected area database corresponding to the target inspection area according to the target via design parameters.
  9. 9. The via inspection tool is characterized by comprising a functional interface, wherein the functional interface comprises a via tolerance database creation component, a region to be inspected database creation component, an inspection rule value determination component and a via inspection component; The via tolerance database creation component is used for creating a via tolerance database according to the corresponding relation between an aperture value interval and an aperture tolerance, wherein the corresponding relation between the aperture value interval and the aperture tolerance is the corresponding relation between the aperture value interval and the aperture tolerance of a via in a printed circuit board determined according to a design file of the printed circuit board; The to-be-inspected area database creation component is used for creating a to-be-inspected area database corresponding to a target inspection area according to via hole design parameters, wherein the via hole design parameters are design parameters of vias in a printed circuit board, which are determined according to a design file of the printed circuit board, the via hole design parameters at least comprise coordinates of the via holes, drilling radiuses of the via holes, copper ring radiuses of the via holes, isolation area radiuses of the via holes and target inspection areas corresponding to the via holes, the to-be-inspected area database corresponding to the target inspection area is created according to the via hole design parameters, and the to-be-inspected area database corresponding to the target inspection area comprises a power supply area and a high-density area, and the to-be-inspected area database corresponding to the target inspection area is created according to the target via hole design parameters, wherein the target via hole design parameters comprise part or all of the via hole design parameters; The inspection rule value determining component is used for determining an inspection rule value corresponding to the target inspection area based on the target inspection area, wherein when the target inspection area is a power supply area, a range of which the radius of the isolation area is larger than the sum of the drilling radius and the aperture tolerance is taken as the inspection rule value corresponding to the power supply area, and when the target inspection area is a high-density area, a range of which the radius of the isolation area is smaller than the radius of the copper ring is taken as the inspection rule value corresponding to the high-density area; The via inspection component is used for executing the via tolerance database created by the via tolerance database creation component and/or the region database to be inspected created by the region database to be inspected creation component and the inspection rule value determined by the inspection rule value determination component according to inspection calculation logic corresponding to the via, and determining a via inspection result, wherein when the target inspection region is a power supply region, the inspection calculation logic is an inspection rule value corresponding to the power supply region, wherein when the target inspection region is a high-density region, the difference value between the radius of the isolation region and the radius of the copper ring is smaller than or equal to the inspection rule value corresponding to the high-density region.
  10. 10. The via inspection tool of claim 9, wherein the functional interface further comprises a results viewing component; the result checking component is used for displaying the via checking result determined by the via checking component.
  11. 11. An electronic device comprising a memory for storing a computer program and a processor for implementing the via inspection method according to any of claims 1-7 when the computer program is executed.
  12. 12. A readable storage medium, characterized in that the readable storage medium stores a computer program, which when executed by a processor implements the via inspection method according to any of claims 1-7.

Description

Via inspection method, device, tool, electronic device, and readable storage medium Technical Field The present invention relates to the field of computer technologies, and in particular, to a method, an apparatus, a tool, an electronic device, and a readable storage medium for inspecting a via. Background The number of devices and routing density provided on printed circuit boards (Printed Circuit Board, PCBs) as an important component of the server are increasing with increased server performance. In double-sided and multi-layer boards of printed circuit boards, it is unavoidable that vias are provided at the intersections of the conductors of the layers that need to be connected in order to connect the conductors between the layers. When the printed circuit board is drilled, the tolerance of the via hole prepared on the printed circuit board is too large due to the limitation of the processing capability, the quality problem of short circuit board burning easily occurs in a power supply area under the condition of the too large tolerance of the via hole, and meanwhile, the quality problem of signal distortion is easily caused because a signal does not refer to a reflow path in a high-density area (BGA, ball GRID ARRAY) when the hole wall of the via hole is far away from the hole walls of other via holes. Based on the quality problems described above, printed circuit boards often use vias with different parameters in different application scenarios. At present, through holes are mainly inspected according to different use scenes in a manual visual inspection mode so as to prevent short circuit and signal distortion. However, as the device and the routing density on the printed circuit board are continuously increased, the number of the via holes on the printed circuit board is also continuously increased, and the manual visual inspection is low in efficiency and is extremely prone to the problems of missing inspection and false inspection, so that the inspection efficiency and the inspection accuracy cannot be guaranteed. Disclosure of Invention The embodiment of the invention provides a method, a device, a tool, electronic equipment and a readable storage medium for checking via holes, which are used for solving the problems of low via hole checking efficiency and low accuracy in the related technology. In order to solve the above technical problems, an embodiment of the present invention provides a method for inspecting a via, including: acquiring a design file corresponding to a printed circuit board, and determining a corresponding relation between an aperture value interval and an aperture tolerance of a via hole in the printed circuit board and a via hole design parameter of the via hole based on the design file; Creating a via tolerance database according to the corresponding relation between the aperture value interval and the aperture tolerance; Creating a region database to be inspected corresponding to the target inspection region according to the via design parameters; Determining an inspection rule value corresponding to the target inspection region based on the target inspection region; and determining a via inspection result according to the via tolerance database and/or the region to be inspected database and the inspection rule value. Optionally, the creating a via tolerance database according to the correspondence between the aperture value interval and the aperture tolerance includes: Determining a positive aperture tolerance of the aperture tolerance according to the aperture tolerance; According to the corresponding relation between the aperture value interval and the aperture tolerance, determining the aperture value interval corresponding to the aperture positive tolerance under the condition that the aperture positive tolerance is the same; combining the aperture value intervals; And creating a via tolerance database according to the corresponding relation between the combined aperture value interval and the positive aperture tolerance. Optionally, the creating a to-be-inspected area database corresponding to the target inspection area according to the via design parameters includes: Extracting a target via design parameter corresponding to a target inspection area from the via design parameters according to the via design parameters, wherein the target via design parameter comprises part or all of the via design parameters; And creating a region database to be inspected corresponding to the target inspection region according to the target via design parameters. Optionally, the target inspection area includes a power supply area and a high density area; The extracting, according to the via design parameters, a target via design parameter corresponding to a target inspection area from the via design parameters includes: When the target inspection area is a power supply area, extracting a first coordinate, a drilling radius and a first isolation area radius of a first via correspondi