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CN-116344435-B - Device for jacking wafer from wafer processing chamber

CN116344435BCN 116344435 BCN116344435 BCN 116344435BCN-116344435-B

Abstract

In order to solve the technical problem that a wafer is easy to be sprung away or damaged when the wafer is jacked up due to static electricity residue in the prior art, the embodiment of the invention provides a device for jacking the wafer from a wafer processing chamber, which comprises a control device, a power device and at least one jacking device, wherein each jacking device comprises a lifting rod, a permanent magnet, an electromagnet, a distance sensor and a power device, one end of the permanent magnet is used for being connected with the other end of the lifting rod, one end of the electromagnet is used for being magnetically connected with the other end of the permanent magnet, the distance sensor is arranged at one end of the electromagnet and used for sensing the distance between the other end of the permanent magnet and one end of the electromagnet, the power device is used for being connected with the other end of the electromagnet so as to drive one end of the electromagnet to move close to the other end of the permanent magnet or away from the other end of the permanent magnet, and the control device is used for being connected with a distance sensor, the power device and the electromagnet.

Inventors

  • ZHENG YUXIAN

Assignees

  • 成都高真科技有限公司

Dates

Publication Date
20260512
Application Date
20230214

Claims (8)

  1. 1. An apparatus for lifting a wafer from within a wafer processing chamber, comprising a control device, a power device, and at least one lifting device, each lifting device comprising: A lift bar having one end for contacting a wafer on the electrostatic chuck to lift the wafer from the electrostatic chuck; one end of the permanent magnet is connected with the other end of the lifting rod; an electromagnet having one end magnetically connected to the other end of the permanent magnet, and The distance sensor is arranged at one end of the electromagnet and used for sensing the distance between the other end of the permanent magnet and one end of the electromagnet; The power device is used for being connected with the other end of the electromagnet to drive one end of the electromagnet to move close to the other end of the permanent magnet or away from the other end of the permanent magnet; The control device is used for being connected with the distance sensor, the power device and the electromagnet; The control device is also used for generating a distance feedback value according to the distance feedback signal of the distance sensor; Judging whether the distance feedback value is smaller than or equal to the safety distance value, if so, controlling the power device to stop jacking action, or driving one end of the electromagnet to move towards the other end far away from the permanent magnet through the power device; the safe distance value is a distance value between the other end of the permanent magnet and one end of the electromagnet when the wafer is static-free and the wafer is jacked.
  2. 2. The apparatus of claim 1, further comprising an alarm device coupled to the control device, wherein the control device is further configured to control the alarm device to alarm when the distance feedback value is less than the safe distance value.
  3. 3. The apparatus of claim 1, wherein the control means is further adapted to control the direction and magnitude of the current flowing into the electromagnet to control the magnitude and polarity of the magnetic force of the electromagnet.
  4. 4. The apparatus of claim 1, wherein each of the plurality of lifting devices further comprises a mounting chamber, wherein one end of the mounting chamber is provided with a through hole through which the lifting rod passes, the other end of the lifting rod is connected to one end of the permanent magnet after passing through the through hole, the permanent magnet is slidably connected to an inner side wall of the mounting chamber, the other end of the mounting chamber is opened, the electromagnet is disposed at the other end of the mounting chamber and slidably connected to an inner side wall of the mounting chamber, the electromagnet has a mounting hole therethrough, and the distance sensor is disposed in the mounting hole of the electromagnet.
  5. 5. The apparatus of claim 4, wherein the sensing end of the distance sensor protrudes from the mounting hole near the permanent magnet.
  6. 6. The apparatus of claim 1, further comprising a mounting member, wherein the number of the jacking devices is at least 2, wherein all jacking devices are mounted on one side of the mounting member, and wherein the other side of the mounting member is coupled to the output of the power unit via a drive shaft.
  7. 7. The apparatus of claim 1, wherein the power device is a motor.
  8. 8. An apparatus for lifting a wafer from within a wafer processing chamber as recited in claim 6, wherein all of the lifting means are uniformly distributed at the edge locations of the mounting member.

Description

Device for jacking wafer from wafer processing chamber Technical Field The present invention relates to an apparatus for lifting a wafer from within a wafer processing chamber. Background The first step in transferring the wafer inside the wafer processing chamber to the outside of the wafer processing chamber requires the wafer held on the electrostatic chuck ESC (Electrostatic Chuck) to be rounded. At this time, the wafer must be subjected to static electricity removal, and the wafer is uniformly stressed. However, static electricity may not be removed or remain for various reasons. When the wafer is lifted up with a large force in a state of static electricity remaining, the wafer is sprung away or damaged due to the overlarge local stress, so that a device for preventing the wafer from being sprung away or damaged due to the overlarge local stress is needed when the static electricity remains. Disclosure of Invention In order to solve the technical problem that a wafer is easy to be bounced away or damaged when the wafer is jacked up due to static electricity residue in the prior art, the embodiment of the invention provides a device for jacking the wafer from a wafer processing chamber. The embodiment of the invention is realized by the following technical scheme: in a first aspect, an embodiment of the present invention provides an apparatus for lifting a wafer from a wafer processing chamber, including a control device, a power device, and at least one lifting device, where each lifting device includes: A lift bar having one end for contacting a wafer on the electrostatic chuck to lift the wafer from the electrostatic chuck; one end of the permanent magnet is connected with the other end of the lifting rod; an electromagnet having one end magnetically connected to the other end of the permanent magnet, and The distance sensor is arranged at one end of the electromagnet and used for sensing the distance between the other end of the permanent magnet and one end of the electromagnet; the power device is used for being connected with the other end of the electromagnet to drive one end of the electromagnet to move close to the other end of the permanent magnet or away from the other end of the permanent magnet; and the control device is used for being connected with the distance sensor, the power device and the electromagnet. Further, the control device is also used for generating a distance feedback value according to the distance feedback signal of the distance sensor; And judging whether the distance feedback value is smaller than or equal to the safety distance value, if so, controlling the power device to stop jacking action, or driving one end of the electromagnet to move towards the other end far away from the permanent magnet through the power device. Further, the safe distance value is a distance value between the other end of the permanent magnet and one end of the electromagnet when the wafer is static-free and the wafer is jacked up. The system further comprises an alarm device, wherein the alarm device is connected with the control device, and the control device is further used for controlling the alarm device to alarm when the distance feedback value is smaller than the safety distance value. Further, the control device is also used for controlling the direction and the magnitude of the current flowing into the electromagnet to control the magnitude and the polarity of the magnetic force of the electromagnet. Further, each jacking device further comprises a mounting cavity, a through hole is formed in one end of the mounting cavity, the lifting rod penetrates through the through hole and then is connected with one end of the permanent magnet, the permanent magnet is slidably connected with the inner side wall of the mounting cavity, the other end of the mounting cavity is opened, the electromagnet is arranged at the other end of the mounting cavity and is slidably connected with the inner side wall of the mounting cavity, the electromagnet is provided with a penetrating mounting hole, and the distance sensor is arranged in the mounting hole of the electromagnet. Further, the sensing end of the distance sensor protrudes out of one end of the mounting hole, which is close to the permanent magnet. The lifting device comprises a power device, a lifting device, a driving shaft, a lifting device, a mounting piece, at least 2 jacking devices and all jacking devices, wherein the jacking devices are mounted on one side of the mounting piece, and the other side of the mounting piece is connected with the output end of the power device through the driving shaft. Further, the power device is a motor. Further, all jacking devices are uniformly distributed at the edge positions of the mounting piece. Compared with the prior art, the embodiment of the invention has the following advantages and beneficial effects: According to the device for jacking up the wafer from the wafer processing chamber, provided b