CN-116347943-B - Display device and method of manufacturing the same

Abstract

Provided are a display device and a method of manufacturing the same, in which holes are provided in a region overlapping with or adjacent to an outer peripheral line of a flexible film in an inorganic insulating layer, which makes it possible to suppress propagation of cracks caused by an air gap in a pad region and to improve reliability of the display device.

Inventors

• Quan Huirong

Assignees

• 乐金显示有限公司

Dates

Publication Date

20260508

Application Date

20221031

Priority Date

20211215

Claims (20)

1. 1. A display device, comprising: A substrate having a display region and a non-display region disposed adjacent to the display region, the display region including a plurality of sub-pixels; a pad region in the non-display region; A link region disposed between the display region and the pad region; A first inorganic insulating layer disposed on the substrate in the link region; A plurality of pad electrodes disposed in the pad region; A plurality of link lines disposed in the link region and covering the first inorganic insulating layer, the plurality of link lines configured to electrically connect the plurality of pad electrodes and the plurality of sub-pixels, respectively; An organic insulating layer disposed on the plurality of link lines and on the first inorganic insulating layer; A hole provided in the first inorganic insulating layer, the hole being positioned to overlap with a portion at least one of the plurality of link lines provided on the substrate, and A flexible film disposed on and electrically connected to the plurality of pad electrodes, Wherein the organic insulating layer is positioned in and fills the hole, and Wherein the aperture overlaps an edge of a peripheral line of the flexible membrane.
2. 2. The display device of claim 1, wherein the link line is positioned in the hole and assists in filling the hole.
3. 3. The display device according to claim 2, wherein the hole overlaps a peripheral line adjacent to the link region among peripheral lines of the flexible film.
4. 4. The display device according to claim 2, wherein the hole is provided between the display region and a peripheral line adjacent to the link region among peripheral lines of the flexible film.
5. 5. The display device according to claim 1, wherein a second hole is provided adjacent to an outer peripheral line of the substrate provided in the pad region.
6. 6. The display device of claim 1, wherein the plurality of link lines comprises at least one gate link line or at least one data link line, and Each of the plurality of link lines is electrically connected to the pad electrode through a conductive layer disposed in the pad region.
7. 7. The display device according to claim 5, further comprising: a second inorganic insulating layer disposed on the plurality of link lines, Wherein the plurality of link lines includes a gate link line disposed in the second hole, and The second hole is disposed in the second inorganic insulating layer.
8. 8. The display device according to claim 6, comprising: and a conductive layer configured to electrically connect the gate link line with the pad electrode, wherein the conductive layer is disposed under the first inorganic insulating layer.
9. 9. The display device according to claim 6, comprising: A gate insulating layer disposed over the first inorganic insulating layer and under the gate link line, Wherein a top surface and a side surface of the gate link line disposed in the hole are adjacent to the organic insulating layer, and A bottom surface of the gate link line disposed in the hole is adjacent to the gate insulating layer.
10. 10. The display device according to claim 1, wherein the plurality of link lines are provided on the organic insulating layer, and the hole is provided below the plurality of link lines.
11. 11. The display device according to claim 1, comprising: a conductive layer configured to electrically connect the plurality of link lines with the pad electrode, Wherein the conductive layer is disposed over the first inorganic insulating layer.
12. 12. A display device, comprising: A substrate having a display region and a non-display region disposed adjacent to the display region; A plurality of subpixels in the display area; a first insulating layer on the substrate; a pad region in the non-display region; A plurality of pad electrodes disposed in the pad region; A link region between the display region and the pad region; a plurality of insulating layers positioned on the first insulating layer in the link region; a plurality of conductive lines disposed in the link region and positioned on the plurality of insulating layers, the conductive lines configured to electrically connect the plurality of pad electrodes to the plurality of sub-pixels, respectively; a second insulating layer covering the plurality of conductive lines in the link region; a hole disposed in the plurality of insulating layers and the second insulating layer, the hole positioned to overlap at least one of the conductive lines, and An organic insulating layer filling the hole and surrounding the at least one conductive line.
13. 13. The display device of claim 12, wherein the organic insulating layer filling the hole is in direct physical contact with a top and two sides of the at least one conductive line.
14. 14. The display device of claim 13, wherein the organic insulating layer filling the hole is in direct physical contact with a bottom of the at least one conductive line.
15. 15. The display device according to claim 12, further comprising: And a flexible film disposed on and electrically connected to the plurality of pad electrodes, the flexible film being positioned to overlap the holes in the plurality of insulating layers and the second insulating layer and the organic insulating layer filling the holes.
16. 16. A method of manufacturing a display device, comprising: forming a display region on a substrate, the display region including a pixel layer having a plurality of light emitting pixels therein; Forming a non-display region adjacent to the display region on the substrate, the non-display region including a link region and a pad region; depositing a first insulating layer on the substrate, the first insulating layer being disposed into the display region and the non-display region; depositing a plurality of insulating layers on the first insulating layer, the plurality of insulating layers being disposed in the link region; forming a conductive pad in the pad region; Depositing conductive link lines on the plurality of insulating layers, the conductive link lines extending from the pad region, through the link region and into the display region; depositing a second insulating layer covering the conductive link line in the pad region and the link region; Forming a hole extending through the second insulating layer and the plurality of insulating layers in the link region, the conductive link line not being removed and being exposed within the hole after the hole is formed, and The hole is filled with an organic insulating layer surrounding at least three sides of the conductive link line within the hole.
17. 17. The method of claim 16, wherein forming a hole in the link region comprises: the second insulating layer and the plurality of insulating layers are removed using an etching process that does not remove the conductive link line or the first insulating layer.
18. 18. The method of claim 17, wherein the conductive link line is suspended in the hole after the hole is formed and before the organic insulating layer fills the hole.
19. 19. The method of claim 16, wherein the organic insulating layer is in direct contact with at least three surfaces of the conductive link line when the conductive link line is surrounded by the organic insulating layer, and at least one insulating layer of the plurality of insulating layers is in contact with the conductive link line.
20. 20. The method of claim 16, wherein the substrate is configured as a transparent conductive oxide layer or an oxide semiconductor layer.

Description

Display device and method of manufacturing the same Cross Reference to Related Applications The present application claims priority from korean patent application No. 10-2021-0179516 filed in the korean intellectual property office on day 12 and 15 of 2021, the disclosure of which is incorporated herein by reference. Technical Field The present disclosure relates to a display device, and more particularly, to a display device that does not use a plastic substrate to improve moisture transmission characteristics, reduce parasitic capacitance, and minimize occurrence and propagation of cracks in a pad region. Background Display devices for monitors of computers, televisions, mobile phones, etc. include Organic Light Emitting Display (OLED) devices configured to autonomously emit light, and Liquid Crystal Display (LCD) devices requiring a separate light source. Display devices are diversified in application range from monitors of computers and televisions to monitors of personal mobile devices, and research is being conducted on display devices having a wide display area and having reduced volume and weight. In addition, recently, a flexible display device, which is manufactured by forming display elements, lines, etc. on a substrate made of a flexible plastic material having flexibility, and thus can display images even when folded or curled, has attracted attention as a next-generation display device. Disclosure of Invention One technical advantage provided by the present disclosure is that a display device using a substrate of a transparent conductive oxide layer and an oxide semiconductor layer instead of a plastic substrate can be provided. It is an object of the present disclosure to provide a display device that reduces and in some cases may eliminate or minimize the permeation of moisture and oxygen. Another object to be achieved by the present disclosure is to provide a display device capable of simplifying processing and reducing manufacturing costs by not using a plastic substrate. It is yet another object of the present disclosure to provide a display device capable of reducing the occurrence and propagation of cracks in the peripheral line region of a flexible film. It is still another object of the present disclosure to provide a display device in which the link line is made of the same material as the anode so as to secure the margin of the hole provided in the inorganic insulating layer. The objects of the present disclosure are not limited to the above-mentioned objects, but other objects not mentioned above will be clearly understood by those skilled in the art from the following description. According to one aspect of the present disclosure, a display device includes a substrate configured as one of a transparent conductive oxide layer and an oxide semiconductor layer, and includes a display region and a non-display region. The display region includes a plurality of sub-pixels, an insulating layer disposed on a substrate, an active layer disposed on the insulating layer and having a channel region, a plurality of thin film transistors including a gate electrode, a source electrode, and a drain electrode, and a plurality of light emitting elements disposed on the insulating layer and disposed in the plurality of sub-pixels, wherein the substrate includes a plurality of holes overlapping at least a portion of the active layer. Accordingly, the substrate may be made of a transparent conductive oxide layer or an oxide semiconductor layer, and a plurality of holes may be provided in the substrate. Accordingly, a display device having improved flexibility and reduced parasitic capacitance may be provided. Other details of the exemplary embodiments are included in the detailed description and the accompanying drawings. According to the present disclosure, moisture permeation can be easily controlled by using a transparent conductive oxide layer or an oxide semiconductor layer as a substrate of a display device. According to the present disclosure, flexibility of a display device may be improved by using a thin film transparent conductive oxide layer or a thin film oxide semiconductor layer as a substrate of the display device. According to the present disclosure, a thin film transparent conductive oxide layer or a thin film oxide semiconductor layer is used as a substrate of a display device. Accordingly, stress occurring when the display device is bent or rolled up can be reduced, thereby reducing cracks in the display device. According to the present disclosure, the structure of the display device can be simplified and the manufacturing cost can be reduced by using the transparent conductive oxide layer or the oxide semiconductor layer as a substrate of the display device. According to the present disclosure, static electricity generated on a substrate can be reduced and display quality can be improved by using a transparent conductive oxide layer or an oxide semiconductor layer as the substrate