CN-116364618-B - Wafer box conveying device

CN116364618BCN 116364618 BCN116364618 BCN 116364618BCN-116364618-B

Abstract

The invention discloses a wafer box conveying device which comprises a carrying area, a transfer area, a guide plate area and a wafer detection module, wherein the carrying area, the transfer area, the guide plate area and the wafer detection module are arranged in a U shape, the wafer detection module comprises an optical detection unit and a wave band detection unit, the optical detection unit comprises at least one group of receiving integrated components and light source integrated components, each group of receiving integrated components and light source integrated components are respectively positioned at the bottom of a wafer box bearing position and at two sides corresponding to a hollowed-out position, the receiving integrated components are integrally moved up and down and/or rotated to receive and convert transmission light, and the light source integrated components are integrally moved up and down and/or rotated to integrate the light transmitted by the receiving integrated components.

Inventors

DENG XINFU
KONG HAO
LU ZHENGKAI
CHEN XINLAI
YANG FU

Assignees

上海至纯洁净系统科技股份有限公司
合肥至微半导体有限公司

Dates

Publication Date: 20260505
Application Date: 20230210

Claims (10)

1. The wafer box conveying device is characterized by comprising a carrying area (1), a transferring area (2), a guide piece area (3) and a wafer detection module, wherein the carrying area (1), the transferring area (2), the guide piece area (3) and the wafer detection module are arranged in a U shape; The standby load area (1) is provided with a loading transfer platform (11), one end of the loading transfer platform (11) is connected with a wafer box loading window, a plurality of wafer box bearing positions (12) with hollowed-out middle parts are arranged, transfer channels are formed in two sides of the plurality of wafer box bearing positions (12), and the transfer channels are communicated with the hollowed-out positions and penetrate through the loading transfer platform (11) for bearing and transferring single or double wafer boxes, so that temporary loads of the wafer boxes are provided; The transfer area (2) is provided with a connecting platform (21) which is connected with the other end of the loading transfer platform (11), the connecting platform (21) slides in the loading area (1) and the guide piece area (3) to transfer the wafer box on the loading transfer platform (11) to the guide piece area (3); the wafer detection module comprises an optical detection unit and a band detection unit, The optical detection unit comprises at least one group of receiving integrated components (4) and light source integrated components (5), wherein each group of receiving integrated components (4) and light source integrated components (5) are respectively positioned at the bottom of a wafer box bearing position (12) and at two sides corresponding to a hollowed-out position, the receiving integrated components (4) are integrally moved up and down and/or rotated and swung so as to receive and convert the transmitted light, and the light source integrated components (5) are integrally moved up and down and/or rotated and swung so as to integrate the light transmitted by the receiving integrated components (4) and optically scan the wafers in the wafer box through the hollowed-out positions, so that the real-time state of the wafers is reflected; the wave band detection unit is arranged at least in one direction of an X axis, a Y axis and a Z axis of wafer transmission, and transmits millimeter waves to the wafer for spectrum scanning, and the space position of the wafer is fed back by the transmission and the reception of the millimeter waves.
2. The wafer cassette transport apparatus of claim 1, wherein at least one group of the receiving integrated component (4) and the light source integrated component (5) is disposed at a wafer cassette loading position (12) of the loading transfer platform (11) near the engagement platform (21), the band detection unit is disposed at an intermediate position of the loading transfer platform, and a band is radiated to all wafer cassette loading positions (12).
3. The wafer cassette transport apparatus of claim 2, wherein the optical detection unit further comprises a light source emitting end parallel to the loading transfer stage (11) and disposed below the loading transfer stage (11).
4. The wafer cassette transport device according to claim 3, wherein the wafer cassette positioning blocks (13) are disposed at four corners of the hollowed-out position of the wafer cassette loading position (12), a detection sensor is disposed on the wafer cassette positioning blocks (13), and when the detection sensor detects that the wafer cassette is placed on the positioning pins of the wafer cassette positioning blocks (13), the light source emitting end is started to emit light to the wafer.
5. The wafer cassette transport apparatus of claim 3, wherein the band detection unit includes a band transmitting end and a band receiving end, which are positioned parallel to the loading transfer platform (11) and at a height intermediate the wafer cassettes.
6. The wafer cassette transport apparatus of claim 1, wherein the guide zone (3) is parallel to the load zone (1) for guiding wafers out of the wafer cassette and transferring the guided wafers to the cleaning zone for cleaning by the robot, wherein the optical detection unit is configured to monitor the wafer guide zone (3) process and the robot clamping action of the wafer in the Z-axis direction of the wafer guide.
7. Wafer cassette transport device according to claim 1, characterized in that the loading zone (1) is provided with a first long axis linear robot (14) for transporting the wafer cassette in the direction of the loading transfer platform (11) to the respective wafer cassette loading station (12), and the guide zone (3) is provided with a second long axis linear robot (31) for receiving the transport of the wafer cassette in the guide zone (3) and the transfer zone (2).
8. The wafer cassette transport apparatus according to claim 7, wherein the first long axis linear robot (14) and the second long axis linear robot (31) each include a tray that can pass through a hollowed-out position, a support arm that can pass through a transfer passage, and a movement device integrated with multiple actions, by which the movement device performs: the tray receives the wafer cassette to the corresponding wafer cassette loading position (12) in a horizontal linear motion; lifting movement, the tray is lifted or lowered to lift the wafer cassette off or load the wafer cassette into the wafer cassette loading position (12); and (3) rotating, namely, carrying the wafer box by the tray to rotate 180 degrees, and changing the direction of the wafer box.
9. The wafer cassette transport apparatus as set forth in claim 8, wherein the engagement platform (21) is provided with a wafer cassette loading position (12) with a hollow center, and the wafer cassette loading position (12) is provided with a transfer channel toward the loading transfer platform (11), and the first long axis linear robot (14) and the second long axis linear robot (31) both pass through the transfer channel to receive the wafer cassette.
10. The wafer cassette transport apparatus of claim 1, wherein at least one set of the receiving integrated component (4) and the light source integrated component (5) is disposed at a bottom of the engagement platform (21) corresponding to a wafer cassette loading location (12) of the engagement platform (21).

Description

Wafer box conveying device Technical Field The invention relates to the field of wafer conveying, in particular to a wafer box conveying device. Background The wet tank cleaning equipment for semiconductor wafers transfers wafers or cassettes during the entire process through wafer transfer, and is particularly important for achieving efficient wafer transfer per unit time. Taking a groove type cleaning device as an example, the wafer mechanical moving device is a wafer transfer system device, and the device formed by the wafer transmission and guide sheet module is used for actually carrying out wafer transmission, so that the wafer transmission with high efficiency is required to be effectively achieved. In the process of wafer transmission, the wafer in the wafer box needs to be kept to ensure the coordination of the action of the transmission process, the whole process is controllable, and various external damage caused by shaking of the wafer box needs to be avoided, so that the wafer box and the wafer metering and the position detection of the wafer box in the transmission process need to be carried out. Disclosure of Invention In order to detect wafers in the process of transmission, the invention provides a wafer box conveying device. The wafer box conveying device provided by the invention adopts the following technical scheme: the wafer box conveying device comprises a loading area, a transfer area, a guide area and a wafer detection module which are arranged in a U shape; the standby load area is provided with a loading transfer platform, one end of the loading transfer platform is connected with a wafer box loading window, a plurality of wafer box bearing positions with hollowed-out middle parts are arranged, transfer channels are formed in two sides of the plurality of wafer box bearing positions, the transfer channels are communicated with the hollowed-out positions and penetrate through the loading transfer platform, and the transfer channels are used for bearing and transferring single-loading or double-loading wafer boxes and provide temporary loads of the wafer boxes; the transfer area is provided with a connection platform which is connected with the other end of the loading transfer platform, and the connection platform slides in the loading area and the guide piece area to transfer the wafer box on the loading transfer platform to the guide piece area; the wafer detection module comprises an optical detection unit and a band detection unit, The optical detection unit comprises at least one group of receiving integrated components and light source integrated components, wherein each group of receiving integrated components and light source integrated components are respectively positioned at the bottom of a bearing position of the wafer box and at two sides corresponding to the hollowed-out position, the receiving integrated components are integrally moved up and down and/or rotated and swung so as to receive and convert the transmitted light, and the light source integrated components are integrally moved up and down and/or rotated and swung so as to integrate the light transmitted by the receiving integrated components, and the optical scanning is carried out on the wafer in the wafer box through the hollowed-out position, so that the real-time state of the wafer is reflected; the wave band detection unit is arranged at least in one direction of an X axis, a Y axis and a Z axis of wafer transmission, and transmits millimeter waves to the wafer for spectrum scanning, and the space position of the wafer is fed back by the transmission and the reception of the millimeter waves. Optionally, at least one group of the receiving integrated component and the light source integrated component are arranged at the wafer box bearing position of the loading transfer platform, which is close to the connecting platform, the band detection unit is arranged at the middle position of the loading transfer platform, and the band is radiated to all the wafer box bearing positions. Optionally, the optical detection unit further includes a light source emitting end parallel to the loading transfer platform and disposed below the loading transfer platform. Optionally, the four corners that the wafer box bears position fretwork position is provided with the wafer box locating piece, be provided with the detection sensor on the wafer box locating piece, when the detection sensor detects that the wafer box is placed on the locating pin of wafer box locating piece, the light source transmitting terminal starts, to the wafer emission light. Optionally, the band detection unit includes a band transmitting end and a band receiving end, and the positions of the band transmitting end and the band receiving end are parallel to the loading transfer platform, and the height of the band detecting unit is in the middle position of the wafer box. Optionally, the guiding area is parallel to the loading area and is used for g